| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/09/2007 | US7159306 Modular rotary anvil |
| 01/09/2007 | US7159292 Recovery processing method of an electrode |
| 01/09/2007 | CA2242726C Near azeotropic mixture of 1,1,1,3,3-pentafluorobutane, methylene chloride and methanol for the treatment of solid surfaces |
| 01/09/2007 | CA2176285C Encapsulated anti-shock electronic device |
| 01/04/2007 | WO2007002956A1 Composite metal layer formed using metal nanocrystalline particles in an electroplating bath |
| 01/04/2007 | WO2007002424A1 Silver barrier layer to minimize whisker growth in tin electrodeposits |
| 01/04/2007 | WO2007002099A1 Method for mutually connecting circuit boards |
| 01/04/2007 | WO2007001995A1 Dielectric substrate with holes and method of manufacture |
| 01/04/2007 | WO2007001008A1 Method for producing printed board and printed board |
| 01/04/2007 | WO2007000963A1 Process for producing nonflat ceramic substrate |
| 01/04/2007 | WO2007000885A1 Permanent patterning method |
| 01/04/2007 | WO2007000833A1 Method for electrically conductive circuit formation |
| 01/04/2007 | WO2006031206A3 An improved backup board |
| 01/04/2007 | WO2005105356A3 Electrochemical mechanical planarization process and apparatus |
| 01/04/2007 | US20070005112 Biocompatible bonding method and electronics package suitable for implantation |
| 01/04/2007 | US20070005111 Protection apparatus for implantable medical device |
| 01/04/2007 | US20070004240 System and method for processor power delivery and thermal management |
| 01/04/2007 | US20070004200 Selective activation of aluminum, copper, and tungsten structures |
| 01/04/2007 | US20070004089 Stacked memory and manufacturing method thereof |
| 01/04/2007 | US20070002254 Liquid crystal display device |
| 01/04/2007 | US20070001796 Printed circuit board with integrated inductor |
| 01/04/2007 | US20070001701 Circuit board inspection device |
| 01/04/2007 | US20070001313 Method of interconnecting terminals and method for mounting semiconductor device |
| 01/04/2007 | US20070001300 Semiconductor device |
| 01/04/2007 | US20070001286 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 01/04/2007 | US20070001271 Lead frame and method of manufacturing the lead frame |
| 01/04/2007 | US20070000685 Connection sheet |
| 01/04/2007 | US20070000439 Paste coating method |
| 01/04/2007 | US20070000126 Flexible printed circuit board assembly, method for manufacturing the same, and portable terminal comprising the same |
| 01/04/2007 | US20070000125 Component mounting device and component mounting method |
| 01/04/2007 | DE19529656B4 Verfahren zur Herstellung von Mikrostrukturen A process for the fabrication of microstructures |
| 01/04/2007 | DE112004002013T5 Paste für die Bildung einer Verknüpfung und die Verknüpfung gebildet aus der Paste Paste formed for the formation of a link and the link from the paste |
| 01/04/2007 | DE10248112B4 Verfahren zur Herstellung von gedruckten elektrischen Schaltungen A process for the production of printed electrical circuits |
| 01/04/2007 | DE102005055488A1 Electronic structure and production process use lead-free solder columns comprising two materials for interconnections with the core material having the lower melting temperature |
| 01/04/2007 | DE102005031181A1 Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte Printed circuit board having a surface with multiple contact surfaces, methods for coating the contact surfaces of a printed circuit board |
| 01/04/2007 | DE102004009567B4 Verdrahtungsträger zur Aufnahme von Chips Wiring carrier to hold chips |
| 01/04/2007 | DE10139111B4 Verfahren für das Verbinden eines leitfähigen Klebers und einer Elektrode sowie einer verbundenen Struktur A method of bonding a conductive adhesive and an electrode as well as a connected structure |
| 01/04/2007 | CA2613282A1 Dielectric substrate with holes and method of manufacture |
| 01/03/2007 | EP1740029A1 Circuit substrate |
| 01/03/2007 | EP1740028A1 Printed circuit board with RF connector and method for attaching RF connector to printed circuit board |
| 01/03/2007 | EP1740027A2 Method for manufacturing an overmolded electronic assembly |
| 01/03/2007 | EP1740026A2 Foreign matter removing apparatus |
| 01/03/2007 | EP1739739A1 Through wiring board and method for producing the same |
| 01/03/2007 | EP1739487A1 Bilayer laminated film for bump formation and method of bump formation |
| 01/03/2007 | EP1739475A2 Partition-wall structure for forming a conductive pattern by ink jet printing |
| 01/03/2007 | EP1738627A2 Method and apparatus for venting an electronic control module |
| 01/03/2007 | EP1738626A1 Process for manufacturing a power electronic appliance by bending |
| 01/03/2007 | EP1738623A1 Method for reflow soldering |
