| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/19/2007 | CN100338979C Thin-laminate panels for capacative printed-circuit boards ance methods for making the same |
| 09/19/2007 | CN100338978C Method for producing wiring board |
| 09/19/2007 | CN100338757C Method for preparing copper conductor for plane display substrate |
| 09/19/2007 | CN100338746C Method for forming conductive bolt |
| 09/19/2007 | CN100338738C Installation structure and method of electronic device, photoelectric device and electronic apparatus |
| 09/19/2007 | CN100338699C Transformer and transformer unit with said transformer |
| 09/19/2007 | CN100338546C Hierarchical module |
| 09/19/2007 | CN100338259C Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 09/19/2007 | CN100338139C Thermally vanishing material, transfer sheet using the same, and method for forming pattern |
| 09/19/2007 | CN100337818C Screen printing apparatus |
| 09/19/2007 | CN100337782C Joining material and joining method |
| 09/18/2007 | US7272809 Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design |
| 09/18/2007 | US7271908 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device |
| 09/18/2007 | US7271860 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| 09/18/2007 | US7271484 Substrate for producing a soldering connection |
| 09/18/2007 | US7271478 Printed circuit board and inkjet head |
| 09/18/2007 | US7271476 Wiring substrate for mounting semiconductor components |
| 09/18/2007 | US7271415 Flexible electronic device and production method of the same |
| 09/18/2007 | US7271349 Via shielding for power/ground layers on printed circuit board |
| 09/18/2007 | US7271348 Providing decoupling capacitors in a circuit board |
| 09/18/2007 | US7271095 Process for producing metallic interconnects and contact surfaces on electronic components |
| 09/18/2007 | US7271084 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 09/18/2007 | US7271039 Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method |
| 09/18/2007 | US7271028 High density electronic interconnection |
| 09/18/2007 | US7271016 Methods and apparatus for a flexible circuit interposer |
| 09/18/2007 | US7270845 dielectric compositions for forming dielectric layers that can be used as circuitized substrates and particularly those used in multilayered circuit boards, chip carriers, and the like; comprising: a cured epoxy resin material; and a particulate filler |
| 09/18/2007 | US7270844 Supplying the material to be deposited;atomizing the material to produce a plurality of discrete particles;applying a force; collimating particles by surrounding the carrier gas with a coflowing sheath gas; passing the particles through no more than one orifice; depositing |
| 09/18/2007 | US7270717 Compositions and methods for cleaning contaminated articles |
| 09/18/2007 | US7270712 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 09/18/2007 | US7270398 Circuit board and liquid discharging apparatus |
| 09/18/2007 | US7270270 Optical scanner control method, optical scanner and laser machining apparatus |
| 09/18/2007 | US7269899 Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 09/18/2007 | US7269898 Method for making an edge intensive antifuse |
| 09/18/2007 | US7269897 Manufacturing process of a stacked semiconductor device |
| 09/18/2007 | US7269896 Method for connecting multiple coaxial cables to a PCB |
| 09/18/2007 | US7269892 Electric part handling device |
| 09/18/2007 | US7269891 High density, zero-height, free floating interconnect system |
| 09/18/2007 | CA2331813C Circuit board of protective circuit for storage battery, protective circuit device for storage,and storage battery pack |
| 09/13/2007 | WO2007102644A1 Method of forming triple palladium- palladium-gold plating layer on high-density printed circuit board for solving the thickness deviation of plating and printed circuit board produced thereby |
| 09/13/2007 | WO2007102597A1 Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate |
| 09/13/2007 | WO2007102589A1 Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| 09/13/2007 | WO2007102588A1 Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| 09/13/2007 | WO2007102482A1 Mounting method, board with electrical component, and electrical apparatus |
| 09/13/2007 | WO2007102366A2 Device and connecting method |
| 09/13/2007 | WO2007102289A1 Photosensitive composition, photosensitive film, method for permanent pattern formation using said photosensitive composition, and printed board |
| 09/13/2007 | WO2007102261A1 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board |
| 09/13/2007 | WO2007102062A2 Method and process of manufacturing robust high temperature solder joints |
| 09/13/2007 | WO2007101688A1 Method for producing at least one electrically conductive structure, and electrically conductive structure |
| 09/13/2007 | WO2007087162A3 Multilayer imageable element containing sulfonamido resin |
| 09/13/2007 | WO2006062575A3 Microfabrication using patterned topography and self-assembled monolayers |
