| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/19/2007 | US20070166558 Writable and printable colloidal gold solution |
| 07/19/2007 | US20070166549 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure |
| 07/19/2007 | US20070166530 Molded article, injection molding method and apparatus |
| 07/19/2007 | US20070166520 Glass material for use at high frequencies |
| 07/19/2007 | US20070165363 Potting shell |
| 07/19/2007 | US20070164450 Integrated circuit (IC) carrier assembly with suspension means |
| 07/19/2007 | US20070164433 Ball grid array package |
| 07/19/2007 | US20070164079 Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method |
| 07/19/2007 | US20070163992 Method and device for contacting semiconductor chips |
| 07/19/2007 | US20070163888 Conformable Contact Masking Methods and Apparatus Utilizing In Situ Cathodic Activation of a Substrate |
| 07/19/2007 | US20070163887 Method of manufacturing a circuit carrier and the use of the method |
| 07/19/2007 | US20070163111 Method for manufacturing a multilayer flexible wiring board |
| 07/19/2007 | DE202005021276U1 Bauteil zur Montage auf Schaltungsträgern Component for mounting on circuit boards |
| 07/19/2007 | DE19605595B4 Verfahren zum örtlich begrenzten Aufbringen einer Schicht auf ein Substrat A method of localized deposition of a layer on a substrate |
| 07/19/2007 | DE112005001965T5 Verfahren zum Verbessern einer Lötverbindungsfestigkeit eines sehr kleinen emaillierten Drahts beim SW A method for improving a soldering strength of a very small enameled wire in SW |
| 07/19/2007 | DE102006000852A1 Drahtverlegevorrichtung und Verfahren zur Verlegung eines Antennendrahtes Wire-laying apparatus and method of installing an antenna wire |
| 07/19/2007 | DE102005063282A1 Verfahren zur Herstellung von Druck-Schablonen, insbesondere für Rakeldruckverfahren, sowie Schablonenvorrichtung A process for the production of printing stencils, in particular for squeegee printing processes, and template means |
| 07/18/2007 | EP1809083A2 Multilayer printed circuit board |
| 07/18/2007 | EP1808701A1 Test contact system |
| 07/18/2007 | EP1808265A1 Paste for soldering and soldering method using the same |
| 07/18/2007 | EP1808059A1 Soldering a flexible circuit |
| 07/18/2007 | EP1807654A1 Strip-type assembly comprising a printed conductor structure and electronic components that are connected to said structure, in particular an illumination strip comprising illumination elements |
| 07/18/2007 | EP1807549A1 Method for coating substrates containing antimony compounds with tin and tin alloys |
| 07/18/2007 | EP1807240A2 Electroform spring built on mandrel transferable to other surface |
| 07/18/2007 | EP1807239A2 Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
| 07/18/2007 | EP1628799B1 Electrode for machine for electromagnetic induction welding of the layers forming a multi-layer printed circuit ; induction device for machine for electromagnetic induction welding with such electrodes |
| 07/18/2007 | EP1478249B1 Method and device for integrating electronics in textiles |
| 07/18/2007 | EP0949668B1 Method for forming bump and semiconductor device |
| 07/18/2007 | CN2925010Y Hot-air circulating heating device |
| 07/18/2007 | CN2925009Y Printed circuit board ink scraper device |
| 07/18/2007 | CN2925008Y Electronic paste direct-write forming device |
| 07/18/2007 | CN2925007Y Tin paste temperature returning machine |
| 07/18/2007 | CN1327749C Method for processing hole on ceramic sheet |
| 07/18/2007 | CN1327748C Solder structure and soldering method of electronic assembly |
| 07/18/2007 | CN1327746C Circuit board device and method for board-to-board connection |
| 07/18/2007 | CN1327519C Device package, a printed wiring board, and an electronic apparatus |
| 07/18/2007 | CN1327515C Circuit board and method of manufacturing the same |
| 07/18/2007 | CN1327514C Wiring substrate and method of manufacturing the same |
| 07/18/2007 | CN1327499C Method for mfg. semiconductor assembly |
| 07/18/2007 | CN1327481C Method of forming multilayer interconnection structure, method of manufacturing circuit board, and method of manufacturing device |
| 07/18/2007 | CN1327479C Method of manufacturing electronic device |
| 07/18/2007 | CN1327468C Pattern |
| 07/18/2007 | CN1326939C Optical solidifying-thermo solidifying resin composition and its solidified products |
| 07/18/2007 | CN1326919C Method for modifying the surface of a polymeric substrate |
| 07/18/2007 | CN1326674C Perforating apparatus and method for slab workpiece |
| 07/18/2007 | CN101002516A Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method |
| 07/18/2007 | CN101002515A Method of manufacturing an electronic circuit assembly using direct write techniques |
