| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/21/2007 | EP1763594A1 Method for improving solderability of nickel coatings |
| 03/21/2007 | EP1459408B1 Grouped element transmission channel link termination assemblies |
| 03/21/2007 | EP1181535B1 Method and apparatus for inspecting solder paste deposits on substrates |
| 03/21/2007 | EP1042534B1 Metal surface coating, especially for micro electronics |
| 03/21/2007 | CN2882193Y Improved structure of tin paste coating machine |
| 03/21/2007 | CN1934919A Method for gluing circuit components on circuit board |
| 03/21/2007 | CN1934918A Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components |
| 03/21/2007 | CN1934917A Support platform for electrical components, and module comprising said support platform |
| 03/21/2007 | CN1934916A Device provided with an electric motor and a main printed circuit board and mounting method |
| 03/21/2007 | CN1934915A Printed circuit board comprising at least one connection borehole for a connecting wire or pin of a wired electronic component |
| 03/21/2007 | CN1934718A Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate |
| 03/21/2007 | CN1934707A Method of forminig thin film integrated circuit |
| 03/21/2007 | CN1934690A Solder composition and method of bump formation therewith |
| 03/21/2007 | CN1934689A Plasma processing method and method for fabricating electronic component module using the same |
| 03/21/2007 | CN1934293A Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surfac |
| 03/21/2007 | CN1934173A Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material |
| 03/21/2007 | CN1933703A Printed circuit board having fine pattern and manufacturing method thereof |
| 03/21/2007 | CN1933702A Forming method for resin layer of metal layer, printed wiring board and its manufacturing method |
| 03/21/2007 | CN1933701A Aqueous dispersion forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the s |
| 03/21/2007 | CN1933700A Wiring forming system and method |
| 03/21/2007 | CN1933699A Method for producing antipressing linear circuit board and products thereof |
| 03/21/2007 | CN1933698A 膜孔形成装置及方法 Apparatus and method for the formation of membrane pores |
| 03/21/2007 | CN1933697A Multilayered wiring substrate and manufacturing method thereof |
| 03/21/2007 | CN1933696A Multilayer wiring board and fabricating method of the same |
| 03/21/2007 | CN1933139A Wiring board and method for manufacturing the same, and semiconductor device |
| 03/21/2007 | CN1931947A Adhesive composition for circuit connection |
| 03/21/2007 | CN1306856C Electroplating method of printed circuit board |
| 03/21/2007 | CN1306658C Low profile connector |
| 03/21/2007 | CN1306621C Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler |
| 03/21/2007 | CN1306605C Film carried belt for mounting electronic components thereon |
| 03/21/2007 | CN1306604C Semiconductor device, its mfg. method and thin sheet interconnecting line parts |
| 03/21/2007 | CN1306603C Laminated electronic component |
| 03/21/2007 | CN1306601C Semiconductor package and its manufacture |
| 03/21/2007 | CN1306574C Manufacturing process of conducting hole |
| 03/21/2007 | CN1306526C Method for forming noble metal film pattern |
| 03/21/2007 | CN1306338C Photosensitive composition, cured article thereof, and printed circuit board using same |
| 03/21/2007 | CN1306333C Display board and liquid crystal display with the same |
| 03/21/2007 | CN1305657C Cushioning material for hot pressing and process for producing the same |
| 03/20/2007 | US7193841 Circuit assembly and heat-insulating member for circuit assembly |
| 03/20/2007 | US7193838 Printed circuit dielectric foil and embedded capacitors |
| 03/20/2007 | US7193499 Chip resistor and method of making the same |
| 03/20/2007 | US7193329 Semiconductor device |
| 03/20/2007 | US7193321 IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body |
| 03/20/2007 | US7193314 Semiconductor devices and substrates used in thereof |
| 03/20/2007 | US7193311 Multi-chip circuit module and method for producing the same |
| 03/20/2007 | US7193307 Multi-layer FET array and method of fabricating |
| 03/20/2007 | US7193158 Wiring board device |
| 03/20/2007 | US7193157 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 03/20/2007 | US7193009 Electronic device using low dielectric loss tangent insulators for high frequency signals |
| 03/20/2007 | US7192846 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 03/20/2007 | US7192806 Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| 03/20/2007 | US7192801 Printed circuit board and fabrication method thereof |
| 03/20/2007 | US7192320 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity |
| 03/20/2007 | US7192312 Design and method for plating PCI express (PCIE) edge connector |
| 03/20/2007 | US7192286 Printed circuit board and an image forming apparatus having the printed circuit board |
