Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2007
07/10/2007US7240426 Equipment for bonding printed circuit boards
07/10/2007US7240425 Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board
07/10/2007US7240424 Method of laminating low temperature co-fired ceramic (LTCC) Material
07/10/2007CA2440026C Connection structure between printed circuit board and flexible circuit board
07/10/2007CA2268797C Method to control cavity dimensions of fired multilayer circuit boards on a support
07/06/2007CA2572903A1 Miniature coils on core with printed circuit
07/05/2007WO2007076424A1 Process for forming electrical contacts on a semiconductor wafer using a phase changing ink
07/05/2007WO2007075586A2 Flexible circuit
07/05/2007WO2007075084A1 Material jet system
07/05/2007WO2007074941A1 Multilayer printed wiring board
07/05/2007WO2007074889A1 Soldering method, semiconductor module manufacturing method and soldering apparatus
07/05/2007WO2007074835A1 Soldering method, semiconductor module manufacturing method and soldering apparatus
07/05/2007WO2007074601A1 Multilayer wiring board, and electronic module and electronic device provided with such multilayer wiring board
07/05/2007WO2007074594A1 Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board
07/05/2007WO2007074567A1 Optical and electrical composite wiring board and method for fabricating same
07/05/2007WO2007074351A1 Substrate with contact studs of improved quality
07/05/2007WO2007074155A1 Method for producing an electronic circuit carrier, apparatus for protecting the finish of an electronic circuit carrier, and circuit carrier
07/05/2007WO2007073886A1 Device, system and method for treating the surfaces of substrates
07/05/2007WO2007033849A3 Combined fastening and contacting system for electrical components on superimposed circuit boards
07/05/2007WO2006134216A3 Circuit board structure and method for manufacturing a circuit board structure
07/05/2007WO2006125512A3 Device and method for assembly of electrical components
07/05/2007US20070155194 System for the mechanical and electrical connection of printed circuits
07/05/2007US20070155176 Interconnect circuitry, multichip module, and methods of manufacturing thereof
07/05/2007US20070155174 Circuit substrate and method for fabricating the same
07/05/2007US20070155156 Bonding pad structure for a display device and fabrication method thereof
07/05/2007US20070155029 Methods for processing semiconductor devices in a singulated form
07/05/2007US20070154647 Spray valve
07/05/2007US20070154631 Polyimide compositions and use thereof in ceramic product defect repair
07/05/2007US20070154626 Wiring substrate
07/05/2007US20070154134 Printed circuit board including waveguide and method of producing the same
07/05/2007US20070153488 Multi-Layer Printed Circuit Board and Method for Fabricating the Same
07/05/2007US20070153453 Fully conductive pad for electrochemical mechanical processing
07/05/2007US20070153427 Recording disk drive capable of suppressing vibration of flexible printed circuit board
07/05/2007US20070153426 Recording disk drive capable of suppressing vibration of flexible printed circuit board
07/05/2007US20070153423 Substrate material for an hdd suspension
07/05/2007US20070153207 Organic electroluminescent display device with separately connected signal lines and power lines
07/05/2007US20070152782 Coaxial waveguide microstructures having an active device and methods of formation thereof
07/05/2007US20070152769 Semi-suspended coplanar waveguide on a printed circuit board
07/05/2007US20070152025 Electronic part mounting method
07/05/2007US20070152020 Optical structures including liquid bumps
07/05/2007US20070151858 Method and electrode for defining and replicating structures in conducting materials
07/05/2007US20070151756 Flexible substrate having interlaminar junctions, and process for producing the same
07/05/2007US20070151755 Mounting structure providing electrical surge protection
07/05/2007US20070151753 Printed circuit board having plated through hole with multiple connections and method of fabricating same
07/05/2007US20070151752 Wiring board and a semiconductor device using the same
07/05/2007US20070151748 Flexible carrier with an electrically conducting structure
07/05/2007US20070151661 Etched dielectric film in hard disk drives
07/05/2007US20070151099 Direct integration of inorganic nanowires with micron-sized electrodes
07/05/2007US20070151098 Extractable electronic apparatus with handle latching structure
07/05/2007US20070151090 Ceramic substrate
