| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/18/2007 | CN1311721C Circuit board comprising a contact sleeve that is mounted thereon |
| 04/18/2007 | CN1311720C Method for forming image on object surface including circuit substrate |
| 04/18/2007 | CN1311719C Printed wiring board and production method thereof |
| 04/18/2007 | CN1311718C Anti-alter multilayer board and its design device and method |
| 04/18/2007 | CN1311549C Wiring and wiring production method and wiring board and wiring board production method |
| 04/18/2007 | CN1311504C Manufacturing method of plasma display device |
| 04/18/2007 | CN1311484C Method for forming film capacitor with less leakage current and high insulation voltage-resistance |
| 04/18/2007 | CN1311297C Polymerizable composition, inhibitor and electron beam plate printing method |
| 04/18/2007 | CN1311099C Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy |
| 04/18/2007 | CN1311027C Soldering pallet for printing circuit board, and preparing method |
| 04/18/2007 | CN1311014C Silver-based powder, method of preparation thereof, and curable silicone composition |
| 04/18/2007 | CN1310772C Laser thermal transfer donor contg separated adulterant coating |
| 04/18/2007 | CN1310747C Security tag and process for making same |
| 04/17/2007 | US7206711 System and method for automatically comparing test points of a PCB |
| 04/17/2007 | US7206185 Capacitor device and fabricating method thereof |
| 04/17/2007 | US7206120 Dynamic beam splitter outputting a selectable number of beams |
| 04/17/2007 | US7206055 Liquid crystal display device |
| 04/17/2007 | US7205909 Touch panel device and method of fabricating the same |
| 04/17/2007 | US7205668 Multi-layer printed circuit board wiring layout |
| 04/17/2007 | US7205661 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 04/17/2007 | US7205659 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
| 04/17/2007 | US7205655 Multilayer circuit including stacked layers of insulating material and conductive sections |
| 04/17/2007 | US7205645 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 04/17/2007 | US7205501 Laser machining method and laser machining apparatus |
| 04/17/2007 | US7205485 Printed circuit board and method for fabricating the same |
| 04/17/2007 | US7205484 Bonding structure for a hard disk drive suspension using anisotropic conductive film |
| 04/17/2007 | US7205483 Flexible substrate having interlaminar junctions, and process for producing the same |
| 04/17/2007 | US7205482 Tape carrier for TAB |
| 04/17/2007 | US7205230 Process for manufacturing a wiring board having a via |
| 04/17/2007 | US7204948 Disposing dispensers for applying the resin, applying the resin directing from each of dispensers to upper side corner and lower side corner, applying the resin almost uniformly over a total length of panel, on the upper side corner; applying the resin onto each attaching portion of flexible boards |
| 04/17/2007 | US7204918 High efficiency plating apparatus and method |
| 04/17/2007 | US7204730 Circuit board inter-connection system and method |
| 04/12/2007 | WO2007040950A1 Laser resist transfer for microfabrication |
| 04/12/2007 | WO2007040196A1 Surface-treated copper foil, process for production of the surface-treated copper foil, and copper-clad laminates made by using the foil |
| 04/12/2007 | WO2007040125A1 Process for producing prepreg with carrier, prepreg with carrier, process for producing thin-type double sided board, thin-type double sided board, and process for producing multilayered printed wiring board |
| 04/12/2007 | WO2007040064A1 Sheet-like composite electronic component and method for manufacturing same |
| 04/12/2007 | WO2007040061A1 Copper-clad laminate, printed wiring board, multilayer printed wiring board, and methods for producing those |
| 04/12/2007 | WO2007040046A1 Etchant for nickel-chromium alloy |
| 04/12/2007 | WO2007039992A1 Two-layer flexible substrate |
| 04/12/2007 | WO2007039751A1 Laminated glazing |
| 04/12/2007 | WO2007039332A1 Printed board |
| 04/12/2007 | WO2007039227A1 Method for generation of metal surface structures and apparatus therefor |
| 04/12/2007 | WO2007038950A1 Method for generation of metal surface structures and apparatus therefor |
| 04/12/2007 | WO2005016580A3 Composite metal matrix castings, solder compositions, and methods |
| 04/12/2007 | US20070082144 Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring, electro-optic device, electronic apparatus, and non-contact card medium |
| 04/12/2007 | US20070082133 Method of metallizing a silicone rubber substrate |
| 04/12/2007 | US20070082127 Process for producing a structured metal layer on a substrate body |
| 04/12/2007 | US20070081341 LED Assembly with Vented Circuit Board |
| 04/12/2007 | US20070080447 Electronic apparatus |
| 04/12/2007 | US20070080329 Electrically conductive paste and multilayer ceramic substrate |
| 04/12/2007 | US20070079986 Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
