| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/11/2007 | WO2006118971A3 Generic patterned conductor for customizable electronic devices |
| 01/11/2007 | WO2006007166A3 Device and method of manufacture of an interconnection structure for printed circuit boards |
| 01/11/2007 | WO2005018293A3 Circuit board design |
| 01/11/2007 | US20070010636 Latent hardener |
| 01/11/2007 | US20070010086 Circuit board with a through hole wire and manufacturing method thereof |
| 01/11/2007 | US20070010038 Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment |
| 01/11/2007 | US20070009710 Dimensional stability, heat resistance, chemical resistance (especially alkali resistance), adhesion; for use in prited boards; applyling solution of heat-resistant organic solvent-soluble aromatic polyimide and/or aromatic polyamide-imide to to a metal foil, winding, heat-treating the predried laminate |
| 01/11/2007 | US20070008709 Board Supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method |
| 01/11/2007 | US20070007640 Surface mount package |
| 01/11/2007 | US20070007034 Connector-to-pad printed circuit board translator and method of fabrication |
| 01/11/2007 | US20070006455 Methods for forming high density data storage devices with read/write probes with hollow or reinforced tips |
| 01/11/2007 | US20070006454 Component mounting apparatus and component mounting method |
| 01/11/2007 | US20070006453 Component mounting apparatus and component mounting method |
| 01/11/2007 | US20070006452 Method of making a circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof |
| 01/11/2007 | US20070006434 Method for manufacturing a piezoelectric vibration device |
| 01/11/2007 | DE10220982B4 Sensor für schwach magnetische Felder unter Verwendung der Herstellungstechnik für gedruckte Leiterplatten und Verfahren zum Herstellen eines solchen Sensors Sensor for weak magnetic fields using the manufacturing technology for printed circuit boards and methods for manufacturing of such a sensor |
| 01/11/2007 | DE102005031431A1 Anschlussstift-Array Pin-array |
| 01/11/2007 | DE102005031377A1 Plastics module with surface-applied metal layer, has layer of thermosetting plastic or highly thermally stable thermoplastic applied to module basic body |
| 01/11/2007 | DE102005027276B3 Production process for a stack of at least two base materials comprising printed circuit boards photostructures the boards applies solder stacks and melts with lacquer separating the boards |
| 01/11/2007 | DE102004002075B4 Presse zum Herstellen von Laminaten Press for producing laminates |
| 01/11/2007 | DE10021672B4 Hermetisch verkapselter Sensor und Verfahren zu seiner Herstellung Hermetically encapsulated sensor and method for its preparation |
| 01/10/2007 | EP1742294A2 A method and a device for manufacturing a roll of items |
| 01/10/2007 | EP1742107A1 Photoimageable composition |
| 01/10/2007 | EP1741650A1 Anisotropic conductive film holding tape and mounting method |
| 01/10/2007 | EP1741323A2 Fusion bonded assembly with attached leads |
| 01/10/2007 | EP1741322A1 Method for the production of circuit boards and/or corresponding constructs |
| 01/10/2007 | EP1741134A2 Stacked module systems and methods |
| 01/10/2007 | EP1741006A2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 01/10/2007 | EP1401636B1 Partition plate and method for producing a partition plate for a multi-layer pressed stack |
| 01/10/2007 | EP1387367B1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/10/2007 | EP1360720A4 Process for the manufacture of printed circuit boards with plated resistors |
| 01/10/2007 | EP1262509B1 Imide-benzoxazole polycondensate and process for producing the same |
| 01/10/2007 | EP1127387B1 Non-circular micro-via |
| 01/10/2007 | EP0997060B1 High frequencies printed board assembly with improved signal transmission |
| 01/10/2007 | CN2856993Y Detection clamp |
| 01/10/2007 | CN1894792A Helical microelectronic contact and method for fabricating same |
| 01/10/2007 | CN1894758A Printed circuit embedded capacitors |
| 01/10/2007 | CN1894588A Systems and methods for connecting electrical components |
| 01/10/2007 | CN1894444A Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/10/2007 | CN1894155A Method and system for self-aligning parts in mems |
| 01/10/2007 | CN1894087A Method of producing flexible laminate sheet |
| 01/10/2007 | CN1893868A Apparatus and method for cleaning surfaces |
| 01/10/2007 | CN1893779A Housing of circuit boards |
| 01/10/2007 | CN1893776A Method for manufacturing circuit board with built-in electronic components |
| 01/10/2007 | CN1893775A Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof |
| 01/10/2007 | CN1893774A 回流炉 Reflow oven |
| 01/10/2007 | CN1893773A Reflow oven |
| 01/10/2007 | CN1893772A Circuit substrate |
| 01/10/2007 | CN1893771A Parallel chip embedded printed circuit board and manufacturing method thereof |
