| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/09/2007 | CN1315317C Multifunctional apparatus |
| 05/09/2007 | CN1315185C Electronic device with carrier, method of manufacturing same |
| 05/09/2007 | CN1315138C Formation of thin-film capacitor |
| 05/09/2007 | CN1315007C Transfer basic board platform for exposure equipment |
| 05/09/2007 | CN1314726C Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound, copper foil coated with resin and copper-coating layer-pressing |
| 05/09/2007 | CN1314509C Pad spot welding method |
| 05/08/2007 | USRE39615 Blend of a phenolic resole and the product made by reacting a difunctional epoxide and a di- or trifunctional benzene compound, e.g., resorcinol or m-aminophenol; provides both good adhesion as measured by peel strength testing and good heat resistance as measured by solder blister testing. |
| 05/08/2007 | US7216327 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method |
| 05/08/2007 | US7215889 Compact optical transceivers for host bus adapters |
| 05/08/2007 | US7215555 Bus bar structure plate and producing method of circuit structure body by using of the same |
| 05/08/2007 | US7215235 Conductive substrate with resistance layer, resistance board, and resistance circuit board |
| 05/08/2007 | US7215022 Multi-die module |
| 05/08/2007 | US7215021 Electronic device |
| 05/08/2007 | US7214962 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 05/08/2007 | US7214889 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 05/08/2007 | US7214887 Electronic circuit connecting structure, and its connecting method |
| 05/08/2007 | US7214886 High performance chip carrier substrate |
| 05/08/2007 | US7214625 Method for manufacturing movable portion of semiconductor device |
| 05/08/2007 | US7214617 Method of forming thin film pattern, method of manufacturing device, electro-optical apparatus and electronic apparatus |
| 05/08/2007 | US7214419 Conductive paste multilayered board including the conductive paste and process for producing the same |
| 05/08/2007 | US7214305 forming concave zone in substrate surface; forming an electroconductive seed layer; electrolytic plating |
| 05/08/2007 | US7214304 Process for preparing a non-conductive substrate for electroplating |
| 05/08/2007 | US7213741 Lead wire bonding method |
| 05/08/2007 | US7213740 Optical structures including liquid bumps and related methods |
| 05/08/2007 | US7213739 Underfill fluxing curative |
| 05/08/2007 | US7213336 Hyperbga buildup laminate |
| 05/08/2007 | US7213335 Method for manufacturing printed circuit boards |
| 05/08/2007 | US7213334 Method for manufacturing double-sided flexible printed board |
| 05/08/2007 | US7213333 Method for manufacturing mounting substrate and method for manufacturing circuit device |
| 05/08/2007 | US7213332 Method component on a circuit board |
| 05/08/2007 | US7213331 Method for forming stencil |
| 05/08/2007 | US7213330 Method of fabricating an electronic device |
| 05/08/2007 | US7213329 Method of forming a solder ball on a board and the board |
| 05/08/2007 | US7213327 Method for fabricating embedded thin film resistors of printed circuit board |
| 05/08/2007 | US7213323 Method of forming an electronic pressure sensitive transducer on a printed circuit board |
| 05/08/2007 | CA2358467C Methods of manufacturing voidfree resin impregnated webs |
| 05/08/2007 | CA2137076C Improved stencil or mask for applying solder to circuit boards and support frame therefor |
| 05/03/2007 | WO2007050333A2 Article comprising conductive conduit channels |
| 05/03/2007 | WO2007049640A1 Exposure method and exposure apparatus |
| 05/03/2007 | WO2007049502A1 Flexible laminate board, process for manufacture of the board, and flexible print wiring board |
| 05/03/2007 | WO2007049458A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 05/03/2007 | WO2007049325A1 A device for the high-speed drilling of boards for printed circuits and the like |
| 05/03/2007 | WO2007049324A1 A device for the high-speed drilling of boards for printed circuits and the like |
| 05/03/2007 | WO2007048559A1 Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| 05/03/2007 | WO2007048300A1 Flexible printed circuit and method for manufacturing the same |
| 05/03/2007 | WO2005117508A3 Printed wiring board with conductive constraining core including resin filled channels |
| 05/03/2007 | WO2005002299A3 Component and method for manufacturing printed circuit boards |
| 05/03/2007 | US20070099345 Method for producing through-contacts and a semiconductor component with through-contacts |
| 05/03/2007 | US20070099342 Method and Structure for an Organic Package with Improved BGA Life |
| 05/03/2007 | US20070099330 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/03/2007 | US20070099131 Silver halide emulsion including a water soluble red sensitizing trinuclear merocyanine dye and osmium complex bearing an NO or NS ligand, especially Os(NO)Cl5; optional iridium dopant (IrCl6); reducing the extent of or preventing speed gain over time; graphic arts films; manufacturing printed circuits |