| 04/12/2007 | US20070079727 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 04/12/2007 | US20070079505 Tape feeder for component mounter providing stable tape feeding and method for mounting a component on a circuit board with component mounter |
| 04/12/2007 | DE19611240B4 Leitfähige Paste auf Silberbasis sowie deren Verwendung als Leiter auf Keramischen Leiterplatten The conductive paste of silver-based, as well as their use as conductors on ceramic circuit boards |
| 04/12/2007 | DE102006045127A1 Verfahren zum Herstellen einer hochdichten Leiterplatte A method for producing a high-density circuit board |
| 04/12/2007 | DE102005048921A1 Verfahren zum Verbinden zweier Körper, sowie Baugruppe A method for connecting two bodies, as well as assembly |
| 04/12/2007 | DE102004041173B4 Lötaufbau zwischen einem Streifen einer Stromschiene und einem bedruckten Substrat Lötaufbau between a strip of a bus bar and a printed substrate |
| 04/11/2007 | EP1773105A2 Multilayer printed circuit board |
| 04/11/2007 | EP1772878A1 Method for manufacturing electronic component, parent board and electronic component |
| 04/11/2007 | EP1772768A2 Electronically addressable microencapsulated ink and display thereof |
| 04/11/2007 | EP1772212A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
| 04/11/2007 | EP1771878A1 Capping of metal interconnects in integrated circuit electronic devices |
| 04/11/2007 | EP1771815A1 Method to manufacture an electrical bridge for an rfid antenna |
| 04/11/2007 | EP1771302A1 Apparatus for and method of manufacturing photosensitive laminated body |
| 04/11/2007 | EP1687381B1 Formation of self-assembled monolayers |
| 04/11/2007 | EP1377984B1 Conductive paste, article produced therewith with a conductive coating on glass, ceramics or enameled steel and method for the production thereof |
| 04/11/2007 | EP1212927B1 A printed circuit board assembly |
| 04/11/2007 | EP1200533B1 Method of producing a laminated structure |
| 04/11/2007 | EP1053507B1 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 04/11/2007 | EP0720232B1 Multi-chip module |
| 04/11/2007 | CN2888796Y Vacuum plate-folding device |
| 04/11/2007 | CN2888794Y Fixture for auxiliary circuit board |
| 04/11/2007 | CN1947480A Packaging method of electronic component |
| 04/11/2007 | CN1947479A Method and apparatus for accurately applying structures to a substrate |
| 04/11/2007 | CN1947478A Circuit board, circuit board manufacturing method and display apparatus provided with circuit board |
| 04/11/2007 | CN1947477A Fusion bonded assembly with attached leads |
| 04/11/2007 | CN1947475A Printed wiring board assembled panel, unit sheet for mounting printed wiring board, rigid-flexible board and method for manufacturing them |
| 04/11/2007 | CN1947462A Variable watt density layered heater |
| 04/11/2007 | CN1947238A Process for forming a solder mask, apparatus thereof and process for forming electric-curcuit patterned internal dielectric layer |
| 04/11/2007 | CN1947153A Systems and methods for detecting defects in printed solder paste |
| 04/11/2007 | CN1946880A Selective catalytic activation of non-conductive substrates |
| 04/11/2007 | CN1946877A Etching method and etchant |
| 04/11/2007 | CN1946510A Solder and mounted article using same |
| 04/11/2007 | CN1946280A Tape feeder for component mounter and method for mounting a component with component mounter |
| 04/11/2007 | CN1946271A Printed circuit board and manufacturing method thereof |
| 04/11/2007 | CN1946270A Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor |
| 04/11/2007 | CN1946269A Soldering apparatus |
| 04/11/2007 | CN1946268A Through hole welding technology for mobile phone camera module image sensor |
| 04/11/2007 | CN1946267A Embedding method for printed circuit board and printed circuit board |
| 04/11/2007 | CN1946266A Method of manufacturing a printed circuit board |
| 04/11/2007 | CN1946265A Process for producing wiring circuit board |
| 04/11/2007 | CN1946264A Substrate for flexible wiring and method for producing the same |
| 04/11/2007 | CN1945957A Method of manufacturing circuit board, and brushless DC motor using the circuit board |
| 04/11/2007 | CN1945802A Method, circuit board and tool for improving welding spot reliability of ball grating array package device |
| 04/11/2007 | CN1945434A Photohardenable and thermosetting resin compositions, their hardened product, and printing circuit boards using the same |
| 04/11/2007 | CN1945430A Photosensitive resin composition and photosensitive resin laminate using the same |
| 04/11/2007 | CN1945429A Photosensitive resin composition and photosensitive resin laminate using the same |
| 04/11/2007 | CN1945428A Photosensitive resin composition and photosensitive resin laminate using the same |
| 04/11/2007 | CN1944717A Negative pressure electroplating method for PCB |
| 04/11/2007 | CN1310578C Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |