Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2007
01/25/2007DE102005039619B3 Plug connector with at least three rows of contacts esp. for connection to circuit boards
01/25/2007DE102005034535A1 Circuit plate for an electronic automobile controller has fuse plugs inserted into the tracks that melt to prevent overload
01/25/2007DE102004045719B4 Gedruckte-Schaltungsplatine-Testzugangspunktstrukturen und Verfahren zum Herstellen derselben Printed circuit board test access point structures and method of making same
01/24/2007EP1746871A1 Method of manufacturing multilayer printed wiring board
01/24/2007EP1746870A2 Connecting element and circuit connecting device using the connecting element
01/24/2007EP1746869A1 Methods for embedding conducting material and devices resulting from said methods
01/24/2007EP1746867A1 Connector employing flexible printed board
01/24/2007EP1746866A1 Packaging chip having inductor therein
01/24/2007EP1745684A1 Method for production of electronic circuit board
01/24/2007EP1745240A1 Multipurpose spacer support for maintaining and positioning complexly shaped parts
01/24/2007EP1665887A4 Warming apparatus with heater produced by pcb
01/24/2007EP1614329B1 Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device
01/24/2007EP1403228B1 Ceramic component and production method therefor
01/24/2007EP1393605B1 Circuit board with at least one electronic component
01/24/2007EP1230107B1 Control device for a motor vehicle
01/24/2007EP1143776B1 Printed-circuit board and method of manufacture thereof
01/24/2007EP1083779B1 Printed circuit board and method of production thereof
01/24/2007EP0941644B1 Electronic circuit with a screening case to attenuate high-frequency interference
01/24/2007CN2862593Y Terminal bench assembling apparatus
01/24/2007CN2862591Y Soft circuit board without any glue
01/24/2007CN1902994A Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter
01/24/2007CN1902991A Method and device for reflow soldering with volume flow control
01/24/2007CN1902990A Electromagnetically shielded slot transmission line
01/24/2007CN1902989A Printable electromechanical input means and an electronic device including such input means
01/24/2007CN1902784A Electrical connector
01/24/2007CN1902755A Electrical connection of components
01/24/2007CN1902703A Base material for hdd suspension
01/24/2007CN1902547A Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed wiring board
01/24/2007CN1902482A Surface acoustic wave sensor assemblies
01/24/2007CN1902338A Surface reactive preservative for use with solder preforms
01/24/2007CN1902051A A frame unit for tensioning a printing screen and a jig for fitting a printing screen to or removing a printing screen from a frame unit
01/24/2007CN1902043A Method for producing flexible laminate
01/24/2007CN1902021A Reflow furnace and hot-air blowing-type heater
01/24/2007CN1901794A Solder joint determination method, solder inspection method, and solder inspection device
01/24/2007CN1901783A Multilayer printed wiring board fabrication method and multilayer printed wiring board
01/24/2007CN1901782A Circuit base board with through hole circuit and its producing method
01/24/2007CN1901781A Ball planting method and device for applying said method
01/24/2007CN1901780A Board cleaning apparatus and board transporting apparatus
01/24/2007CN1901779A Package substrate and electronic component packaging method
01/24/2007CN1901183A Substrate, smart card modules and methods for fabricating the same
01/24/2007CN1901182A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
01/24/2007CN1901181A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
01/24/2007CN1901180A Package substrate
01/24/2007CN1901177A Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
01/24/2007CN1901157A Forming method for film pattern, device, electro-optical apparatus, electronic apparatus, and manufacturing method for active matrix substrate
01/24/2007CN1900829A Method for removing photoresist, etch and/or polymeric residues or contaminants from semiconductor substrates
01/24/2007CN1900725A Lithographic contact elements
01/24/2007CN1900377A Electrolytic copper plating bath and plating process therewith
01/24/2007CN1900157A Flexible printed circuit coating film and its preparing method
01/24/2007CN1899809A Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer
01/24/2007CN1899750A Solder metal, soldering flux and solder paste
01/24/2007CN1899740A Tin soldering device and method
01/24/2007CN1297045C Optical device and optical head apparatus mounting method
01/24/2007CN1296993C Semiconductor device and liquid crystal module using the same, and method for producing liquid crystal module
01/24/2007CN1296720C Printed circuit board with integrated two-axis fulxgate sensor and its making method
01/24/2007CN1296189C Stamping device for printing circuit substrate
01/24/2007CN1296164C Cleaning apparatus and method for reflux welding oven
01/23/2007US7168058 Printed circuit wiring board designing support device, printed circuit board designing method, and its program
01/23/2007US7167608 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical interconnects and manufacturing methods thereof
01/23/2007US7167379 Micro-spring interconnect systems for low impedance high power applications
01/23/2007US7167378 Circuit board transmitting high frequency signal
01/23/2007US7167377 Circuit-constituting unit and method of producing the same
01/23/2007US7167376 Multilayer wiring board, method of mounting components, and image pick-up device
01/23/2007US7167375 Populated printed wiring board and method of manufacture
01/23/2007US7167344 Magnetic head actuator having finely movable tracking device
01/23/2007US7167014 Method for testing using a universal wafer carrier for wafer level die burn-in
01/23/2007US7167013 Suction cap for IC sockets and IC socket assembly using same
01/23/2007US7167012 Universal wafer carrier for wafer level die burn-in
01/23/2007US7166925 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
01/23/2007US7166914 Semiconductor package with heat sink
01/23/2007US7166909 Method and apparatus for molding module electronic devices and a module electronic device molded thereby
01/23/2007US7166906 Package with barrier wall and method for manufacturing the same
01/23/2007US7166529 Method of connecting wiring member
01/23/2007US7166361 Multilayer lamination printed circuit containing metal foils
01/23/2007US7166252 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
01/23/2007US7166180 Method of vacuum-laminating adhesive film
01/23/2007US7165857 Interactive LED display device
01/23/2007US7165323 Method of manufacturing a touch screen
01/23/2007US7165322 Process of forming socket contacts
01/23/2007US7165321 Method for manufacturing printed wiring board with embedded electric device
01/23/2007US7165318 Components placing apparatus
01/18/2007WO2007008369A1 Tin electrodeposits having properties or characteristics that minimize tin whisker growth
01/18/2007WO2007008169A1 Electronic device and method for its manufacture
01/18/2007WO2007007865A1 Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
01/18/2007WO2007007861A1 Multilayer printed wiring board
01/18/2007WO2007007857A1 Multilayer printed wiring board
01/18/2007WO2007007451A1 Multilayer wiring board and fabrication method thereof
01/18/2007WO2007007450A1 Interconnecting board and three-dimensional wiring structure using it
01/18/2007WO2007007393A1 Etching device and etching method
01/18/2007WO2007006633A1 Use of heat-activated adhesive for manufacture and a device so manufactured
01/18/2007WO2007006598A1 Method for soldering a printed circuit board with the aid of a lead-free soldering paste in a reflow soldering furnace, a printed circuit board for carrying out said method and a reflow soldering furnace
01/18/2007WO2005118213A3 Solder paste and process
01/18/2007US20070015872 Thermosetting resin composition and multilayer printed wiring board using the same
01/18/2007US20070015378 Flexible printed circuit board
01/18/2007US20070015349 Method of producing a composite multilayer
01/18/2007US20070015309 Electronic part manufacturing method
01/18/2007US20070014975 Method of manufacturing wiring substrate, and wiring substrate
01/18/2007US20070014974 Method and system for creating fine lines using ink jet technology
01/18/2007US20070014944 Multi-layer sheet
01/18/2007US20070014092 Resin-packaged protection circuit module for rechargeable batteries and method of making the same