| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/06/2007 | EP1793656A2 Flexible printed wiring board |
| 06/06/2007 | EP1793447A1 Integration of functional layers in or on transparent synthetic parts of automobile construction |
| 06/06/2007 | EP1793419A1 Method and system for processing frozen adhesive particles |
| 06/06/2007 | EP1792528A2 Method for mounting an electronic component on a preferably soft support, and resulting electronic enitity, such as a passport |
| 06/06/2007 | EP1792526A1 Electronic device provided with an integrated heat spreader |
| 06/06/2007 | DE19936013B4 Verfahren zur gleichzeitigen Herstellung von Leiterplatten und Teilen aus einem gemeinsamen Trägersubstrat, Leiterplatte mit Befestigungselementen und deren Verwendung A process for the simultaneous production of printed circuit boards and parts made of a common carrier substrate, printed circuit board with fixing elements and their use |
| 06/06/2007 | DE10230711B4 Elektrisch leitende Verbindung Electrically conductive connection |
| 06/06/2007 | DE102006051762A1 Hochdichte Leiterplatte und Verfahren zu ihrer Herstellung High density printed circuit board and process for its preparation |
| 06/06/2007 | CN2909787Y Cleaning machine for circuit board |
| 06/06/2007 | CN2909786Y Support device for circuit board |
| 06/06/2007 | CN2909785Y Tool for preventing tin sticking onto golden finger contact |
| 06/06/2007 | CN2908003Y Equipment for pressing and connecting electronic element |
| 06/06/2007 | CN1977574A Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board |
| 06/06/2007 | CN1977572A Circuit substrate for solid configuration |
| 06/06/2007 | CN1977375A Stacked module systems and methods |
| 06/06/2007 | CN1977370A Lead solder indicator and method |
| 06/06/2007 | CN1977369A Method and apparatus for mounting conductive ball |
| 06/06/2007 | CN1977365A Through substrate and interposer, and method for manufacturing through substrate |
| 06/06/2007 | CN1977280A Method for producing RFID labels |
| 06/06/2007 | CN1976790A Mold made of amorphous fluorine resin and fabrication method thereof |
| 06/06/2007 | CN1976561A Process for producing printed board having cable portion |
| 06/06/2007 | CN1976560A Core substrate and multiplayer printed circuit board using paste bump and method of manufacturing thereof |
| 06/06/2007 | CN1976559A Parts supply device |
| 06/06/2007 | CN1976558A Flexible circuit board and manufacture method and plasma display board using the same |
| 06/06/2007 | CN1976557A Circuit board device and method for board-to-board connection |
| 06/06/2007 | CN1975950A Sheet capacitor manufacturing method |
| 06/06/2007 | CN1975948A Sheet capacitor |
| 06/06/2007 | CN1975944A Thin-film laminate, and electronic parts |
| 06/06/2007 | CN1975942A Sheet capacitor |
| 06/06/2007 | CN1974457A Glass cream for protective coating and thick film resistance element |
| 06/06/2007 | CN1974207A Photogravure roller |
| 06/06/2007 | CN1974107A Welding method and supply solder alloy |
| 06/06/2007 | CN1974088A Device and method for eliminating drillings from circuit board |
| 06/06/2007 | CN1320848C Welder |
| 06/06/2007 | CN1320847C Liquid crystal polymers for flexible circuits |
| 06/06/2007 | CN1320846C Circuit board and its manufacturing method |
| 06/06/2007 | CN1320648C Electronic module |
| 06/06/2007 | CN1320642C Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls |
| 06/06/2007 | CN1320597C Device and method for preventing oxidizing of electronic device |
| 06/06/2007 | CN1320495C Equipment and method for processing integrated circuit |
| 06/06/2007 | CN1319695C Multiple beam laser holing working device |
| 06/05/2007 | US7227758 Printed circuit board assembly with integrated connector |
| 06/05/2007 | US7227739 Solid electrolytic capacitor |
| 06/05/2007 | US7227443 Fixed network resistor |
| 06/05/2007 | US7227268 Placement of sacrificial solder balls underneath the PBGA substrate |
| 06/05/2007 | US7227261 Vertical surface mount assembly and methods |
| 06/05/2007 | US7227179 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 06/05/2007 | US7227156 System and method for attenuating the effect of ambient light on an optical sensor |
| 06/05/2007 | US7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 06/05/2007 | US7226806 Wet etched insulator and electronic circuit component |
| 06/05/2007 | US7226710 Prepolymer having a carboxyl group in combination with at least two unsaturated bonds in its molecule, a polymerization initiator, a diluent, a di- or polyoxetane compound, and a curing promoter, suitable for the formation of a solder resist |
