| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/06/2007 | US7185429 Manufacture method of a flexible multilayer wiring board |
| 03/06/2007 | US7185428 Method of making a circuitized substrate |
| 03/06/2007 | US7185427 Method for making electrical connections to an element on printed circuit board |
| 03/06/2007 | US7185426 Method of manufacturing a semiconductor package |
| 03/06/2007 | US7185425 Method for connecting printed circuit boards |
| 03/06/2007 | US7185424 Electronic component mounting method and apparatus |
| 03/06/2007 | US7185423 Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation |
| 03/06/2007 | US7185422 Part mounting apparatus and part mounting method |
| 03/06/2007 | US7185421 Method and apparatus for manufacturing multilayer printed wiring board |
| 03/01/2007 | WO2007025252A1 Electronic module and method for sealing an electronic module |
| 03/01/2007 | WO2007023944A1 Composite resin molded article, laminate, multi-layer circuit board, and electronic device |
| 03/01/2007 | WO2007023863A1 Production method and transport method for very thin copper foil laminated film |
| 03/01/2007 | WO2007023834A1 Adhesive composition |
| 03/01/2007 | WO2007023825A1 Electronic component mounting method |
| 03/01/2007 | WO2007023742A1 Multilayered circuit board and electronic equipment |
| 03/01/2007 | WO2007023617A1 Printed wiring board |
| 03/01/2007 | WO2007023604A1 Reflow furnace |
| 03/01/2007 | WO2007023531A1 Liquid-like body filling device and liquid-like body filling method |
| 03/01/2007 | WO2007023284A1 Reducing joint embrittlement in lead-free soldering processes |
| 03/01/2007 | WO2005104226A8 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts |
| 03/01/2007 | WO2005082983A9 Etched polycarbonate films |
| 03/01/2007 | WO2005081657A3 Laser ablation resistant copper foil |
| 03/01/2007 | WO2005036644A3 Electronic device and carrier substrate |
| 03/01/2007 | US20070050158 Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device |
| 03/01/2007 | US20070049869 Warming apparatus with heater produced by pcb |
| 03/01/2007 | US20070049147 Plural layer woven electronic textile, article and method |
| 03/01/2007 | US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology |
| 03/01/2007 | US20070046283 Solder material test apparatus, and method of controlling the same |
| 03/01/2007 | US20070045895 Process for producing synthetic resin film having molecular orientation controlled in MD direction |
| 03/01/2007 | US20070045874 Lithographic Type Microelectronic Spring Structures with Improved Contours |
| 03/01/2007 | US20070045842 Lead-containing solder bumps |
| 03/01/2007 | US20070045839 Lead-containing solder paste |
| 03/01/2007 | US20070045838 Lead-containing anodes |
| 03/01/2007 | US20070045813 Printed circuit board assembly with strain-alleviating structures |
| 03/01/2007 | US20070045808 Test carrier for semiconductor components having conductors defined by grooves |
| 03/01/2007 | US20070045296 Electrode for machines for electromagnetic induction welding of the layers forming a multi-layer printed circuit |
| 03/01/2007 | US20070045229 System and method for the manufacture of surgical blades |
| 03/01/2007 | US20070045122 Building up a three-dimensional structure from a number of adhered layers by depositing a first material onto a substrate; selectively etching to a desired depth; depositing a second material at least into the voids created; at least one of the deposition processes is an electrodeposition process |
| 03/01/2007 | US20070044901 Friction Heating for Joining Dissimilar Materials |
| 03/01/2007 | US20070044589 Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
| 03/01/2007 | US20070044294 Apparatus for manufacturing a wiring board and method for manufacturin a wiring board |
| 03/01/2007 | DE19749184B4 Lötvorrichtung Soldering device |
| 03/01/2007 | DE10335182B4 Anordnung zur Verbesserung der Modulzuverlässigkeit Arrangement for improving the reliability module |
| 03/01/2007 | DE102005060044A1 LED-Lampe mit hoher Lichtleistung LED lamp with high brightness |
| 03/01/2007 | DE102005040126A1 Überzugsmasse Coating composition |
| 03/01/2007 | DE102004054223B4 Mehrlagige flexible Leiterplatte mit sich gegenüberliegenden flexiblen Leitstrukturen sowie Verfahren zu deren Herstellung Multilayer flexible printed circuit board having opposing flexible conductive structures and processes for their preparation |
| 02/28/2007 | EP1758438A2 Method of manufacturing a wiring board |
| 02/28/2007 | EP1758437A2 Laminated structure including a resin layer containing a glass-cloth and method for manufacturing the same |
