| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/29/2007 | CN101026269A Flat earth terminal and method of surface-mounting same |
| 08/29/2007 | CN101026099A Method for manufacturing a substrate with cavity |
| 08/29/2007 | CN101025502A Production method of flexible electronic device |
| 08/29/2007 | CN101025398A Hollow-bulge analyzing method for micro-pore after filled by copper |
| 08/29/2007 | CN101024480A Method for forming microelectronic spring structures on a substrate |
| 08/29/2007 | CN101024353A Method of forming thick layer by screen printing and method of forming piezoelectric actuator of inkjet head |
| 08/29/2007 | CN101024315A Laminate and its producing method |
| 08/29/2007 | CN100334932C Part mounting recognition mark recognition device and method |
| 08/29/2007 | CN100334929C Interlayer connection structure and its building method |
| 08/29/2007 | CN100334928C Wiring membrane connector and manufacture thereof, multilayer wiring substrate manufacture |
| 08/29/2007 | CN100334927C Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material |
| 08/29/2007 | CN100334926C Lamination process of flexible circuit board and auxiliary material for lamination |
| 08/29/2007 | CN100334710C Mfg. method for conductor fig. |
| 08/29/2007 | CN100334700C Mold release layer transferring film and laminate film |
| 08/29/2007 | CN100334259C Electrode and apparatus for plating |
| 08/29/2007 | CN100333904C Support system and method for a screen printing unit |
| 08/28/2007 | US7262975 Multilayer printed wiring board |
| 08/28/2007 | US7262973 Power conversion module device and power unit using the same |
| 08/28/2007 | US7262822 Structure of liquid crystal display device for easy assembly and disassembly |
| 08/28/2007 | US7262682 Resistor element, stress sensor, and method for manufacturing them |
| 08/28/2007 | US7262616 Apparatus, method and system for testing electronic components |
| 08/28/2007 | US7262510 Chip package structure |
| 08/28/2007 | US7262504 Multiple stage electroless deposition of a metal layer |
| 08/28/2007 | US7262489 Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 08/28/2007 | US7262133 Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| 08/28/2007 | US7262128 Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards |
| 08/28/2007 | US7262076 Method for production of semiconductor package |
| 08/28/2007 | US7261944 At least monoaxially oriented polyester film containing a metal compound which on irradiation with electromagnetic radiation liberates a metal in elemental form coated with an aminosilane; film has a modulus of elasticity in at least one direction of greater than 500 N/mm2 |
| 08/28/2007 | US7261920 Process for forming a patterned thin film structure on a substrate |
| 08/28/2007 | US7261916 Method of manufacturing thin-film antenna |
| 08/28/2007 | US7261569 Connection structure of printed wiring board |
| 08/28/2007 | US7260890 Methods for fabricating three-dimensional all organic interconnect structures |
| 08/28/2007 | US7260882 Methods for making electronic devices with small functional elements supported on a carriers |
| 08/24/2007 | CA2537679A1 Electronic circuit prototyping apparatus |
| 08/23/2007 | WO2007095439A2 Electrochemical etching of circuitry for high density interconnect electronic modules |
| 08/23/2007 | WO2007094614A1 Multi-layer flexible printed circuit board and method for manufacturing the same |
| 08/23/2007 | WO2007094396A1 Photosensitive resin composition and pattern forming method using same |
| 08/23/2007 | WO2007094167A1 Circuit board and process for producing the same |
| 08/23/2007 | WO2007094129A1 Circuit board manufacturing method and circuit board |
| 08/23/2007 | WO2007094123A1 Multilayered ceramic electronic component, multilayered ceramic substrate, and method for manufacturing multilayered ceramic electronic component |
| 08/23/2007 | WO2007094067A1 Substrate structure |
| 08/23/2007 | WO2007093710A2 Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line |
| 08/23/2007 | WO2007093709A1 Method for producing an electronic module by sequential fixation of the components |
| 08/23/2007 | WO2007093284A1 Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material |
| 08/23/2007 | WO2007074049A3 Electric device comprising a lubricated joint point and method for lubricating said type of joint point |
| 08/23/2007 | WO2006091463A8 Method of making multilayered construction for use in resistors and capacitors |
| 08/23/2007 | US20070195511 Component built-in wiring board and manufacturing method of component built-in wiring board |
| 08/23/2007 | US20070195510 Configurable circuit board and fabrication method |
| 08/23/2007 | US20070194449 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 08/23/2007 | US20070193682 Bonding method and apparatus |