| 06/05/2007 | US7226660 To be used for connecting two or more electrodes of an electric circuit, having an improved connection reliability resulting from relaxation of force applied to a circuit, and to substrate structures |
| 06/05/2007 | US7226654 Laminated wiring board and its mounting structure |
| 06/05/2007 | US7226653 Printed circuit board and method for producing a printed circuit board |
| 06/05/2007 | US7226634 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness |
| 06/05/2007 | US7226520 Method for forming pattern and method for forming multilayer wiring structure by droplet discharge system |
| 06/05/2007 | US7225734 Device and method for positioning a substrate to be printed |
| 06/05/2007 | US7225732 Screen printer |
| 06/05/2007 | US7225540 Method for manufacturing an ink jet head |
| 06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |
| 06/05/2007 | US7225537 Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
| 06/05/2007 | US7225536 Precasting multi-layer PCB process |
| 06/05/2007 | US7225535 Method of manufacturing electrochemical sensors |
| 06/05/2007 | CA2253242C Photopolymerizable thermosetting resin composition |
| 05/31/2007 | WO2007061125A1 Electronic component soldering structure and electronic component soldering method |
| 05/31/2007 | WO2007061086A1 Curable resin composition and use thereof |
| 05/31/2007 | WO2007060936A1 Soldering apparatus and soldering method |
| 05/31/2007 | WO2007060855A1 Bonding sheet sticking equipment and method |
| 05/31/2007 | WO2007060824A1 Etching solution for thermoplastic polyimide resin |
| 05/31/2007 | WO2007060788A1 Process for producing multilayer ceramic substrate |
| 05/31/2007 | WO2007060784A1 Circuit module and method for fabricating the same |
| 05/31/2007 | WO2007060742A1 Printing mask and solar cell, and flat panel display ad chip capacitor |
| 05/31/2007 | WO2007060736A1 Process for producing base material holding tool for wiring board, base material holding tool for wiring board, intermediate material for wiring board, and process for producing wiring board |
| 05/31/2007 | WO2007060657A1 System and method for producing a solar cell array |
| 05/31/2007 | WO2007060298A1 Producing an image on a substrate |
| 05/31/2007 | WO2007059797A1 Method to weld conductive tracks together |
| 05/31/2007 | WO2007043639A9 Printed wiring board and method for manufacturing printed wiring board |
| 05/31/2007 | WO2007037553A9 Process for producing substrate with metal wiring |
| 05/31/2007 | WO2007033829A3 Power semiconductor module and a method for the production thereof |
| 05/31/2007 | US20070123082 Interconnect Assemblies And Methods |
| 05/31/2007 | US20070123067 Flexible ring interconnection system |
| 05/31/2007 | US20070123066 Interconnection element for BGA housings and method for producing the same |
| 05/31/2007 | US20070123027 Wiring forming method, wiring forming apparatus, and wiring board |
| 05/31/2007 | US20070122932 Methods and compositions for the formation of recessed electrical features on a substrate |
| 05/31/2007 | US20070122723 Process |
| 05/31/2007 | US20070122553 forming a frame having an undercut near the bottom on an electrode film, forming the patterned thin film by plating through the use of the frame; patterned thin film includes linear portions disposed side by side, and each linear portions has a portion having greater width, close to the electrode film |
| 05/31/2007 | US20070121305 Multilayer wiring board for an electronic device |
| 05/31/2007 | US20070120880 Inkjet ink composition |
| 05/31/2007 | US20070120273 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 05/31/2007 | US20070120229 Wet etched insulator and electronic circuit component |
| 05/31/2007 | US20070120099 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/31/2007 | US20070120098 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/31/2007 | US20070120097 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/31/2007 | US20070120096 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 05/31/2007 | US20070119617 Method for manufacturing component built-in module, and component built-in module |
| 05/31/2007 | US20070119284 Method for producing parts for passive electronic components and parts produced |
| 05/31/2007 | US20070119051 Inductive Heating of Microelectronic Components |
| 05/31/2007 | DE19963264B4 Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement Support material for high performance electronic components in SMD style and thus produced high-performance electronic component |
| 05/31/2007 | DE112005001680T5 Verfahren und Vorrichtung zum Drucken viskoser Materialien Method and apparatus for printing of viscous materials |
| 05/31/2007 | DE112005001663T5 Lötpastenspender für Schablonendrucker Lötpastenspender for Screen Printer |