| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/28/2007 | CN1302545C Printed circuit boards with plated resistors and its manufacturing method |
| 02/28/2007 | CN1302542C Module part |
| 02/28/2007 | CN1302531C Belt for carrying automatic welding |
| 02/28/2007 | CN1302497C Raw chip laminating apparatus and method, and laminated ceramic electronic element making method |
| 02/28/2007 | CN1302488C Resistance material, resistance produced by the same, method for producing resistance and solution for resistance material aggradation |
| 02/28/2007 | CN1302279C System and method for analysing surface condition of printed circuit board using red, green and blue colours |
| 02/28/2007 | CN1302155C Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/28/2007 | CN1301937C Method for metallizing titanate-based ceramics |
| 02/27/2007 | US7185297 Method of diagnosing circuit layout and computer system for performing the same |
| 02/27/2007 | US7184117 Display panel having noise shielding structure |
| 02/27/2007 | US7183653 Via including multiple electrical paths |
| 02/27/2007 | US7183650 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 02/27/2007 | US7183647 Wiring substrate and electronic parts packaging structure |
| 02/27/2007 | US7183646 Semiconductor chip carrier affording a high-density external interface |
| 02/27/2007 | US7183640 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
| 02/27/2007 | US7183630 Lead frame with plated end leads |
| 02/27/2007 | US7183497 Multilayer wiring board |
| 02/27/2007 | US7183496 Soldered heat sink anchor and method of use |
| 02/27/2007 | US7183196 Multilayer interconnection board and production method thereof |
| 02/27/2007 | US7183194 Method of forming socket contacts |
| 02/27/2007 | US7182889 Low cost roofing shingles manufactured from conductive loaded resin-based materials |
| 02/27/2007 | US7182610 Electrical connector and circuit board securing structure |
| 02/27/2007 | US7182241 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/27/2007 | US7181839 Method for producing a circuit board |
| 02/27/2007 | US7181838 Method of fabricating identifiable flexible printed circuit board |
| 02/27/2007 | US7181837 Plating buss and a method of use thereof |
| 02/27/2007 | US7181836 Method for making an electrode structure |
| 02/27/2007 | US7181835 Universal clamping mechanism |
| 02/27/2007 | US7181834 Method of fabricating an RF substrate with selected electrical properties |
| 02/24/2007 | CA2556303A1 Printed circuit board for real-time clock ic and manufacturing method for printed circuit board for real-time clock ic |
| 02/22/2007 | WO2007021750A2 Cable management stays |
| 02/22/2007 | WO2007021687A1 Method of laminating adherend |
| 02/22/2007 | WO2007021006A1 Lead-free low-temperature solder |
| 02/22/2007 | WO2007020963A1 Nanoimprint method and apparatus |
| 02/22/2007 | WO2007020962A1 Nanoimprint method and apparatus |
| 02/22/2007 | WO2007020890A1 Plotting device, exposure device, and plotting method |
| 02/22/2007 | WO2007020809A1 Work transfer apparatus, image forming apparatus provided with such work transfer apparatus, and work transfer method |
| 02/22/2007 | WO2007020793A1 Insulating curable composition , cured product thereof, and printed wiring board using same |
| 02/22/2007 | WO2007020764A1 Laminate to be used in flexible printed wiring boards and wiring boards made by using the same |
| 02/22/2007 | WO2007020726A1 Laminate and process for producing the same |
| 02/22/2007 | WO2007019732A1 Surface mount component having magnetic layer thereon and method of forming same |
| 02/22/2007 | WO2006135261A3 Nansoscale patterning and fabrication methods |
| 02/22/2007 | WO2006133380A3 Manufacturing of electronic devices using conductive polymer |
| 02/22/2007 | US20070044062 Method for checking return path of printed board and cad apparatus for designing patterns of printed board |
| 02/22/2007 | US20070042215 Aluminum/ceramic bonding substrate and method for producing same |
| 02/22/2007 | US20070042167 Novel polymide film and use thereof |
| 02/22/2007 | US20070041166 High brieghtness LED lamp |
| 02/22/2007 | US20070041163 Method for producing an electronic component or module and a corresponding component or module |
| 02/22/2007 | US20070041123 Method for making noble metal conductive leads for suspension assemblies |
| 02/22/2007 | US20070040857 Method and Device for Producing a System Having a Component Applied to a Predetermined Location of A Surface of a Substrate |
| 02/22/2007 | US20070040270 Electronic device and carrier substrate |
| 02/22/2007 | US20070040245 Anisotropic conductive sheet, manufacturing method thereof, and product using the same |
| 02/22/2007 | US20070039921 Etching solutions and processes for manufacturing flexible wiring boards |