| 09/13/2007 | US20070212934 Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component |
| 09/13/2007 | US20070212914 Discrete electronic component and related assembling method |
| 09/13/2007 | US20070212901 Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven |
| 09/13/2007 | US20070212883 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material |
| 09/13/2007 | US20070212564 Silver Powder Coated With Silver Compound And Method for Producing The Same |
| 09/13/2007 | US20070212521 Anisotropic Conductive Film and a Method of Manufacturing the Same |
| 09/13/2007 | US20070212478 Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device |
| 09/13/2007 | US20070210483 Used for forming a pattern (a hyperfine pattern, a micro pattern, and the like) on a substrate (a silicon substrate, a ceramic substrate, a metal layer, a polymer layer and the like) in a manufacturing process of an integrated circuit or electronic device; gas permeability, high strength, flexibility |
| 09/13/2007 | US20070210452 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 09/13/2007 | US20070210393 Lithographic Method Products Obtained And Use Of Said Method |
| 09/13/2007 | US20070209831 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/13/2007 | US20070209491 Method and Related Apparatus for Cutting a Product from a Sheet Material |
| 09/13/2007 | US20070209449 Method for manufacturing a fluid pressure measurement unit and a component for being used in a fluid pressure measurement unit |
| 09/13/2007 | US20070209202 Method For the Production of Circuit Boards and/or Corresponding Constructs |
| 09/13/2007 | US20070209201 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
| 09/13/2007 | US20070209200 Circuit Board, Method Of Manufacturing Circuit Board, And Display Device Having Circuit Board |
| 09/13/2007 | US20070209199 Methods of making microelectronic assemblies |
| 09/13/2007 | US20070209198 Device For Inspecting And Rotating Electronic Components |
| 09/13/2007 | US20070209176 Voltage controlled oscillator |
| 09/13/2007 | US20070209174 Method of producing a topology-optimized electrode for a resonator in thin-film technology |
| 09/13/2007 | DE112005000401T5 Systeme und Verfahren zur Erfassung von Fehlern in aufgedruckter Lötpaste Systems and methods for detecting errors in printed solder paste |
| 09/13/2007 | DE10256250B4 Lötsystem zum Auflöten von elektronischen Komponenten mittels eines Lots auf ein flexibles Substrat Soldering system for soldering electronic components by means of a solder on a flexible substrate |
| 09/13/2007 | DE102006010942A1 Verfahren zur Herstellung mindestens einer elektrisch leitenden Struktur sowie elektrisch leitende Struktur A process for producing at least one electrically conductive structure and electrically conductive structure |
| 09/13/2007 | DE102005013763B4 Herstellungsverfahren für eine Anordnung zur Wärmeableitung A method for manufacturing an arrangement for heat dissipation |
| 09/13/2007 | DE10113474B4 Elektrische Schaltung Electrical circuit |
| 09/13/2007 | CA2644460A1 Method and process of manufacturing robust high temperature solder joints |
| 09/12/2007 | EP1833290A1 Electronic component production method and electronic component production equipment |
| 09/12/2007 | EP1833286A1 Wiring board and wiring board manufacturing method |
| 09/12/2007 | EP1833285A1 Electronic component mounting method and electronic component mounting structure |
| 09/12/2007 | EP1833284A1 System and Method for Assembling Components in an Electronic Device |
| 09/12/2007 | EP1833089A2 Method of producing a conductor substrate for mounting a semiconductor element |
| 09/12/2007 | EP1832636A1 Anisotropic conductive adhesive |
| 09/12/2007 | EP1832149A1 Method for creating circuit assemblies |
| 09/12/2007 | EP1832148A1 Circuit boards |
| 09/12/2007 | EP1832147A1 Wiring method and device |
| 09/12/2007 | EP1831966A1 Cap for an electrical connector |
| 09/12/2007 | EP1831432A2 Electrical, plating and catalytic uses of metal nanomaterial compositions |
| 09/12/2007 | EP1685751B1 Method of soldering electronic component having solder bumps to substrate |
| 09/12/2007 | EP0985333B1 Process for modification of surfaces |
| 09/12/2007 | EP0883173B1 Circuit board for mounting electronic parts |
| 09/12/2007 | CN200947347Y Novel mountable magnetic head |
| 09/12/2007 | CN101036424A 印刷电路板印刷系统和方法 PCB printing system and method |
| 09/12/2007 | CN101036423A Method for producing conductive pattern material |
| 09/12/2007 | CN101036422A Long film circuit board, and production method and production device therefor |
| 09/12/2007 | CN101036421A Solderless component packaging and mounting |
| 09/12/2007 | CN101035425A Side cover assembly of feeder |
| 09/12/2007 | CN101035416A Method of manufacturing wiring substrate |
| 09/12/2007 | CN101035415A Encapsulation method of dual base board electronic module for the radio communication |
| 09/12/2007 | CN101035414A Method of manufacturing wiring substrate |
| 09/12/2007 | CN101035413A Method of manufacturing wiring substrate |