| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/02/2007 | CN1956628A Method for manufacturing rigid-flexible printed circuit board |
| 05/02/2007 | CN1956627A Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus |
| 05/02/2007 | CN1956625A 印刷电路板 A printed circuit board |
| 05/02/2007 | CN1956624A Rigid-flexible printed circuit board and method for manufacturing the same |
| 05/02/2007 | CN1956623A Two-layer flexible printed wiring board and method for manufacturing the same |
| 05/02/2007 | CN1956620A Paste composition and printing circuit substrate for forming dielectric layer, and a method for forming a dielectric layer of plasma display panel |
| 05/02/2007 | CN1955734A Measuring method and compensating method for expansion-contract coefficient in winding copper coated plate manufacturing process |
| 05/02/2007 | CN1314302C Laser processing method, laser welding method and laser processor |
| 05/02/2007 | CN1314167C Low profile connector |
| 05/02/2007 | CN1314109C Multilayer chip carrier and substrate thereof, deallocation method for expanding signal panel weldering plate on chip carrier |
| 05/02/2007 | CN1314095C Substrate for mounting semiconductor chip thereon using ultrasonic welding |
| 05/02/2007 | CN1313966C IC card producing method |
| 05/02/2007 | CN1313883C Printed circuit board |
| 05/02/2007 | CN1313242C Thermal-setting welding paste |
| 05/02/2007 | CN1313239C System and method of laser drilling using a continuously optimized depth of focus |
| 05/01/2007 | US7212698 Circuit board integrated optical coupling elements |
| 05/01/2007 | US7212413 Electronic device with flexible printed circuit board structure |
| 05/01/2007 | US7211951 Connection structure and method of plasma display panel |
| 05/01/2007 | US7211899 Circuit substrate and method for fabricating the same |
| 05/01/2007 | US7211892 Semiconductor device having a particular electrode structure |
| 05/01/2007 | US7211888 Encapsulation of pin solder for maintaining accuracy in pin position |
| 05/01/2007 | US7211830 Circuit interconnect for optoelectronic device |
| 05/01/2007 | US7211738 Bonding pad structure for a display device and fabrication method thereof |
| 05/01/2007 | US7211737 Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |
| 05/01/2007 | US7211735 Processes for manufacturing multilayer flexible wiring boards |
| 05/01/2007 | US7211289 Conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers, holes may be filled, e.g., with metal plating, or conductive or non-conductive paste, In the case of the latter, it providing a top covering conductive layer |
| 05/01/2007 | US7211207 Injection molding method with surface modification |
| 05/01/2007 | US7211204 An aqueous dispersion of graphite, a monosaccharide and/or a polysaccharide binding agent, and a corrosion inhibitor such as benzotriazole to reduce dissolution of metal from a metallic surface |
| 05/01/2007 | US7211135 Shelf-life, results in a written or printed image having an excellent gold-metallic sheen, can especially be used also in inkjet printers |
| 05/01/2007 | US7211103 Biocompatible bonding method and electronics package suitable for implantation |
| 05/01/2007 | US7210942 Connection structure for printed wiring board |
| 05/01/2007 | US7210833 Method of fixing a power light-emitting diode on a radiator, and a signalling device comprising such a diode |
| 05/01/2007 | US7210224 Method for forming an antifuse |
| 05/01/2007 | US7210223 Method of manufacturing a microcoil construction |
| 05/01/2007 | US7210222 Power supply control method |
| 04/26/2007 | WO2007046776A1 Capacitor interconnection |
| 04/26/2007 | WO2007046694A1 Method for preparing a conductive feature on a substrate |
| 04/26/2007 | WO2007046459A1 Multilayer printed wiring board and its manufacturing method |
| 04/26/2007 | WO2007046271A1 Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| 04/26/2007 | WO2007046190A1 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices |
| 04/26/2007 | WO2007046189A1 Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices |
| 04/26/2007 | WO2007046143A1 Method for patterning and apparatus for patterning |
| 04/26/2007 | WO2007046045A2 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| 04/26/2007 | WO2007002269A3 Process of producing printed wiring board |
| 04/26/2007 | WO2005118213A8 Solder paste and process |
| 04/26/2007 | WO2005048303A3 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 04/26/2007 | US20070093620 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 04/26/2007 | US20070093082 Via providing multiple electrically conductive paths |
| 04/26/2007 | US20070092698 Conductive core materials form projections on the outer surface of a base particle, which is covered by a film of a different a conductive material; enhanced conduction reliability; low connection resistance |
| 04/26/2007 | US20070092638 Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method |