| 07/18/2007 | CN101002514A Etching device and etching method |
| 07/18/2007 | CN101002513A Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| 07/18/2007 | CN101002511A Flex-rigid wiring board and manufacturing method thereof |
| 07/18/2007 | CN101002366A Design and method for plating PCI express (PCIE) edge connector |
| 07/18/2007 | CN101001973A Barrier film for flexible copper substrate and sputtering target for forming barrier film |
| 07/18/2007 | CN101001751A Apparatus and method for manufacturing photosensitive laminate |
| 07/18/2007 | CN101001519A Electronic component mounting apparatus and electronic component mounting method |
| 07/18/2007 | CN101001518A Installation system and installation method of electronic element |
| 07/18/2007 | CN101001504A Manufacturing method of circuit substrate side contact |
| 07/18/2007 | CN101001503A Manufacturing method of printed circuit board without precutted |
| 07/18/2007 | CN101001502A Key-press welding plate hole of printed circuit board and its hole covering method |
| 07/18/2007 | CN101000903A Printed circuit board and method of manufacturing semiconductor package using the same |
| 07/17/2007 | US7245884 RF module |
| 07/17/2007 | US7245507 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 07/17/2007 | US7245505 Laminated electronic component |
| 07/17/2007 | US7245501 Configurable circuit board and fabrication method |
| 07/17/2007 | US7245279 Linear led array |
| 07/17/2007 | US7245137 Test head assembly having paired contact structures |
| 07/17/2007 | US7245011 Prevention of contamination on bonding pads of wafer during SMT |
| 07/17/2007 | US7245006 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 07/17/2007 | US7245001 Multi-layer integrated circuit package |
| 07/17/2007 | US7244890 Low cost shielded cable manufactured from conductive loaded resin-based materials |
| 07/17/2007 | US7244675 Electrical connection materials and electrical connection method |
| 07/17/2007 | US7244656 Thin film circuit board device and method for manufacturing the same |
| 07/17/2007 | US7244647 Embedded capacitor structure in circuit board and method for fabricating the same |
| 07/17/2007 | US7244634 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same |
| 07/17/2007 | US7244370 Fabrication of durable thermal liquid discharge head; forming protective layer and anticavitation film in edge portion of wirings; ink jet printing |
| 07/17/2007 | US7244326 Transfer assembly for manufacturing electronic devices |
| 07/17/2007 | US7244310 Over-clocking in a microdeposition control system to improve resolution |
| 07/17/2007 | US7244159 Electromagnetic-shielding transparent window member and method for producing the same |
| 07/17/2007 | US7244125 Connector for making electrical contact at semiconductor scales |
| 07/17/2007 | US7243834 Metal mask and method of printing lead-free solder paste using same |
| 07/17/2007 | US7243424 Production method for a multilayer ceramic substrate |
| 07/17/2007 | US7243423 Chip package with degassing holes |
| 07/17/2007 | US7243422 Apparatus for press-fitting |
| 07/17/2007 | US7243421 Electrical connection of components |
| 07/17/2007 | US7243420 Electronic component mounting method |
| 07/17/2007 | CA2218575C Trace-pad interface for improved signal quality |
| 07/12/2007 | WO2007079156A2 Substrates for electronic circuitry type applications |
| 07/12/2007 | WO2007078893A2 Embedded waveguide printed circuit board structure |
| 07/12/2007 | WO2007078799A2 Low resistivity package substrate and its manufacturing method |
| 07/12/2007 | WO2007078717A2 Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| 07/12/2007 | WO2007078349A2 Mounting structure providing electrical surge protection |
| 07/12/2007 | WO2007077877A1 Soldering method, soldering apparatus and method for manufacturing semiconductor device |
| 07/12/2007 | WO2007077688A1 Soldering method and semiconductor module manufacturing method |
| 07/12/2007 | WO2007077630A1 Laser material processing system, program creating device and laser material processing method |
| 07/12/2007 | WO2007077594A1 Solder remover and method of removing solder |
| 07/12/2007 | WO2007077589A1 Drilling device |
| 07/12/2007 | WO2007077235A1 Method for producing printing masks, in particular for squeegee printing and mask |
| 07/12/2007 | WO2007077233A1 Integrated electronic device and cooling device for an integrated electronic device |
| 07/12/2007 | WO2007077181A1 Punch device, in particular for printed circuit boards and punching method |
| 07/12/2007 | WO2007076849A1 Monolithic ceramic component and production method |
| 07/12/2007 | WO2007046045A3 A component adapted for being mounted on a substrate and a method of mounting a surface mounted device |