| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/15/2007 | DE102005038392A1 Verfahren zum Herstellen von ein Muster bildenden Metallstrukturen auf einem Trägersubstrat A method for producing a pattern-forming of metal structures on a carrier substrate |
| 03/15/2007 | CA2621505A1 3-dimensional multi-layered modular computer architecture |
| 03/14/2007 | EP1763297A1 Printed circuit board |
| 03/14/2007 | EP1763296A2 Method of soldering an electronic part on printed circuit board |
| 03/14/2007 | EP1763295A2 Electronic component embedded board and its manufacturing method |
| 03/14/2007 | EP1762641A2 Metal duplex and method |
| 03/14/2007 | EP1762329A1 Soldering flux, soldering paste and method of soldering |
| 03/14/2007 | EP1762128A1 Method for producing printed circuit board structures comprising via holes, electronic device unit, and use of a flexible strip conductor film in this device unit |
| 03/14/2007 | EP1761951A2 Lead solder indicator and method |
| 03/14/2007 | EP1761823A1 Method of forming plated product using negative photoresist composition and photosensitive composition used therein |
| 03/14/2007 | EP1761659A1 Electrolytically recoverable etching solution |
| 03/14/2007 | EP1761396A1 Printing of organometallic compounds to form conductive traces |
| 03/14/2007 | EP1601821A4 Electroplating pcb components |
| 03/14/2007 | EP1218113B1 Nanostructure coatings |
| 03/14/2007 | EP1163552B2 Method of forming a masking pattern on a surface |
| 03/14/2007 | EP0959648B1 Printed wiring board and manufacturing method therefor |
| 03/14/2007 | EP0831981B1 Epoxy-based, voc-free soldering flux |
| 03/14/2007 | CN2877939Y Lead-free welding rework system |
| 03/14/2007 | CN2877938Y Wave soldering equipment |
| 03/14/2007 | CN1930930A Via transmission lines for multilayer printed circuit boards |
| 03/14/2007 | CN1930929A Multilayer printed wiring board and test body for printed wiring board |
| 03/14/2007 | CN1930928A Partially etched dielectric film with conductive features |
| 03/14/2007 | CN1930927A A method of creating solder bar connections on electronic packages |
| 03/14/2007 | CN1930738A Maximizing capacitance per unit area while minimizing signal transmission delay in PCB |
| 03/14/2007 | CN1930696A Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body |
| 03/14/2007 | CN1930684A Component with encapsulation suitable for WLP and production method |
| 03/14/2007 | CN1930683A Conductive material compositions, apparatus, systems, and methods |
| 03/14/2007 | CN1930637A Process for preparing a non-conductive substrate for electroplating |
| 03/14/2007 | CN1930323A Metal surface treating agent |
| 03/14/2007 | CN1930262A Heat-peelable pressure-sensitive adhesive sheet and method of processing adhered with the heat-peelable pressure-sensitive adhesive sheet |
| 03/14/2007 | CN1930241A Resin molded article with reduced dielectric loss tangent and method of manufacturing thereof |
| 03/14/2007 | CN1929950A Method of semiconductor device assembly including fatigue-resistant ternary solder alloy |
| 03/14/2007 | CN1929721A Method for forming wiring on insulating resin layer |
| 03/14/2007 | CN1929720A Infrared melting welding machine |
| 03/14/2007 | CN1929719A 印刷电路板及其制造方法 A printed circuit board and manufacturing method thereof |
| 03/14/2007 | CN1929718A Improved electrodes, inner layers, capacitors, electronic devices and methods of making thereof |
| 03/14/2007 | CN1929717A Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner |
| 03/14/2007 | CN1929716A Polyimide copper foil laminates and method for manufacturing same |
| 03/14/2007 | CN1929123A Multilayered wiring substrate and method of manufacturing the same |
| 03/14/2007 | CN1929064A Principle and structure for integrated relay and communication relay with height less than 2 millimeter |
| 03/14/2007 | CN1927944A Resin composition, cured composition and printed circuit board using same |
| 03/14/2007 | CN1927583A Position adjustment platform of full-automatic vision printing machine |
| 03/14/2007 | CN1927521A Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method |
| 03/14/2007 | CN1927515A Soldering method |
| 03/14/2007 | CN1305360C Method and device for searching standard and method for detecting standard position |
| 03/14/2007 | CN1305357C Welding method and welded parts |
| 03/14/2007 | CN1305356C Wiring base material, electrical equipment and switching device possessing the same |