| 04/26/2007 | US20070091572 Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and least one intermediate layer located between the heat source and the heat sink |
| 04/26/2007 | US20070090855 Method and apparatus for testing bumped die |
| 04/26/2007 | US20070090164 System and Methods for Data-Driven Control of Manufacturing Processes |
| 04/26/2007 | US20070089993 Electrochemical printer head for use in electrolytically depositing material onto substrate, the printing head comprising a plurality of electrodes, a lead connector, an electric power source, and a high electrical resistance means for controlling distribution of electrolyte to electrode channels |
| 04/26/2007 | US20070089565 reducing ions of a metal by precipitation with a reducing agent in a liquid-phase reaction system so that the metal is precipitated as metal powder particles; reducing agent is a reducing saccharide or a glycitol |
| 04/26/2007 | US20070089291 Electronic part mounting substrate and method for producing same |
| 04/26/2007 | US20070089290 Method of making a printed circuit board with low cross-talk noise |
| 04/26/2007 | DE4436523B4 Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung A method of manufacturing an electronic device, and rotational speed sensor with an electronic circuit |
| 04/26/2007 | DE10243637B4 Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten Circuit board with at least one rigid and at least one flexible portion and method for the production of rigid-flexible PCB |
| 04/26/2007 | DE102005050830A1 Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB |
| 04/26/2007 | DE102005050796A1 SMD reflow flat plug e.g. for soldering, has plug surface area with free end, at which pin sheath is attached |
| 04/26/2007 | CA2626240A1 Method for preparing a conductive feature on a substrate |
| 04/25/2007 | EP1778000A2 Multilayer printed wiring board |
| 04/25/2007 | EP1777999A1 Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component |
| 04/25/2007 | EP1777738A1 Component mounting method and component mounting apparatus |
| 04/25/2007 | EP1777581A2 Fabrication of a wiring pattern and of an active matrix substrate |
| 04/25/2007 | EP1777194A2 Method for forming microelectronic spring structures on a substrate |
| 04/25/2007 | EP1777066A1 A laminated electrically conductive polymer structure |
| 04/25/2007 | EP1776850A1 Solderless component packaging and mounting |
| 04/25/2007 | EP1776739A2 Laser ablation resistant copper foil |
| 04/25/2007 | EP1723836A4 A radio frequency circuit board topology |
| 04/25/2007 | EP1386356B1 Fluxless flip chip interconnection |
| 04/25/2007 | EP1358675B1 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
| 04/25/2007 | CN2894202Y Depth controller for circuit board forming machine |
| 04/25/2007 | CN2892302Y Atuo-filtering washer of wave soldering spraying system |
| 04/25/2007 | CN1954651A Circuit board and electronic apparatus employing it |
| 04/25/2007 | CN1954650A Mounter device, part cartridge for the device, and method of holding and carrying substrate |
| 04/25/2007 | CN1954649A Screen printing apparatus and screen printing method |
| 04/25/2007 | CN1954648A Transport device |
| 04/25/2007 | CN1954393A Insulated conductive particles and anisotropic conductive adhesive film containing the particles |
| 04/25/2007 | CN1953868A Chromium-free antitarnish adhesion promoting treatment composition |
| 04/25/2007 | CN1953644A Method for producing a multilayer printed wiring board |
| 04/25/2007 | CN1953643A Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid |
| 04/25/2007 | CN1953640A A glueless soft circuit substrate |
| 04/25/2007 | CN1953169A Power core devices and methods of making thereof |
| 04/25/2007 | CN1953151A Underlay embedded passive device |
| 04/25/2007 | CN1953150A Method of making a circuitized substrate having a plurality of solder connection sites thereon |
| 04/25/2007 | CN1952218A Process for obtaining coating with different surface roughness |
| 04/25/2007 | CN1951692A Screen printing device and method |
| 04/25/2007 | CN1951581A Cleaning device |
| 04/25/2007 | CN1312966C Method for mutually connecting multolayer printed circuit board |
| 04/25/2007 | CN1312965C Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith |
| 04/25/2007 | CN1312764C Electronic component device and producing method thereof |
| 04/25/2007 | CN1312749C Multi-diameter solder ball automatic releasing device |
| 04/25/2007 | CN1312709C Method for fixing a wire on a substrate and products made thereby |
| 04/25/2007 | CN1312533C Etching method and method for mfg circuit device thereby |
| 04/25/2007 | CN1312469C Good-or-not decision device, decision programme, method and multi-variable statistical analyzing device |
| 04/25/2007 | CN1312246C Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 04/24/2007 | US7209362 Multilayer ceramic substrate with a cavity |
| 04/24/2007 | US7209361 Electronic device |