| 03/20/2007 | US7192119 Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
| 03/20/2007 | US7191930 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 03/20/2007 | US7191517 Shielding base member manufacturing method |
| 03/20/2007 | US7191516 Method for shielding integrated circuit devices |
| 03/20/2007 | US7191515 Method for manufacturing an interconnected circuit board assembly |
| 03/20/2007 | US7191512 Tray system for holding and positioning components |
| 03/20/2007 | US7191507 Method of producing a wireless communication device |
| 03/15/2007 | WO2007029979A1 Release film for pcb lamination process |
| 03/15/2007 | WO2007029866A1 Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
| 03/15/2007 | WO2007029789A1 Method for formation of pzt-type dielectric layer suitable for built-in capacitor circuit in printed wiring board |
| 03/15/2007 | WO2007029452A1 Method of forming conductive pattern and wiring board |
| 03/15/2007 | WO2007029329A1 Solder alloy, and making use of the solder alloy, electronic substrate and process for producing the same |
| 03/15/2007 | WO2007028541A1 Chip carrying group |
| 03/15/2007 | WO2007028410A1 Forming tool |
| 03/15/2007 | WO2006133761A3 Partially shaped electrically conductive structure and method for the production thereof |
| 03/15/2007 | WO2006083615A3 Method for connecting two printed circuit boards and printed circuit board therefore |
| 03/15/2007 | WO2005060401A3 Direct contact power transfer pad and method of making same |
| 03/15/2007 | US20070060674 Curable composition, varnish and laminate |
| 03/15/2007 | US20070060223 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 03/15/2007 | US20070059981 Compact radio equipment and method of mounting the same |
| 03/15/2007 | US20070059939 Method of producing a conductive layer on a substrate |
| 03/15/2007 | US20070059646 exposing pressure sensitive or photosensitive elements dispersed in binders, to pressure or radiation to form latent images, then development to form patterned images and electroless or electrodeposition of metals to the image to improve the electroconductivity of the conductors, used in printed circuits |
| 03/15/2007 | US20070059549 Metallic pattern for manufacturing prism sheet and method of manufacturing the same |
| 03/15/2007 | US20070059503 Insulated conductive particles and anisotropic conductive adhesive film containing the particles |
| 03/15/2007 | US20070059497 Reversal imprint technique |
| 03/15/2007 | US20070059449 Plating method of metal film on the surface of polymer |
| 03/15/2007 | US20070059440 Method for manufacturing plasma display panel |
| 03/15/2007 | US20070058378 Socket device |
| 03/15/2007 | US20070057908 Electronically addressable microencapsulated ink and display thereof |
| 03/15/2007 | US20070057473 Rotary tool holder assemblie |
| 03/15/2007 | US20070057027 Method and device for filling zones situated in hollows or between tracks with a viscous product on a printed circuit board and apparatus using such a device |
| 03/15/2007 | US20070056924 Printed wiring board and method for manufacturing the same |
| 03/15/2007 | US20070056767 Printed wiring board and method for manufacturing the same |
| 03/15/2007 | US20070056766 Electronic component embedded board and its manufacturing method |
| 03/15/2007 | US20070056454 System and apparatus for forming an imprinting tool |
| 03/15/2007 | US20070056365 Fluid quality sensor |
| 03/15/2007 | US20070056163 Bonding Structure With Buffer Layer And Method Of Forming The Same |
| 03/15/2007 | US20070056157 Method of controlling contact load in electronic component mounting apparatus |
| 03/15/2007 | DE202005017409U1 Vorrichtung zum Vorbereiten einer Mehrschicht-Leiterplatte auf das Bohren von Kontaktierungsbohrungen An apparatus for preparing a multi-layer printed circuit board to the drilling of via- |
| 03/15/2007 | DE112005000364T5 Leitfähiger Klebstoff Conductive adhesive |
| 03/15/2007 | DE10327500B4 Verfahren zur Herstellung von Elektrodenstrukturen sowie Elektrodenstruktur und deren Verwendung A process for the production of electrode structures and electrode structure and the use thereof |
| 03/15/2007 | DE102005044659A1 Generating addressed electrically conducting polymer structures as conducting tracks, component supports involves using mask to produce addressed radiation dose acting on electrically conducting polymer coating to destroy conductivity |
| 03/15/2007 | DE102005043279A1 Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component |
| 03/15/2007 | DE102005041640A1 Modulares mikroelektronisches Bauteil Modular microelectronic components |
| 03/15/2007 | DE102005041464A1 Thermoden unit for joining and or electrically contacting many semiconductor elements with a common substrate or second element by warming adhesive under pressure has movable heating head and two heating plates |