| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/07/2007 | CN1910974A Paste for soldering and soldering method using the same |
| 02/07/2007 | CN1910973A Screen printer |
| 02/07/2007 | CN1910972A Nozzle arrangement and method for processing a material for processing with a processing medium |
| 02/07/2007 | CN1910971A Packaging and manufacturing of an integrated circuit |
| 02/07/2007 | CN1910970A Circuit board and method for mounting chip component |
| 02/07/2007 | CN1910100A Coverlay film laminating device |
| 02/07/2007 | CN1910041A Polyimide metal laminate and circuit substrate |
| 02/07/2007 | CN1910028A Circuit insulation methods and systems for vehicle door latches |
| 02/07/2007 | CN1910013A Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
| 02/07/2007 | CN1909775A Connector unit, circuit assembly, and electronic device |
| 02/07/2007 | CN1909769A Retaining and connecting device for opto-electronic element |
| 02/07/2007 | CN1909765A Laminated circuit substrate |
| 02/07/2007 | CN1909764A Multi-layer printed circuit board |
| 02/07/2007 | CN1909763A Multi-layer printed circuit board |
| 02/07/2007 | CN1909762A Multi-layer printed circuit board |
| 02/07/2007 | CN1909226A Package substrate |
| 02/07/2007 | CN1909207A Method for forming film pattern, and method for manufacturing device, electro-optical device, electronic apparatus |
| 02/07/2007 | CN1909187A Pattern forming method |
| 02/07/2007 | CN1908706A Methods of forming devices having optical functionality |
| 02/07/2007 | CN1907876A Biocide method in the process of preparation printed circuit board |
| 02/07/2007 | CN1907628A Thermo compression bonding module and method for use thereof |
| 02/07/2007 | CN1299550C Mfg. appts. of laminator |
| 02/07/2007 | CN1299549C Method of processing before hole metallization process of polytetrafluoroethylene printed board |
| 02/07/2007 | CN1299548C Method for metal coating of substrates |
| 02/07/2007 | CN1299547C Structure for interconnecting conductors and connecting method |
| 02/07/2007 | CN1299546C Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 02/07/2007 | CN1299545C Electronic device |
| 02/07/2007 | CN1299544C Nickel coated copper as electrodes for embedded passive devices |
| 02/07/2007 | CN1299542C Through hole wiring board |
| 02/07/2007 | CN1299391C Spherical grid array connection device |
| 02/07/2007 | CN1299355C Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 02/07/2007 | CN1299325C Substrate element and soft substrate |
| 02/07/2007 | CN1298827C Aqueous stripping and cleaning composition |
| 02/07/2007 | CN1298612C Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| 02/07/2007 | CN1298492C Solder metal, soldering flux and solder paste |
| 02/07/2007 | CN1298491C Separated out type soldering tin composition and soldering separating out method |
| 02/07/2007 | CN1298439C Method and device for coating with paste |
| 02/06/2007 | US7173828 Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure |
| 02/06/2007 | US7173824 Cooled power switching device |
| 02/06/2007 | US7173511 Surface-mounted thermistor and manufacturing method thereof |
| 02/06/2007 | US7173445 Sensor for inspection instrument and inspection instrument |
| 02/06/2007 | US7173342 Method and apparatus for reducing electrical interconnection fatigue |
| 02/06/2007 | US7173336 Hybrid integrated circuit device |
| 02/06/2007 | US7173322 COF flexible printed wiring board and method of producing the wiring board |
| 02/06/2007 | US7173193 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
| 02/06/2007 | US7172966 Method for fabricating metallic interconnects on electronic components |
| 02/06/2007 | US7172958 High-frequency wiring structure and method for producing the same |
| 02/06/2007 | US7172925 Method for manufacturing printed wiring board |
| 02/06/2007 | US7172912 Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment |
| 02/06/2007 | US7172818 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 02/06/2007 | US7172805 Method for manufacturing a sequential backplane |
| 02/06/2007 | US7172785 Process for deposition of metal on a surface |
| 02/06/2007 | US7172707 Sputtered spring films with low stress anisotropy |
| 02/06/2007 | US7172684 Performing extrusion via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken; pattern of deposition may vary over the course of deposition by including relative motion |
| 02/06/2007 | US7172643 Wettability and a low melting point |
| 02/06/2007 | US7172469 Structure of bonding plastic part insert-molded with wiring board and method of bonding the same |
| 02/06/2007 | US7172436 Circuit board assembling structure |
| 02/06/2007 | US7172315 LED lamp assembly |
| 02/06/2007 | US7172106 Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board |