| 08/23/2007 | US20070193680 Backup board for machining process |
| 08/23/2007 | US20070193461 Method for providing a substrate with a printed pattern which comprises a number of separate pattern elements |
| 08/23/2007 | US20070193020 Method of manufacturing an inlet member for an electronic tag |
| 08/23/2007 | DE19901623B4 Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate Method and apparatus for the thermal connection of connecting surfaces of two substrates |
| 08/23/2007 | DE102006023327B3 Removal of components held on substrate, especially to repair electronic circuits, is achieved by suction unit acting selectively on defective components |
| 08/23/2007 | DE102006009159A1 Composite substrate production involves connecting metal-ceramic substrate and/or copper-ceramic substrate with upper surface side of metallic carrier through sintering and under application of metallic sintering material |
| 08/23/2007 | DE102006006255A1 Fingertester zum Prüfen von unbestückten Leiterplatten und Verfahren zum Prüfen unbestückter Leiterplatten mit einem Fingertester Finger tester for testing bare boards and method for testing unpopulated printed circuit boards with a finger tester |
| 08/22/2007 | EP1821588A1 Process for producing multilayer wiring board |
| 08/22/2007 | EP1821587A2 Electronic component mounting structure |
| 08/22/2007 | EP1821586A1 Printed board and printed board manufacturing method |
| 08/22/2007 | EP1820884A1 Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material |
| 08/22/2007 | EP1820380A1 Solder paste stencil and method for producing the same |
| 08/22/2007 | EP1819523A1 Printing screens, machine and method for screen printing |
| 08/22/2007 | EP1377638B1 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 08/22/2007 | EP1366544A4 Method and system for connecting a cable to a circuit board |
| 08/22/2007 | EP1275143B1 Process for forming electrical/mechanical connections |
| 08/22/2007 | EP1269808B1 Method for fabricating electrical connecting elements, and connecting element |
| 08/22/2007 | CN2938732Y Conveying device of circuit board |
| 08/22/2007 | CN2938708Y Device for processing flexible substrate |
| 08/22/2007 | CN2938705Y Welding area of field effect tube |
| 08/22/2007 | CN2938704Y High frequency circuit board device with synchronmous test function |
| 08/22/2007 | CN1333623C Method for producing vias in manufacture of printed wiring boards |
| 08/22/2007 | CN1333494C Connector, method for manufacturing the same, and wiring board structure employing it |
| 08/22/2007 | CN1333461C Potting material for electronic components |
| 08/22/2007 | CN1333460C High-frequency module board device |
| 08/22/2007 | CN1333015C Resin composition |
| 08/22/2007 | CN1332902C High thermal expansion glass and belt composition |
| 08/22/2007 | CN1332879C Method for forming pattern film of surface modified carbon nano tube |
| 08/22/2007 | CN1332779C Solder bonding method and solder bonding device |
| 08/22/2007 | CN101023717A 电极基板 The electrode substrate |
| 08/22/2007 | CN101023716A 柔性印刷配线板 Flexible printed wiring board |
| 08/22/2007 | CN101023202A Method for improving the electrical connection properties of the surface of a product made from a polymer-matrix composite |
| 08/22/2007 | CN101023112A Heat-curable urethane resin composition |
| 08/22/2007 | CN101022911A Solder paste dispenser for a stencil printer |
| 08/22/2007 | CN101022708A Temporary fixing structure for electronic parts |
| 08/22/2007 | CN101022703A Method and process for embedding electrically conductive elements in a dielectric layer |
| 08/22/2007 | CN101022702A Flexible circuit board crimp device and quick crimp machine using the same device |
| 08/22/2007 | CN101022701A Printed circuit board processing device and drilling processing method therefor |
| 08/22/2007 | CN101022699A Wired circuit board and production method thereof |
| 08/22/2007 | CN101022698A Printed circuit board assembly and method of manufacturing the same |
| 08/22/2007 | CN101022697A Multilayer circuit board and method for fabricating same |
| 08/22/2007 | CN101022695A Circuit embedded in dielectric layer non-core band thin base sheet and manufacting method |
| 08/22/2007 | CN101021503A Silk screen printing electrode and producing process, and sensor and detecting method |
| 08/21/2007 | US7260806 Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program |
| 08/21/2007 | US7260233 Hearing aid or similar audio device and method for producing a hearing aid |
| 08/21/2007 | US7259970 Substrate, connecting structure and electronic equipment |
| 08/21/2007 | US7259823 Planar display module |
| 08/21/2007 | US7259777 Scanner system |
| 08/21/2007 | US7259640 Miniature RF and microwave components and methods for fabricating such components |
| 08/21/2007 | US7259639 Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof |