| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/24/2007 | US7208842 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof |
| 04/24/2007 | US7208839 Semiconductor component assemblies having interconnects |
| 04/24/2007 | US7208568 photocurable and thermosetting resin composition derived from the reaction of a multifunctional oxetane compound, an acrylic acid, where the hydroxy group of the subsequent acrylate ester is reacted with an acid anhydride to form carboxyl groups; storage stability; use with printed circuits |
| 04/24/2007 | US7208410 Methods relating to forming interconnects |
| 04/24/2007 | US7208349 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 04/24/2007 | US7208348 Methods of fabricating a via-in-pad with off-center geometry |
| 04/24/2007 | US7208341 Method for manufacturing printed circuit board |
| 04/24/2007 | US7208193 Producing a mixture of a metal powder having a flake morphology and gas;accelerating mixture in a subsonic carrier gas jet through a straight-bore tube; directing the subsonic carrier gas jet onto the substrate; manipulating one of the subsonic carrier gas jet and the substrate for forming conductor |
| 04/24/2007 | US7208105 Mixture of electroconductive particles and polymer |
| 04/24/2007 | US7208062 Method of producing multilayer printed wiring board |
| 04/24/2007 | US7207653 Ink-jet head unit |
| 04/24/2007 | US7207107 Method and device for through-hole plating of substrates and printed circuit boards |
| 04/24/2007 | US7207105 Method for producing an integral ceramic circuit board |
| 04/19/2007 | WO2007043884A2 Method and device for laser cutting at an acute angle of carriers for electronic components |
| 04/19/2007 | WO2007043714A1 Multilayer printed wiring board and method for manufacturing same |
| 04/19/2007 | WO2007043683A1 Printed wiring board |
| 04/19/2007 | WO2007043682A1 Method for producing high dielectric sheet |
| 04/19/2007 | WO2007043670A1 Process for producing metal wiring board |
| 04/19/2007 | WO2007043666A1 Process for producing polyimide film with copper wiring |
| 04/19/2007 | WO2007043639A1 Printed wiring board and method for manufacturing printed wiring board |
| 04/19/2007 | WO2007043544A1 Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition prepared therefrom |
| 04/19/2007 | WO2007043438A1 Multilayer printed wiring board and method for producing same |
| 04/19/2007 | WO2007043411A1 Digital exposure apparatus |
| 04/19/2007 | WO2007043380A1 Catalyst treatment method, electroless plating method, and method for formation of circuit by using the electroless plating method |
| 04/19/2007 | WO2007043254A1 Bonding apparatus |
| 04/19/2007 | WO2007043165A1 Multilayer wiring board and process for producing the same |
| 04/19/2007 | WO2007043107A1 Board structure and package component |
| 04/19/2007 | WO2007042068A1 Method to manufacture a printed circuit partially protected by an insulating layer |
| 04/19/2007 | WO2007027242A3 Electroluminescent panel with inkjet-printed electrode regions |
| 04/19/2007 | WO2007016323A3 Forming conductive strips with loop-engageable touch fasteners |
| 04/19/2007 | WO2006123834A3 Graft pattern forming method and conductive pattern forming method |
| 04/19/2007 | WO2006114267A3 Electronic component and electronic configuration |
| 04/19/2007 | WO2006094755A8 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit |
| 04/19/2007 | WO2006047220A3 Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board |
| 04/19/2007 | WO2005112113A3 Mounting with auxiliary bumps |
| 04/19/2007 | US20070089113 Circuit substrate production method and system, substrate used therein, and circuit substrate using the same |
| 04/19/2007 | US20070087588 Interposer with electrical contact button and method |
| 04/19/2007 | US20070087175 Wired circuit board |
| 04/19/2007 | US20070087122 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 04/19/2007 | US20070086189 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070086188 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070086187 LED Assembly with Vented Circuit Board |
| 04/19/2007 | US20070085636 Waveguide coupler |
| 04/19/2007 | US20070085635 Waveguide coupler |
| 04/19/2007 | US20070085495 Vibrator and protable terminal device mounted with the vibrator |
| 04/19/2007 | US20070085212 Dielectric composite material |
| 04/19/2007 | US20070085203 Multilayer printed wiring board |
| 04/19/2007 | US20070085194 Dielectric composite material |
| 04/19/2007 | US20070085178 Conductor substrate, semiconductor device and production method thereof |
| 04/19/2007 | US20070085108 Liquid crystalline polymer and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications |
| 04/19/2007 | US20070084904 Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment |
| 04/19/2007 | US20070084630 Coreless substrate and manufacturing method thereof |
| 04/19/2007 | DE4334715B4 Verfahren zur Montage von mit elektrischen Anschlüssen versehenen Bauteilen Method for mounting of components provided with electrical terminals |
| 04/19/2007 | DE102006044380A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity |
| 04/19/2007 | DE102006042688A1 Starr-Flexible gedruckte Leiterplatte für gehäuseweise Übereinanderstapelung und Herstellungsverfahren Rigid-Flexible printed circuit board for housing as stacking of and manufacturing processes |
| 04/19/2007 | DE102006038987A1 Bildwandlermodul, Verfahren zur Herstellung eines solchen und Kameramodul zum Betieb eines solchen Image converter module, and method for producing such a camera module for con- sumption During operation of such a |
| 04/19/2007 | DE102005048492A1 Elektrisches oder elektronisches Modul Electrical or electronic module |
| 04/19/2007 | DE102005037950B3 Simplified construction of microwave circuits in LTCC technology with fewer through holes |
| 04/19/2007 | DE10133791B4 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component |
| 04/19/2007 | DE10103807B4 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture |
| 04/18/2007 | EP1776004A1 Method and device for mounting solder ball |
| 04/18/2007 | EP1776003A2 Component support with conductor structure |
| 04/18/2007 | EP1776002A1 Hybrid electronic component and method for manufacturing the same |
| 04/18/2007 | EP1776001A2 Printed wiring board and manufacturing method therefor |
| 04/18/2007 | EP1775761A1 Through substrate and interposer, and method for manufacturing through substrate |
| 04/18/2007 | EP1775734A2 Electrically conductive composition, electrically conductive coating and electrically conductive coating formation method |
| 04/18/2007 | EP1775320A1 Poly-4-methyl-1-pentene resin composition, film, and mold for producing electronic component sealing body |
| 04/18/2007 | EP1775053A2 Apparatus for generating a negatively charged ionic reducing gas |
| 04/18/2007 | EP1775052A2 Apparatus for generating a negatively charged ionic reducing gas |
| 04/18/2007 | EP1774841A1 Method for the production of a metal-ceramic substrate |
| 04/18/2007 | EP1774840A2 Jet printing of patterned metal |
| 04/18/2007 | EP1774584A2 Method for the production of an electric component and component |
| 04/18/2007 | EP1773532A2 Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
| 04/18/2007 | EP1543558A4 Radio frequency identificaton device and method |
| 04/18/2007 | EP1483722B1 Memory module assembly using partially defective chips |
| 04/18/2007 | EP1468042B1 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects |
| 04/18/2007 | EP1444055A4 Tape compositions for the deposition of electronic features |
| 04/18/2007 | EP1247343B1 A slanted connector |
| 04/18/2007 | EP1189725B1 A control method for copper content in a solder dipping bath |
| 04/18/2007 | EP1112803B1 Use of a solder material and process for manufacturing an electric or electronic device |
| 04/18/2007 | CN2891612Y Electronic component pin adjusting device |
| 04/18/2007 | CN2891587Y Soft circuit board overlay film press |
| 04/18/2007 | CN2891586Y Full-automatic bushing patch wire shaping machine |
| 04/18/2007 | CN2891584Y Fastener |
| 04/18/2007 | CN2889981Y Tilt type paper-clip retractable board machine |
| 04/18/2007 | CN2889298Y Heat conduction device of electric incense burner |
| 04/18/2007 | CN1951162A Component placement substrate and production method thereof |
| 04/18/2007 | CN1951160A Method for the production of circuit boards and/or corresponding constructs |
| 04/18/2007 | CN1950837A Polymeric film substrate for use in radio-frequency responsive tags |
| 04/18/2007 | CN1950750A Pattern forming material, pattern forming apparatus and pattern forming method |
| 04/18/2007 | CN1949954A Method for making metal wire |
| 04/18/2007 | CN1949953A Wiring method for printed circuitboard and printed circuitboard |
| 04/18/2007 | CN1949952A Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
| 04/18/2007 | CN1949500A Wiring board, semiconductor device, and method for manufacturing the same |
| 04/18/2007 | CN1949469A Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor |
| 04/18/2007 | CN1949421A Method of manufacturing thin flim capacitor and printed circuit board embedded capacitor |
| 04/18/2007 | CN1949420A Method of producing ceramic laminates, laminate electronic components and manufacturing method thereof |
| 04/18/2007 | CN1948004A Sticking device and method of sheet style thin film |
| 04/18/2007 | CN1311723C Holding/convey jig and holding/convey method |
| 04/18/2007 | CN1311722C Method for producing components for electronic devices |