| 02/28/2007 | EP1758436A1 Electronic package and circuit board having segmented contact pads |
| 02/28/2007 | EP1758179A1 Fixing device and fixing structure for light emitting diode |
| 02/28/2007 | EP1758166A2 Interposer and method for producing the same and electronic device |
| 02/28/2007 | EP1758151A2 Capacitor and manufacturing method thereof |
| 02/28/2007 | EP1758009A1 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
| 02/28/2007 | EP1757176A1 Screen printing apparatus and screen printing method |
| 02/28/2007 | EP1757175A1 Method and apparatus for accurately applying structures to a substrate |
| 02/28/2007 | EP1756336A1 Device and method for electrolytically treating flat work-pieces |
| 02/28/2007 | EP1755820A1 Composition of a solder, and method of manufacturing a solder connection |
| 02/28/2007 | EP1546275B1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 02/28/2007 | EP1541002B1 Apparatus and method for inspecting cream solder printed on a substrate |
| 02/28/2007 | EP1392467A4 Method and apparatus for improving laser hole resolution |
| 02/28/2007 | EP1344434B1 Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor |
| 02/28/2007 | EP1311616B1 Polyarylether-polyetherimide compositions |
| 02/28/2007 | EP1099361B1 Improved method for forming conductive traces and printed circuits made thereby |
| 02/28/2007 | EP1048680B1 Modified polyimide resin and thermosetting resin composition containing the same |
| 02/28/2007 | EP1010228B1 A transient voltage protection device and method of making same |
| 02/28/2007 | CN2874983Y Cleaner for circuit board surface |
| 02/28/2007 | CN1922947A Copper foil having blackened surface or layer |
| 02/28/2007 | CN1922943A Multilayer stacked wiring board |
| 02/28/2007 | CN1922942A Electronic component mounting method, and circuit board and circuit board unit used therein |
| 02/28/2007 | CN1922941A Screen printing apparatus and screen printing method |
| 02/28/2007 | CN1922940A Transmission line with a transforming impedance and solder lands |
| 02/28/2007 | CN1922939A Electronic module and method for the production thereof |
| 02/28/2007 | CN1922938A 印刷电路板 A printed circuit board |
| 02/28/2007 | CN1922921A Hearing aid using printed circuit board |
| 02/28/2007 | CN1922776A Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor |
| 02/28/2007 | CN1922767A Interconnect structure and method for connecting buried signal lines to electrical devices |
| 02/28/2007 | CN1922756A Transmission line having a transforming impedance |
| 02/28/2007 | CN1922661A Etched dielectric film in hard disk drives |
| 02/28/2007 | CN1922546A Bilayer laminated film for bump formation and method for forming bump |
| 02/28/2007 | CN1922340A Method of electroplating on aluminum |
| 02/28/2007 | CN1922017A Methods and apparatus for changing web material in a stencil printer |
| 02/28/2007 | CN1921977A Soldering method |
| 02/28/2007 | CN1921737A Method for printed circuit board wiring and printed circuit board |
| 02/28/2007 | CN1921736A Method and system for creating B side and T side detailed list of veneer |
| 02/28/2007 | CN1921735A Production method of suspension board with circuit |
| 02/28/2007 | CN1921734A Surface treated PI membrane and its application |
| 02/28/2007 | CN1921733A Printed circuit board for mounting a quad flat package ic |
| 02/28/2007 | CN1921732A Laminated product in structure including glass-cloth contained resin layer and method for manufacturing the same |
| 02/28/2007 | CN1921730A Hinge board and method for producing the same |
| 02/28/2007 | CN1921107A Image sensor module, method of manufacturing the same, and camera module using the same |
| 02/28/2007 | CN1921079A Method of manufacturing a wiring board |
| 02/28/2007 | CN1921067A Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate |
| 02/28/2007 | CN1920868A 信息处理装置及信息处理方法 The information processing apparatus and information processing method |
| 02/28/2007 | CN1920587A Multilayer wiring substrate and BVH broken wire detection method |
| 02/28/2007 | CN1920574A Solder material test apparatus, and method of controlling the same |
| 02/28/2007 | CN1920528A Infrared gas analyzer |
| 02/28/2007 | CN1920098A Dissolved tin containing divalent copper compound and tin alloy solution |
| 02/28/2007 | CN1920097A Wet method pattern technology of chrome-nickel alloy thin film |
| 02/28/2007 | CN1302694C Cooled power switching device |
| 02/28/2007 | CN1302693C Combined printed circuit board with superposed through holes and producing method thereof |