| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/18/2007 | US20070014051 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 01/18/2007 | US20070013067 Electronic component mounting method and apparatus |
| 01/18/2007 | US20070013051 Multichip circuit module and method for the production thereof |
| 01/18/2007 | US20070013049 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 01/18/2007 | US20070013048 Electronic parts packaging structure and method of manufacturing the same |
| 01/18/2007 | US20070013041 Flexible wiring board and flex-rigid wiring board |
| 01/18/2007 | US20070012560 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 01/18/2007 | US20070012475 Rigid-flex wiring board and method for producing same |
| 01/18/2007 | US20070011871 Method of manufacturing a device, device, non-contact type card medium, and electronic equipment |
| 01/18/2007 | US20070011870 Method of manufacture of an identification wristband construction |
| 01/18/2007 | DE112005000559T5 Vorrichtung zur Maximierung der Kapazität pro Flächeneinheit bei gleichzeitiger Minimierung der Signalverzögerung in Leiterplatten An apparatus for maximizing the capacitance per unit area while minimizing signal delay in the printed circuit boards |
| 01/18/2007 | DE112005000522T5 Platinen-Herstellungsverfahren und Platine PCB manufacturing process and board |
| 01/18/2007 | DE112005000374T5 Verfahren und Vorrichtung zum Wechseln des Bahnmaterials in einem Schablonendrucker Method and device for changing the sheet material in a stencil printer |
| 01/18/2007 | DE102005048416B3 Electric apparatus or instrument having through contacts in the electric substrate conductively connecting contacts on either side of the substrate |
| 01/18/2007 | DE102005033899A1 Testing status of connection between two components, e.g. solder joint or bond, by comparing data representing ageing characteristics measured at two or more points in time |
| 01/18/2007 | DE102005033756A1 Production of an electronic component, especially for thin film transistors presses two multilayer structures together that include a cutter for carrier release |
| 01/18/2007 | DE102005033218A1 Dreidimensionale Schaltung Three-dimensional circuit |
| 01/18/2007 | DE102005032804A1 Multilayer structure for electronic circuit, especially circuit board, has conductively formed metallic conductor arranged on part of printed conductor elements |
| 01/18/2007 | DE102005032135A1 Verfahren zum Löten einer Leiterplatte mit bleifreier Lotpaste in einem Reflow-Lötofen, Leiterplatte für solch ein Verfahren und Reflow-Lötofen The method of soldering a circuit board with lead-free solder paste in a reflow oven, printed circuit board for such a method and reflow oven |
| 01/18/2007 | DE102004045896B4 Transponder mit Antenne und Flip-Chip-Modul und Verfahren zu dessen Herstellung Transponder with antenna and flip chip module and method of producing the |
| 01/18/2007 | DE102004023688B4 Verfahren zur Bestückung einer flexiblen Leiterplatte Method for mounting a flexible printed circuit board |
| 01/17/2007 | EP1744609A2 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/17/2007 | EP1744608A2 Multilayer printed wiring board |
| 01/17/2007 | EP1744607A1 Conductive member for non-contact type data carrier and method and device for manufacturing the same |
| 01/17/2007 | EP1744606A2 Printed circuit board and method for producing the printed circuit board |
| 01/17/2007 | EP1743510A1 Method for printing electrical and/or electronic structures and film for use in such a method |
| 01/17/2007 | EP1743159A1 Method of assessing the risk of whiskers appearing on the surface of a metallic deposit |
| 01/17/2007 | EP1742991A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material |
| 01/17/2007 | EP1623614B1 Dry cabinets for use in moisture sensitive device management in electronics manufacturing |
| 01/17/2007 | EP1142849B1 Silicon nitride composite substrate |
| 01/17/2007 | CN2859998Y Strain gage pasting tool |
| 01/17/2007 | CN1899005A Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same |
| 01/17/2007 | CN1899004A Wiring formation method, wiring formation equipment, and wiring board |
| 01/17/2007 | CN1899003A Etching solution, method of etching and printed wiring board |
| 01/17/2007 | CN1899002A Printed-circuit board, its manufacturing method and circuit device |
| 01/17/2007 | CN1898764A Connecting structure and connecting method of circuit |
| 01/17/2007 | CN1898555A Substrate inspection device |
| 01/17/2007 | CN1898434A Electric interface for water-bearing household devices |
| 01/17/2007 | CN1898051A Fine metal particles and fine metal oxide particles in dry powder form, and use thereof |
| 01/17/2007 | CN1897807A Component mounting apparatus |
| 01/17/2007 | CN1897806A Method for arranging solid tin on circuit board |
| 01/17/2007 | CN1897797A Multiple layer wiring board and its production method |
| 01/17/2007 | CN1897796A Production of multi-layer circuit board of built-in passive assembly |
| 01/17/2007 | CN1897795A Production of multi-layer circuit board of built-in passive assembly |
| 01/17/2007 | CN1897794A Production of multi-layer circuit board of built-in passive assembly |