| 01/03/2007 | EP1738622A1 Circuit board panel with a plurality of circuit carriers, circuit carrier and method for individually separating circuit carriers belonging to a circuit board panel |
| 01/03/2007 | EP1738431A2 Embedded capacitors using conductor filled vias |
| 01/03/2007 | EP1738418A1 Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate |
| 01/03/2007 | EP1737600A1 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
| 01/03/2007 | EP1516372B1 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof |
| 01/03/2007 | EP1415522A4 Electromagnetic filter for display screens |
| 01/03/2007 | EP1354385B1 Securing electrical conductors |
| 01/03/2007 | EP1330558B1 Leadfree chemical nickel alloy |
| 01/03/2007 | EP1060647B1 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 01/03/2007 | EP0850489B1 Solder deposit support |
| 01/03/2007 | CN2855007Y Printed circuit board replacement structure |
| 01/03/2007 | CN2855005Y Printed circuit board replacement structure |
| 01/03/2007 | CN1891019A Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board |
| 01/03/2007 | CN1891018A Printed-circuit board, its manufacturing method and semiconductor device |
| 01/03/2007 | CN1890845A Small array contact with precision working range |
| 01/03/2007 | CN1890806A Connector for making electrical contact at semiconductor scales and method for forming same |
| 01/03/2007 | CN1890765A Wound capacitor with ball-and-lead configuration |
| 01/03/2007 | CN1890604A Device and method for large area lithography |
| 01/03/2007 | CN1890602A Photographic materials having improved keeping properties |
| 01/03/2007 | CN1890339A Anisotropic conductive adhesive sheet and coupling structure |
| 01/03/2007 | CN1890144A Railway beacon and related production method |
| 01/03/2007 | CN1889813A Light-emitting diode forming welding method and used fixed lamp-socket for realizing the same method |
| 01/03/2007 | CN1889812A Etching removing method and etching solution in manufacturing print wiring substrate using semi-additive process |
| 01/03/2007 | CN1889811A Technology for auxiliary removing hole wall copper in deep drilling hole |
| 01/03/2007 | CN1889810A Printed circuit board with improved hole |
| 01/03/2007 | CN1889809A Jafani effect improving method |
| 01/03/2007 | CN1889808A Printed circuit board overlap pad wiring structure |
| 01/03/2007 | CN1887594A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| 01/03/2007 | CN1887593A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| 01/03/2007 | CN1887592A Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| 01/03/2007 | CN1293790C Built-in module in element and its making process |
| 01/03/2007 | CN1293602C Circuit board and its manufacturing method, copy chip, copy source substrate, electro-optical device |
| 01/03/2007 | CN1293236C Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 01/03/2007 | CN1293234C Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 01/03/2007 | CN1293116C Photocurable/thermoseting composition for forming matte film |
| 01/03/2007 | CN1292896C Laminate and its production method |
| 01/02/2007 | USRE39453 Low profile inductive component |
| 01/02/2007 | US7158387 Film carrier tape for mounting electronic part |
| 01/02/2007 | US7158383 Techniques for fabricating a resistor on a flexible base material |
| 01/02/2007 | US7158372 Electronic control unit |
| 01/02/2007 | US7158365 Method of producing a multilayer microelectronic substrate |
| 01/02/2007 | US7158348 Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication |
| 01/02/2007 | US7157987 Transmission line having a transforming impedance |
| 01/02/2007 | US7157800 Bonded structure using conductive adhesives, and a manufacturing method thereof |
| 01/02/2007 | US7157723 System and method for attenuating the effect of ambient light on an optical sensor |
| 01/02/2007 | US7157415 Post etch cleaning composition for dual damascene system |
| 01/02/2007 | US7157364 Method for forming metal contacts on a substrate |
| 01/02/2007 | US7157362 Electronic circuit unit and method of fabricating the same |
| 01/02/2007 | US7156945 A pattern is printed with a masking coating or an ink, on the substrate, the pattern being such that, the desired thin film structures will be formed in the areas where the printed masking coating is not present |
| 01/02/2007 | US7156935 Unfired first ceramic layers and unfired second ceramic layer of different color from the unfired first layer are laminated, surface is notched to the proper depth using second layer as a reference, firing, and dividing along the notches into ceramic composites; little deformation and few cracks |
| 01/02/2007 | US7156904 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
| 01/02/2007 | US7156362 Method and apparatus for forming metal contacts on a substrate |