| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/04/2007 | CN1992250A Semiconductor package and manufacturing method therefor |
| 07/04/2007 | CN1992013A Optical disc drive apparatus and joint structure of flexible circuit boards |
| 07/04/2007 | CN1991588A Method for fabricating printing plate with fine pattern using electric field |
| 07/04/2007 | CN1991486A Patterning method and method for manufacturing liquid crystal display device using the same |
| 07/04/2007 | CN1991343A Method for inspecting patterns |
| 07/04/2007 | CN1990249A Method of manufacturing ink-jet head |
| 07/04/2007 | CN1990150A Addition of d2 to h2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment |
| 07/04/2007 | CN1990148A Soldering method and apparatus |
| 07/04/2007 | CN1324933C Wiring material, wiring substrate and manufacturing method thereof and display panel |
| 07/04/2007 | CN1324932C Printed circuit board without rough cutting edge |
| 07/04/2007 | CN1324769C Electromagnetic emission reduction technique for shielded connectors |
| 07/04/2007 | CN1324763C Circuit-connecting structure including a terminal piece |
| 07/04/2007 | CN1324698C Ceramic multi-layer substrate and mfg method thereof |
| 07/04/2007 | CN1324697C Semiconductor baseplate and its fabrication process |
| 07/04/2007 | CN1324617C Formation of thin film resistors |
| 07/04/2007 | CN1324616C Strip-like cable |
| 07/04/2007 | CN1324085C Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
| 07/04/2007 | CN1323834C Device and method for positioning a substrate to be printed |
| 07/04/2007 | CN1323769C Washing method, storage method, figure forming method and mfg. method of device |
| 07/04/2007 | CN1323751C Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method |
| 07/03/2007 | US7240318 Placement/net wiring processing system |
| 07/03/2007 | US7240317 Placement/net wiring processing system |
| 07/03/2007 | US7240313 Method for analyzing material density variations on a multi-layer printed circuit board |
| 07/03/2007 | US7239851 High frequency module |
| 07/03/2007 | US7239524 Resistive element apparatus and method |
| 07/03/2007 | US7239484 Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device utilizing solder balls with nonmelting cores |
| 07/03/2007 | US7239261 Injection molding of a mixture of a hollow carbon globule; a rubber or a polymeric or inorganic insulating material; and one or more metals, metallic silicates, and/or metallic sulfides; usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance |
| 07/03/2007 | US7239222 High frequency circuit module |
| 07/03/2007 | US7239219 Miniature RF and microwave components and methods for fabricating such components |
| 07/03/2007 | US7239029 Packages for semiconductor die |
| 07/03/2007 | US7239014 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor |
| 07/03/2007 | US7239013 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 07/03/2007 | US7238891 Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards |
| 07/03/2007 | US7238889 Integrated cable management stay |
| 07/03/2007 | US7238603 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
| 07/03/2007 | US7238550 Methods and apparatus for fabricating Chip-on-Board modules |
| 07/03/2007 | US7238306 Conformal tribocharge-reducing coating |
| 07/03/2007 | US7238044 Connection structure of printed wiring board |
| 07/03/2007 | US7237724 Smart card and method for manufacturing a smart card |
| 07/03/2007 | US7237333 Surface mount captive screw ferrule for PCB |
| 07/03/2007 | US7237332 Method of manufacturing wiring board |
| 07/03/2007 | US7237331 Electronic part manufacturing method and electronic part |
| 07/03/2007 | US7237330 Method for making conductive circuits using powdered metals |
| 07/03/2007 | CA2295131C A protective containment apparatus for potted electronic circuits |
| 06/28/2007 | WO2007072876A1 Method for manufacturing printed wiring board |
| 06/28/2007 | WO2007072875A1 Method for manufacturing printed wiring board |
| 06/28/2007 | WO2007072872A1 Method of manufacturing printed wiring board |
| 06/28/2007 | WO2007072812A1 Structure for mounting electronic parts on circuit board, and mounting method |
| 06/28/2007 | WO2007072786A1 Glass substrate having circuit pattern and process for producing the same |
| 06/28/2007 | WO2007072727A1 Composition for removing residue from wiring board and cleaning method |
| 06/28/2007 | WO2007072641A1 Pattern-forming material, pattern-forming apparatus and pattern-forming method |
| 06/28/2007 | WO2007072616A1 Module having built-in component and method for fabricating such module |
| 06/28/2007 | WO2007072570A1 Circuit board connecting structure, circuit board connecting section, and electronic apparatus |
| 06/28/2007 | WO2007071985A1 Method of and apparatus for transferring material from a carrier to a substrate by laser irradiation |