| 01/17/2007 | CN1897793A Method of treating and probing a via |
| 01/17/2007 | CN1897792A Printing circuit board |
| 01/17/2007 | CN1897791A Heating apparatus |
| 01/17/2007 | CN1897790A Separation of printing circuit board component |
| 01/17/2007 | CN1897789A Semiconductor device |
| 01/17/2007 | CN1897788A Reinforced film for flexible printing circuit board |
| 01/17/2007 | CN1897787A Circuit board assembly and method for producing the same |
| 01/17/2007 | CN1897264A Package substrate |
| 01/17/2007 | CN1897018A Memory-card component configuration |
| 01/17/2007 | CN1896806A Module for manufacturing a display device, method of manufacturing the same, and method of manufacturing a display device using the same |
| 01/17/2007 | CN1295951C Electromagnetically shielded circuit device and shielding method therefor |
| 01/17/2007 | CN1295947C Electronic component, component mounting equipment, and component mounting method |
| 01/17/2007 | CN1295861C Piezoelectric oscillator and its mfg. method |
| 01/17/2007 | CN1295783C 电子装置 Electronic devices |
| 01/17/2007 | CN1295771C Flip chip interconnection using no clean flux |
| 01/17/2007 | CN1295770C Electronic interconnect devices and methods of making the same and coaxial electrical bonding pad |
| 01/17/2007 | CN1295721C Electronic device with external terminals and mfg method thereof |
| 01/17/2007 | CN1295711C 被覆导电性微粒 Covering the conductive particles |
| 01/17/2007 | CN1295555C Circuit array lining for display device and method for making said lining |
| 01/17/2007 | CN1295052C Laser milling method and system therfor |
| 01/16/2007 | US7164460 Mounting structure for semiconductor device, electro-optical device, and electronic apparatus |
| 01/16/2007 | US7164388 Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials |
| 01/16/2007 | US7164341 Surface-mountable PTC thermistor and mounting method thereof |
| 01/16/2007 | US7164281 Circuit board component ambient moisture exposure monitoring |
| 01/16/2007 | US7164198 Multilayered substrate for semiconductor device |
| 01/16/2007 | US7164197 Containing a toughened benzocyclobutene resin and about 50% by weight of an inorganic particulate filler, resin and inorganic particulate filler being compatibilized by means of a silane coupling agent; excellent dielectrical, thermal, and mechanical properties |
| 01/16/2007 | US7164196 Semiconductor device |
| 01/16/2007 | US7164195 Semiconductor device and semiconductor device manufacturing method |
| 01/16/2007 | US7164097 Solder ball bonding method and bonding device |
| 01/16/2007 | US7164085 Multilayer wiring board including stacked via structure |
| 01/16/2007 | US7163847 Method of making circuitized substrate |
| 01/16/2007 | US7163846 Method for manufacturing circuit devices |
| 01/16/2007 | US7163734 Suitable as an electronic circuitry element in an electric or semiconductor device |
| 01/16/2007 | US7163614 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 01/16/2007 | US7163613 Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses |
| 01/16/2007 | US7163600 manufacturing a material for components that are as thin as possible |
| 01/16/2007 | US7163137 Method of manufacturing mounting boards |
| 01/16/2007 | US7162796 Method of making an interposer with contact structures |
| 01/16/2007 | US7162795 Power distribution system with a dedicated power structure and a high performance voltage regulator |
| 01/16/2007 | US7162794 Manufacturing method for multilayer ceramic elements |
| 01/16/2007 | US7162793 Apparatus for clamping printed circuit boards inside an electronic module housing |
| 01/16/2007 | CA2212740C Cleaning process where cleaning agent comprises organic solvent that forms an azetrope with water |
| 01/11/2007 | WO2007005516A2 Connector-to-pad pcb translator for a tester and method of fabricatio |
| 01/11/2007 | WO2007004660A1 Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package |
| 01/11/2007 | WO2007004658A1 Printed wiring board |
| 01/11/2007 | WO2007004657A1 Printed wiring board |
| 01/11/2007 | WO2007004619A1 Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition |
| 01/11/2007 | WO2007004431A1 Method of forming high-resolution pattern and apparatus therefor |
| 01/11/2007 | WO2007004415A1 Multilayer ceramic substrate, process for producing the same and composite green sheet for production of multilayer ceramic substrate |
| 01/11/2007 | WO2007004414A1 Multilayer ceramic substrate, process for producing the same and composite green sheet for production of multilayer ceramic substrate |
| 01/11/2007 | WO2007004259A1 Method and device for removing micro component |
| 01/11/2007 | WO2007003465A1 Printed circuit board provided whose surface is provided with several contact surfaces, method for coating contact surfaces of a printed circuit board and a method for conductivity gluing an electric or electronic component to the printed circuit board |
| 01/11/2007 | WO2007003247A1 Security document or valuable document comprising a contactless interface and a bi-stable display |
| 01/11/2007 | WO2007003223A1 Method and apparatus for forming a noble metal layer, notably on inlaid metal features |
| 01/11/2007 | WO2007002995A1 Fabrication of electronic components in plastic |