07/05/2007DE102006057542A1 Leiterplatte mit eingebetteten elektronischen Bauteilen und Herstellungsverfahren derselben Circuit board with embedded electronic components and manufacturing method thereof
07/05/2007DE102005063278A1 Punching device for printed circuit board, has upper part and lower part, where component e.g. printed circuit board, that is to be punched is arranged between upper part and lower part, and sectional bushing is formed as sectional film
07/05/2007DE102005063272A1 Flexible Leiterplatte und Kontaktierverfahren Flexible printed circuit board and contacting methods
07/05/2007DE102005062604A1 Production of an electronic circuit carrier for circuit boards comprises applying a foil for covering a second partial region before a first partial region is processed
07/05/2007DE102005062600A1 Method for positioning electronic power components on a circuit board used in chip manufacture comprises using a heat-conducting electrically insulating foil
07/05/2007DE102004008897B4 Elektroniksystem für ein Kraftfahrzeug Electronic system for a motor vehicle
07/05/2007DE10133256B4 Verfahren zur Herstellung von leitfähigen oder halbleitenden strukturierten Polymeren A process for the production of conductive or semiconductive polymers structured
07/05/2007CA2632912A1 Device, system and method for the surface treatment of substrates
07/04/2007EP1804562A1 Composite multilayer substrate and its manufacturing method
07/04/2007EP1804561A1 Printed circuit board for perpendicularly connecting electronic components
07/04/2007EP1804558A1 Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material
07/04/2007EP1804202A1 Tape carrier and module for contact type IC card and method for manufacturing the tape carrier
07/04/2007EP1803804A2 Method and material for cleaning a substrate
07/04/2007EP1803803A2 Cleaning compounds and method and system for using the cleaning compound
07/04/2007EP1803522A2 Laser processing method, laser soldering method, and laser processing apparatus
07/04/2007EP1803504A2 Method for removing contamination from a substrate and for making a cleaning solution
07/04/2007EP1803338A1 Flex-rigid printed circuit by bonding
07/04/2007EP1802674A1 Heat-curable urethane resin composition
07/04/2007EP1726191A4 Flexible circuit board assembly
07/04/2007EP1608535B1 Arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area
07/04/2007EP1545891B1 Screen printing method
07/04/2007EP1497810B1 Electrotechnical kit
07/04/2007EP1326079B1 Probe card
07/04/2007CN2919809Y Modular micro-adhering head of high-speed full automatic piece-adhering machine
07/04/2007CN2919788Y Ball planting steel mash
07/04/2007CN2919787Y 辅助固定机构 Auxiliary fixing mechanism
07/04/2007CN2917906Y Full-automatic wave crest welding machine
07/04/2007CN1994033A Printed-circuit board, its manufacturing method and semiconductor device
07/04/2007CN1994032A Methods and apparatuses for imprinting substrates
07/04/2007CN1994030A 多层印刷电路板 The multilayer printed circuit board
07/04/2007CN1993774A Conductive paste and electronic component mounting substrate using it
07/04/2007CN1993652A Method of calibrating alignment section, image-drawing device with calibrated alignment section, and conveying device
07/04/2007CN1993498A Solution, material for plating, insulating sheet, laminate and printed wiring board
07/04/2007CN1993457A Cleaning compositions for microelectronics substrates
07/04/2007CN1993418A Poly 4-methyl-1-pentene resin composition, film, and die for manufacturing electronic component seal
07/04/2007CN1993197A Reflow oven
07/04/2007CN1993025A Multi-layer printed circuit board and method for manufacturing same
07/04/2007CN1993024A Method for filling through hole
07/04/2007CN1993023A Processing method and structure for replacing bad element in printed circuit board
07/04/2007CN1993022A Method for fixing nickel strip on printed circuit board
07/04/2007CN1993021A Method for manufacturing wiring board
07/04/2007CN1993020A Circuit layout system and method for automatic presenting project for modification
07/04/2007CN1993019A Line data managerial approach of line layout
07/04/2007CN1993018A Printed circuit board and method of manufacture
07/04/2007CN1993017A Via architecture of printed circuit board
07/04/2007CN1993016A Composition board aligning structure and method thereof
07/04/2007CN1993014A Wired circuit board
07/04/2007CN1993012A Multilayer wiring board capable of reducing noise over wide frequency band with simple structure
07/04/2007CN1993011A Electronic carrier plate and packaging structure thereof
07/04/2007CN1993003A Manufacturing method of resistance film heating device and the formed resistance film heating device