| 06/28/2007 | WO2007071218A1 Metal-ceramic substrate |
| 06/28/2007 | WO2007043714A9 Multilayer printed wiring board and method for manufacturing same |
| 06/28/2007 | WO2007018748A3 Printed circuit board interconnection and method |
| 06/28/2007 | US20070150074 Component feeder exchange diagnostic tool |
| 06/28/2007 | US20070149001 Flexible circuit |
| 06/28/2007 | US20070148360 Low temperature bumping process |
| 06/28/2007 | US20070148337 Flame-perforated aperture masks |
| 06/28/2007 | US20070148336 Photovoltaic contact and wiring formation |
| 06/28/2007 | US20070147676 Substrate inspection device |
| 06/28/2007 | US20070147012 Circuit board |
| 06/28/2007 | US20070146404 Method for generating a jetting program |
| 06/28/2007 | US20070145632 Elastomeric stamp, patterning method using such a stamp and method for producing such a stamp |
| 06/28/2007 | US20070145603 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof |
| 06/28/2007 | US20070145584 Printed wiring board, method for manufacturing same, and circuit device |
| 06/28/2007 | US20070145575 Circuit board and method for mounting chip component |
| 06/28/2007 | US20070145568 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/28/2007 | US20070145566 Method and system of tape automated bonding |
| 06/28/2007 | US20070145554 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
| 06/28/2007 | US20070145103 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 06/28/2007 | US20070144915 Process and composition for passivating a substrate during electrochemical mechanical polishing |
| 06/28/2007 | US20070144913 Method of preparing printed or daubed image and printed or daubed image element by it. |
| 06/28/2007 | US20070144896 Plating process enhanced by squeegee roller apparatus |
| 06/28/2007 | US20070144841 Miniaturized Contact Spring |
| 06/28/2007 | US20070144669 Method of producing flexible laminate sheet |
| 06/28/2007 | US20070143993 Substrate structure with capacitor component embedded therein and method for fabricating the same |
| 06/28/2007 | US20070143991 Method for the Production of a Circuit Board Element and Circuit Board Element |
| 06/28/2007 | DE112005001225T5 Verfahren zum Bereitstellen einer konsistenten Qualität einer Zielmaterialentfernung durch Laser mit verschiedenen Ausgangsleistungseigenschaften A method for providing a consistent quality of a target material removal by lasers with different output characteristics |
| 06/28/2007 | DE10234751B4 Verfahren zur Herstellung einer spritzgegossenen Chipkarte und nach dem Verfahren hergestellte Chipkarte A process for producing an injection molded chip card and the chip card produced by the process |
| 06/28/2007 | DE102006050890A1 Verfahren zur Herstellung einer gedruckten Leiterplatte mit kontaktsteglosem Kontaktloch A process for producing a printed circuit board with contact web loose contact hole |
| 06/28/2007 | DE102005062028A1 Verfahren zur Herstellung von metallisiertem textilem Flächengebilde, metallisiertes textiles Flächengebilde und Verwendung des so hergestellten metallisierten textilen Flächengebildes A process for preparing a metallized textile fabric, metallized fabric and using the metallized fabric thus prepared |
| 06/28/2007 | DE102005061989A1 Holding device for coating of printed circuit board, has elastic unit e.g. O- ring, which is provided for elastic prestressing of retaining strips against stentering frame, where retaining strip has recess for guiding clamping units |
| 06/28/2007 | DE10149912B4 Tretkraft-Erfassungsvorrichtung Pedaling force detecting device |
| 06/27/2007 | EP1802187A2 Printed circuit board and manufacturing method thereof |
| 06/27/2007 | EP1802186A2 Solder resist composition and printed circuit boards |
| 06/27/2007 | EP1802185A2 Method to apply material to a component |
| 06/27/2007 | EP1802184A1 Method for manufacturing conductive pattern material |
| 06/27/2007 | EP1802183A2 Ultrathin copper foil with carrier and printed circuit board using same |
| 06/27/2007 | EP1802182A2 Allignment structure of printed circuit board substrate and method thereof |
| 06/27/2007 | EP1802181A1 Via structure of a printed circuit board |
| 06/27/2007 | EP1801867A2 Method of flip-chip mounting a semiconductor chip to a circuit board, circuit board for flip-chip connection and method of manufacturing the same |
| 06/27/2007 | EP1801826A1 Thick film capacitors on ceramic interconnect substrates |
| 06/27/2007 | EP1801565A2 Solder material test apparatus, and method of controlling the same |
| 06/27/2007 | EP1800791A1 Method of forming via hole using laser beam |
| 06/27/2007 | EP1800525A2 Drilling device for drilling contact holes for assembling contact surfaces of a multilayer circuit boards |
| 06/27/2007 | EP1800524A2 Method and device for coating circuit boards |
| 06/27/2007 | EP1799880A2 Active filler particles in inks |