Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2007
04/04/2007CN1942055A Auxiliary designing system and method for circuit board
04/04/2007CN1942054A Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus
04/04/2007CN1942050A Coated radiating circuit board and its production
04/04/2007CN1942049A Circuit board and method of manufacturing circuit board
04/04/2007CN1942048A Circuit board with verified laminated layer sequence
04/04/2007CN1942047A Printed wiring board and fabrication method for printed wiring board
04/04/2007CN1942046A Alternating micro-vias and through-hole in order to create improved PCB routing channels
04/04/2007CN1942042A Protecting component of electronic circuit
04/04/2007CN1941361A Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
04/04/2007CN1941352A Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
04/04/2007CN1941339A Semiconductor IC-embedded substrate and method for manufacturing same
04/04/2007CN1941240A Interposer with electrical contact button and manufacturing method thereof
04/04/2007CN1940675A Liquid crystal display device
04/04/2007CN1940382A Fluorescent lamp container as ready for use
04/04/2007CN1940145A Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
04/04/2007CN1939718A Mounting structure of transverse leak-proof and silk screen printing device
04/04/2007CN1939717A 丝网印刷装置 Screen printing apparatus
04/04/2007CN1939716A Silk screen printing device and printing system comprising same
04/04/2007CN1939644A Laser machining method and laser machining apparatus
04/04/2007CN1309288C Package assembly of electronic apparatus and assembling method thereof
04/04/2007CN1309285C High frequency circuit block member, its manufacturing method, high refrequency module device and its manufacturing method
04/04/2007CN1309284C Electric circuit base board assembling body
04/04/2007CN1309283C Manufacturing method of circuit device
04/04/2007CN1309282C Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit
04/04/2007CN1309281C Circuit board and method for manufacturing the same
04/04/2007CN1309271C Electronic component and mobile communicating device using the same
04/04/2007CN1309073C High-density chip carrier and its constituent method
04/04/2007CN1309038C High density area array solder microjoining interconnect structure and fabrication method
04/04/2007CN1308978C Method for making ceramic laminate product, laminate electronic element and making method
04/04/2007CN1308975C Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
04/04/2007CN1308963C Conductive particle and adhesive agent
04/04/2007CN1308158C Pedalling force testing device
04/04/2007CN1308141C Method for controlling screen printer
04/04/2007CN1308113C Method and apparatus of ablating an opening in a hard, non-metallic substrate
04/03/2007US7200009 Integrated electromechanical arrangement and method of production
04/03/2007US7199478 Printed circuit board having an improved land structure
04/03/2007US7199475 Protective ceramic metal hydride coatings on copper circuits for soldering without fluxing; bond wires to copper circuits; electronic package; metal hydride layer was formed by reducing with hydrogen
04/03/2007US7199468 Hybrid integrated circuit device with high melting point brazing material
04/03/2007US7199457 Thin film circuit board device and its manufacturing method
04/03/2007US7199440 Techniques for joining an opto-electronic module to a semiconductor package
04/03/2007US7199342 Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
04/03/2007US7199329 Method of soldering semiconductor part and mounted structure of semiconductor part
04/03/2007US7199309 Structure for repairing or modifying surface connections on circuit boards
04/03/2007US7199308 Multi-layered printed wiring board
04/03/2007US7199306 Multi-strand substrate for ball-grid array assemblies and method
04/03/2007US7199033 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
04/03/2007US7198996 Component built-in module and method for producing the same
04/03/2007US7198989 Method of producing a COF flexible printed wiring board
04/03/2007US7198986 Electronic parts built-in substrate and method of manufacturing the same
04/03/2007US7198984 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
04/03/2007US7198983 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls
04/03/2007US7198884 Heat stable photocurable resin composition for dry film resist
04/03/2007US7198816 dispersoid convects within the dispersion medium toward the edges of the dispersion to form narrow lines of the dispersoid without using photolithography
04/03/2007US7198735 Homogenizing electroconductive fibers, powders and/or mixtures in polymers, and molding into construction materials
04/03/2007US7198662 Aqueous solution containing sulfonate compound