| 05/03/2007 | US20070098883 Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape |
| 05/03/2007 | US20070098882 Electronic substrate, electronic circuit, and method and device for manufacturing of the same |
| 05/03/2007 | US20070097162 Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board |
| 05/03/2007 | US20070096983 Railway beacon and related production method |
| 05/03/2007 | US20070096864 Surface mount composite electronic component and method for manufacturing same |
| 05/03/2007 | US20070096271 Substrate frame |
| 05/03/2007 | US20070096065 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/03/2007 | US20070096064 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/03/2007 | US20070096063 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/03/2007 | US20070096062 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/03/2007 | US20070095566 Printed wiring board and printed circuit board using the same |
| 05/03/2007 | US20070095563 Circuit board having deformation interrupting section and circuit board forming method |
| 05/03/2007 | US20070095469 Formation of self-assembled monolayers |
| 05/03/2007 | US20070094873 System for making a conductive circuit on a substantially non-conductive substrate |
| 05/03/2007 | US20070094872 Method for mounting electronic component |
| 05/03/2007 | US20070094870 Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument |
| 05/03/2007 | DE19534165B4 Verfahren zur Bestrahlung einer Oberfläche eines Werkstücks und Einrichtung zur Bestrahlung einer Oberfläche eines Werkstücks A method for irradiating a surface of a workpiece and means for irradiating a surface of a workpiece |
| 05/03/2007 | DE112005001414T5 Verfahren zur Herstellung eines Elektronikmoduls A process for producing an electronic module |
| 05/03/2007 | DE102006050505A1 Interconnect making involves patterning protective layer to form openings to conductive layer, depositing contact pads comprising conductive material on the conductive layer, and patterning the conductive and protective layers |
| 05/03/2007 | DE102006043019A1 Gedruckte Leiterplatte mit feinem Muster und Verfahren zur Herstellung derselben Printed circuit board having fine patterns and methods for making same |
| 05/03/2007 | DE102005051807A1 Circuit board e.g. for SMD components, has unit provided with retention zone comprising neck and thickening connected to neck |
| 05/03/2007 | DE102004045451B4 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| 05/03/2007 | DE10124419B4 Schirmeinrichtung für elektrische Bauteile zum Aufsetzen auf eine Leiterplatte Screening device for electrical components to be placed on a printed circuit board |
| 05/03/2007 | DE10030468B4 Dickfilmschaltungen und Metallisierungsprozeß Thick film circuits and metalization |
| 05/02/2007 | EP1781073A2 Copper foil excellent in drilling property by laser and method for manufacturing thereof |
| 05/02/2007 | EP1780880A2 Power converter comprising a controller and a power component mounted on separate circuit boards |
| 05/02/2007 | EP1780662A1 Reinforced chipcard module and method of manufacturing the same |
| 05/02/2007 | EP1780309A1 Composition and method for improved adhesion of polymeric materials to copper or copper alloy surfaces |
| 05/02/2007 | EP1780034A1 Printing plate, printing board, and printing method for printed board |
| 05/02/2007 | EP1779222A1 Sensor product for electric field sensing |
| 05/02/2007 | EP1224339A4 Process for selective deposition of copper substrates |
| 05/02/2007 | CN2896796Y Electronic apparatus |
| 05/02/2007 | CN2896794Y Circuit-board with differential signal transmission structure |
| 05/02/2007 | CN2896793Y Circuit board arranged by non-signal through holes |
| 05/02/2007 | CN1957649A 多层印刷配线板 Multilayer printed wiring board |
| 05/02/2007 | CN1957648A Resin ejection nozzle, resin encapsulation method, and electronic part assembly |
| 05/02/2007 | CN1957451A Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
| 05/02/2007 | CN1957450A Solder bumps formation using paste retaining its shape after UV irradiation |
| 05/02/2007 | CN1957322A Interchangeable graphics card for a computing device |
| 05/02/2007 | CN1957321A Touch panel and electronic device display window protection panel using the same |
| 05/02/2007 | CN1957298A Method of forming a metal pattern on a substrate |
| 05/02/2007 | CN1956778A Method of oxidizing substance and oxidizing apparatus thereof |
| 05/02/2007 | CN1956635A Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method |
| 05/02/2007 | CN1956634A Leadless tin solder soaking process for printed circuit board |
| 05/02/2007 | CN1956633A Common rolled separation board |
| 05/02/2007 | CN1956632A Method for plating printed circuit board and printed circuit board manufactured therefrom |
| 05/02/2007 | CN1956631A Method of forming pattern, film structure, electrooptical device and electronic equipment |
| 05/02/2007 | CN1956630A Method of transplating and splicing single board of printed circuit board |
| 05/02/2007 | CN1956629A Flexible printed circuit board and its manufacturing method |