| 01/10/2007 | CN1893770A Planar resistance heating element and manufacturing method thereof |
| 01/10/2007 | CN1893768A Electronic equipment and method for mounting electronic component |
| 01/10/2007 | CN1893766A Multilayer printed wiring board |
| 01/10/2007 | CN1893765A Printed wiring board, solder resist resin composition, and method for manufacturing printed wiring board |
| 01/10/2007 | CN1893011A Component pressing device |
| 01/10/2007 | CN1893003A Manufacturing method of wiring board and semiconductor device |
| 01/10/2007 | CN1892934A Embedded thin layer capacitor, layered structure, and fabrication method of the same |
| 01/10/2007 | CN1892203A Printed circuit board optical testing method and optical testing equipment |
| 01/10/2007 | CN1891454A Multi-component ltcc substrate with a core of high dielectric constant ceramic material and processes for the development thereof |
| 01/10/2007 | CN1891453A Resin coated metal foil, metal-clad laminate, printed wiring board using the same, and its manufacturing process |
| 01/10/2007 | CN1294790C Method of manufacturing electronic part and electronic part obtained by the method |
| 01/10/2007 | CN1294789C Manufacture of printed circuits using single layer processing techniques |
| 01/10/2007 | CN1294788C Method of manufacturing multilayer printed wiring board |
| 01/10/2007 | CN1294787C Method for mounting an electronic component |
| 01/10/2007 | CN1294296C Method and electrode for defining and replicating structures in conducting materials |
| 01/10/2007 | CN1294207C Liquid crystalline polymeric compositions |
| 01/10/2007 | CN1294167C Polymerisable composition |
| 01/10/2007 | CN1294004C Composite material |
| 01/09/2007 | US7161810 Stacked chip electronic package having laminate carrier and method of making same |
| 01/09/2007 | US7161373 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 01/09/2007 | US7161371 Module part |
| 01/09/2007 | US7161370 Semiconductor testing device |
| 01/09/2007 | US7161282 Vibrator support structure and manufacturing method for the support structure |
| 01/09/2007 | US7161252 Module component |
| 01/09/2007 | US7161250 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 01/09/2007 | US7161241 Multi-layer board |
| 01/09/2007 | US7161240 Insitu-cooled electrical assemblage |
| 01/09/2007 | US7161238 Structural reinforcement for electronic substrate |
| 01/09/2007 | US7161236 Bow control in an electronic package |
| 01/09/2007 | US7161092 Apparatus and method for protecting an electronic circuit |
| 01/09/2007 | US7161090 Element for electromagnetic shielding and method for manufacturing thereof |
| 01/09/2007 | US7161088 System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design |
| 01/09/2007 | US7160796 Method for manufacturing wiring board and semiconductor device |
| 01/09/2007 | US7160770 Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern |
| 01/09/2007 | US7160672 Forming a thin ceramic protective coating applied at relatively low temperature by selective coating of ceramic on an electrical or magnetic biocompatible implant; metallization; photolithographic polyamide coating; scribing and dissolving away polymerized polyamide and a ceramic mask; batch processing |
| 01/09/2007 | US7160609 Curable composition, varnish, and layered product |
| 01/09/2007 | US7160476 Method of manufacturing an electronic device |
| 01/09/2007 | US7160429 Depositing portion of a layer onto the substrate; forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer |
| 01/09/2007 | US7160428 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 01/09/2007 | US7160406 Sintering a stack of layers containing an unsintered ceramic material and a sintering agent with a forcing layer on the top layer; one of the layers contains an increased proportion of sintering agent relative to an adjacent layer; after sintering the forcing layer is removed |
| 01/09/2007 | US7160154 Grouped element transmission channel link termination assemblies |
| 01/09/2007 | US7160119 Controlled compliance fine pitch electrical interconnect |
| 01/09/2007 | US7160105 Temperature controlled vacuum chuck |
| 01/09/2007 | US7159754 Apparatus and method for corrective soldering |
| 01/09/2007 | US7159752 Continuous mode solder jet apparatus |
| 01/09/2007 | US7159313 Solderless electronics packaging and methods of manufacture |
| 01/09/2007 | US7159312 Connector having improved contacts with fusible members |
| 01/09/2007 | US7159311 Method of making an interposer with contact structures |
| 01/09/2007 | US7159310 Electronic part mounting substrate and method for producing same |
| 01/09/2007 | US7159309 Method of mounting electronic component on substrate without generation of voids in bonding material |
| 01/09/2007 | US7159308 Method of making a circuit board |