04/03/2007US7198438 Drilling system with stationary work table
04/03/2007US7197820 Circuit board and its manufacturing method
04/03/2007US7197819 Method of assembling an electric power
04/03/2007US7197818 Method and structures for implementing customizable dielectric printed circuit card traces
04/03/2007US7197817 Method for forming contact bumps for circuit board
04/03/2007US7197800 Method of making a high impedance surface
04/03/2007CA2142178C Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method
03/2007
03/29/2007WO2007035880A2 Method and apparatus for forming device features in an integrated electroless deposition system
03/29/2007WO2007034893A1 Pasty metal particle composition, method of hardening pasty metal particle composition, method of bonding metal member, process for producing printed wiring board
03/29/2007WO2007034833A1 Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
03/29/2007WO2007034801A1 Flexible printed wiring board and method for manufacturing same
03/29/2007WO2007034629A1 Production method for component built-in module and component built-in module
03/29/2007WO2007034626A1 Packaging method of electronic component module, method for manufacturing electronic apparatus using it, and electronic component module
03/29/2007WO2007034610A1 Photosensitive resin composition, photosensitive element, method of forming resist pattern, process for producing printed wiring board, and method of forming partition wall for plasma display
03/29/2007WO2007033882A1 Printing template of an smt process and method of coating it
03/29/2007WO2007015938A3 Method for patterning an underbump metallizattion layer using a dry etc process
03/29/2007WO2007005516A3 Connector-to-pad pcb translator for a tester and method of fabricatio
03/29/2007WO2006088262A3 Image-drawing method, image-drawing device, image-drawing system, and correction method
03/29/2007WO2005116976A3 Force sensing pointing device with click function
03/29/2007US20070072454 Connector chip and manufacturing method thereof
03/29/2007US20070071910 Organic insulating film having controlled molecular orientation, and adhesive film, flexible metal-clad laminate, multilayer flexible metal-clad laminate, coverlay film, tab tape, and COF base tape including the organic insulating film
03/29/2007US20070071888 Method and apparatus for forming device features in an integrated electroless deposition system
03/29/2007US20070071886 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
03/29/2007US20070069744 Board for probe card, inspection apparatus, photo-fabrication apparatus and photo-fabrication method
03/29/2007US20070069379 Lead-free solder ball
03/29/2007US20070069355 Package with barrier wall and method for manufacturing the same
03/29/2007US20070068996 Continuous mode solder jet apparatus
03/29/2007US20070068622 Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film
03/29/2007US20070068035 Dry Cabinets for Use in Moisture Sensitive Device Management in Electronics Manufacturing
03/29/2007US20070067987 Printed circuit board with improved cooling of electrical component
03/29/2007DE112005000245T5 Schaltkreismodul Circuit module
03/29/2007DE102006037273A1 Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte Flattened resin-coated printed circuit board
03/29/2007DE102005044769A1 Process to assemble semiconductor on substrate by bonding within gas evacuated environment prior to soldering
03/29/2007DE10148550B4 Verfahren zum Herstellen von Metall-Keramik-Verbundmaterialien, insbesondere Metall-Keramik-Substraten A method for producing metal-ceramic composite materials, in particular metal-ceramic substrates
03/29/2007CA2622984A1 Combined fastening and contacting system for electrical components on superimposed circuit boards
03/28/2007EP1768474A1 Printed circuit board and manufacturing method thereof
03/28/2007EP1768473A1 Multilayer wiring board and method for manufacturing the same
03/28/2007EP1768470A1 Flex-rigid wiring board and manufacturing method thereof
03/28/2007EP1768215A2 Plasma Display Device
03/28/2007EP1767989A1 Method of forming graft pattern, graft pattern material, method of lithography, method of forming conductive pattern, conductive pattern, process for producing color filter, color filter and process for producing microlens
03/28/2007EP1767672A1 Tin-based plating film and method for forming the same
03/28/2007EP1767304A1 Brazing machine and process under protective gas with altitude difference between the entrance and/or the exit and an inner part of the brazing machine tunnel
03/28/2007EP1767074A1 Method for applying a material onto a substrate using a droplet printing technique
03/28/2007EP1766726A1 Flexible ring interconnection system
03/28/2007EP1766675A1 Method of manufacture of electronic or functional devices