| 03/14/2007 | CN1305355C Rolled copper foil for making flexible printed circuit board and its production method |
| 03/14/2007 | CN1305123C Device for locating apparatus on substrate with no need of welding |
| 03/14/2007 | CN1305120C Metal pattern formation |
| 03/14/2007 | CN1305004C IC card and manufacturing method thereof |
| 03/14/2007 | CN1304510C Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| 03/14/2007 | CN1304460C Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts |
| 03/14/2007 | CN1304196C Laminar composition and method for preparing the same |
| 03/14/2007 | CN1304179C A method and related apparatus for cutting a product from a sheet material |
| 03/13/2007 | US7191415 Clearance inspection apparatus and clearance inspection method |
| 03/13/2007 | US7190982 Radio frequency device |
| 03/13/2007 | US7190970 Multiplexer |
| 03/13/2007 | US7190592 Integrated library core for embedded passive components and method for forming electronic device thereon |
| 03/13/2007 | US7190243 Waveguide coupler |
| 03/13/2007 | US7190179 Contact probe |
| 03/13/2007 | US7190080 Semiconductor chip assembly with embedded metal pillar |
| 03/13/2007 | US7190073 Circuit film with bump, film package using the same, and related fabrication methods |
| 03/13/2007 | US7190069 Method and system of tape automated bonding |
| 03/13/2007 | US7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate |
| 03/13/2007 | US7189929 Flexible circuit with cover layer |
| 03/13/2007 | US7189927 Electronic component with bump electrodes, and manufacturing method thereof |
| 03/13/2007 | US7189669 Dielectric ceramic material and multilayer ceramic substrate |
| 03/13/2007 | US7189630 Layer sequence for producing a composite material for electromechanical components |
| 03/13/2007 | US7189600 Methods for fabricating stiffeners for flexible substrates |
| 03/13/2007 | US7189598 Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument |
| 03/13/2007 | US7189449 Metal/ceramic bonding substrate and method for producing same |
| 03/13/2007 | US7189435 Three dimensional multilayer nanostructure |
| 03/13/2007 | US7189336 Etchant, method for roughening copper surface and method for producing printed wiring board |
| 03/13/2007 | US7189302 Multi-layer printed circuit board and fabricating method thereof |
| 03/13/2007 | US7189083 Method of retaining a solder mass on an article |
| 03/13/2007 | US7189081 Method of mounting terminal and terminal mounting structure |
| 03/13/2007 | US7189079 Electro-formed ring interconnection system |
| 03/13/2007 | US7189077 Lithographic type microelectronic spring structures with improved contours |
| 03/13/2007 | US7188781 Method and apparatus for detecting a liquid spray pattern |
| 03/13/2007 | US7188414 Method of assembling a flat electrical cable |
| 03/13/2007 | US7188413 Method of making a microelectronic package |
| 03/13/2007 | US7188412 Method for manufacturing printed wiring board |
| 03/13/2007 | US7188410 Insertion of electrical component within a via of a printed circuit board |
| 03/13/2007 | US7188409 Method for rejecting component during a placement cycle |
| 03/13/2007 | US7188408 Method of making a straddle mount connector |
| 03/13/2007 | US7188405 Pin removal structure used in printed circuit board drilling machine |
| 03/13/2007 | CA2187316C High temperature resistant antistatic pressure-sensitive adhesive tape |
| 03/08/2007 | WO2007027604A1 Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing |
| 03/08/2007 | WO2007026541A1 Screen mask and semiconductor device fabrication method |
| 03/08/2007 | WO2007026499A1 Board structure and electronic device |
| 03/08/2007 | WO2007026455A1 Ceramic electronic component and method for manufacturing the same |
| 03/08/2007 | WO2007026439A1 Substrate structure |
| 03/08/2007 | WO2007026366A1 Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| 03/08/2007 | WO2007026174A2 Method of printing |
| 03/08/2007 | WO2007025753A2 Modular microelectronic component |
| 03/08/2007 | WO2007025675A1 Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
| 03/08/2007 | WO2006133317A3 Printing conductive patterns using lep |
| 03/08/2007 | WO2006009850A3 Semiconductor assembly having substrate with electroplated contact pads |
| 03/08/2007 | WO2002029137A9 Method and associated apparatus for tilting a substrate upon entry for metal deposition |