| 02/06/2007 | US7171898 Method and apparatus for performing operations within a stencil printer |
| 02/06/2007 | US7171897 System and methods for data-driven control of manufacturing processes |
| 02/06/2007 | US7171746 Process for applying conductor tracks to the surface of plastics moldings |
| 02/06/2007 | US7171745 Apparatus and method for force mounting semiconductor packages to printed circuit boards |
| 02/06/2007 | US7171744 Substrate frame |
| 02/06/2007 | US7171743 Apparatus and method for warpage compensation of a display panel substrate assembly |
| 02/06/2007 | US7171742 Method and system for assembling a printed circuit board using a land grid array |
| 02/01/2007 | WO2007013595A1 Bending-type rigid printed wiring board and process for producing the same |
| 02/01/2007 | WO2007013433A1 METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN |
| 02/01/2007 | WO2007013365A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 02/01/2007 | WO2007013344A1 Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
| 02/01/2007 | WO2007013330A1 Process for producing wiring board covered with thermoplastic liquid crystal polymer film |
| 02/01/2007 | WO2007012992A1 A package and manufacturing method for a microelectronic component |
| 02/01/2007 | WO2007012514A1 Electrically conductive connection and method for producing the same |
| 02/01/2007 | WO2006076613A3 Metal nanoparticle compositions |
| 02/01/2007 | WO2006075794A3 Structure and method for attaching shield case to circuit board, electronic component module and portable telephone |
| 02/01/2007 | WO2005089510A3 Method of forming one or more base structures on an ltcc cofired module |
| 02/01/2007 | US20070027298 Photosetting, thermosetting liquid ink |
| 02/01/2007 | US20070027259 laminated layer contains a blend of first fluoropolymer in which vulcanizing agent has been previously compounded and second fluoropolymer is free of vulcanizing agent, for having the low degree of vulcanization; low hardness and nonbleeding under high temperature and high pressure |
| 02/01/2007 | US20070026710 Electrical connection component |
| 02/01/2007 | US20070026678 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 02/01/2007 | US20070026227 Adhesive aid composition |
| 02/01/2007 | US20070026196 Laminated electronic component and method for producing the same |
| 02/01/2007 | US20070026159 can be deployed to patient care facilities for regional, local, or on-site and on-demand production of adequately pure Yttrium-90; generator column comprise a 90Sr stock adsorbed on a sorbent; milking solution elutes 90Y from the column; concentration column sorbent captures y90 from milking solution |
| 02/01/2007 | US20070025878 Electronic device and thermal type flow meter on vehicle |
| 02/01/2007 | US20070025180 Agitation/deaeration device |
| 02/01/2007 | US20070025040 High voltage over-current protection device and manufacturing method thereof |
| 02/01/2007 | US20070024800 Substrate and process for producing the same |
| 02/01/2007 | US20070023924 Semiconductor device and method of manufacturing the same |
| 02/01/2007 | US20070023419 Variable watt density layered heater |
| 02/01/2007 | US20070023138 Gluing method and device |
| 02/01/2007 | US20070022808 Sensor device and method for manufacturing the same |
| 02/01/2007 | US20070022773 Cooling energy saving structure |
| 02/01/2007 | US20070022601 Dual-damascene bit line structures for microelectronic devices and methods of fabricating microelectronic devices |
| 02/01/2007 | US20070022590 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same |
| 02/01/2007 | DE202006016542U1 Releasable bare chip module is fitted on substrate with printed circuit and one or more setting frames, each with inner rubber spring connector |
| 02/01/2007 | DE19718029B4 Elektrisches Verbindungssystem An electrical interconnect system |
| 02/01/2007 | DE10325550B4 Elektrisches Kontaktierungsverfahren Electrical contacting methods |
| 02/01/2007 | DE102005035102A1 Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen Electrically conductive connection and methods for producing such |
| 02/01/2007 | DE102005034499A1 Werkzeug zum Verpressen eines Multilayerpresspaketes, insbesondere zur Anordnung in einer Presse bzw. Paketaufbau zum Verpressen von Multilayern bzw. Presse zur Verpressung bzw. Herstellung von Multilayern Tool for compressing a multilayer press packet, in particular for arrangement in a press or packet structure for pressing multilayer or press for pressing or multilayer production |
| 02/01/2007 | DE102005034085A1 Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff A method of applying electrical conductor patterns on a target component made of plastic |