| 02/22/2007 | US20070039832 Electrofluidic textiles and cleaning implements using such electrofluidic textiles |
| 02/22/2007 | US20070039753 Built-up printed circuit board with stack type via-holes |
| 02/22/2007 | US20070039694 Method for producing rfid labels |
| 02/22/2007 | US20070039171 Method of Fabricating a High-Layer-Count Backplane |
| 02/22/2007 | DE19604319B4 Chipkarte Smart card |
| 02/22/2007 | DE112005000438T5 Eine Zwischenverbindungsstruktur und ein Verfahren zum Verbinden von vergrabenen Signalleitungen mit elektrischen Vorrichtungen An interconnect structure and a method of connecting signal lines with the buried electrical devices |
| 02/22/2007 | DE10304634B4 Reparierbares flexibles Flachkabel und Verfahren zu dessen Reparatur Repairable flexible flat cable and process for its repair |
| 02/22/2007 | DE10236200B4 Verkupferungsverfahren zum elektrolytischen Füllen von Sacklochbohrungen For electrolytic copper plating filling blind holes |
| 02/22/2007 | DE102006037070A1 Circuit board fabrication involves providing a conductive paste with metallic nanoparticles |
| 02/22/2007 | DE102006035114A1 Semiconductor package, useful for surface mounting, comprises substrate, semiconductor chips and transparent resin layer |
| 02/22/2007 | DE102006027653A1 Parallelchip-Eingebettete gedruckte Schaltungsplatine und Herstellungsverfahren dafür Parallel chip-embedded printed circuit board and manufacturing method thereof |
| 02/22/2007 | DE102005038752A1 Method for mounting semiconductor chips on substrate, |
| 02/22/2007 | DE102005034083A1 Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil von Kunststoff A method of applying electrical conductor patterns on a target component of plastic |
| 02/21/2007 | EP1755367A2 Surface mounting component and mounted structure of surface mounting component |
| 02/21/2007 | EP1755366A2 Holder for a small-sized electronic part |
| 02/21/2007 | EP1755365A1 Positive photosensitive insulating resin composition, cured product thereof, and electronic component |
| 02/21/2007 | EP1755161A2 Interconnect module with reduced power distribution impedance |
| 02/21/2007 | EP1755023A1 Touch panel and electronic device display window protection panel using the same |
| 02/21/2007 | EP1754986A1 Optical communication device and optical communication device manufacturing method |
| 02/21/2007 | EP1754762A1 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 02/21/2007 | EP1754400A1 Electronic component |
| 02/21/2007 | EP1754399A1 Method for producing transverse connections in printed circuit board sets |
| 02/21/2007 | EP1754398A2 Printed wiring board with conductive constraining core including resin filled channels |
| 02/21/2007 | EP1753728A1 Phenylnaphthylimidazoles for use on copper surfaces during soldering |
| 02/21/2007 | EP1501756B1 Method of manufacturing an electronic device in a cavity with a cover |
| 02/21/2007 | EP1360067B1 Lightweight circuit board with conductive constraining cores |
| 02/21/2007 | EP1231016B1 Soldering flux, solder paste and method of soldering |
| 02/21/2007 | CN2872797Y Cleaner of circuit board |
| 02/21/2007 | CN2871457Y Automatic retracter of inclined printing circuit board |
| 02/21/2007 | CN2871455Y Structure improvement of framed thin-plate inserted retracter |
| 02/21/2007 | CN1918954A Method and apparatus for simultaneous inspection and cleaning of a stencil |
| 02/21/2007 | CN1918953A Methods of forming tracks and track arrangements |
| 02/21/2007 | CN1918952A Preferential ground and via exit structures for printed circuit boards |
| 02/21/2007 | CN1918951A Flexible circuit board assembly |
| 02/21/2007 | CN1918757A Soldering nest for a bus bar |
| 02/21/2007 | CN1918749A A system for detachably connecting a large number of signal lines of two components |
| 02/21/2007 | CN1918747A 电路板安装支架 Circuit board mounting bracket |
| 02/21/2007 | CN1918587A Method and device for continuously producing electronic film components, and an electronic film component |
| 02/21/2007 | CN1918583A Electronic device |
| 02/21/2007 | CN1917994A Process for producing synthetic resin film having molecular orientation controlled in md direction |
| 02/21/2007 | CN1917745A Soldering apparatus and soldering method |
| 02/21/2007 | CN1917744A Method for assembling and positioning extended slot seat for interface card |
| 02/21/2007 | CN1917743A Method of forming metal plate pattern and circuit board |
| 02/21/2007 | CN1917740A Power amplification circuit board, and grounding method |
| 02/21/2007 | CN1917738A Build-up multilayer printed circuit board and its manufacture method |
| 02/21/2007 | CN1917282A Built-in antenna module of wireless communication terminal |
| 02/21/2007 | CN1301636C Method for manufacturing printed wiring board and multi-printed wiring board |