Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2007
06/14/2007DE102005058794A1 Vorrichtung und getaktetes Verfahren zur Drucksinterverbindung Apparatus and method for pulsed pressure sintering connection
06/14/2007DE102005058739A1 Method for heating articles in the vapor phase, useful particularly for soldering electronic components, uses heat-transfer fluid of fixed boiling point for controlled transfer of heat
06/14/2007DE102005058089A1 Method of inserting a plug part or pin into a connector bore of a printed circuit board by pressing the pin into the bore after heating
06/14/2007DE102004060416B4 Verfahren zur Befestigung eines Koaxialkabels an einer Leiterplatte und entsprechende Leiterplatte A method of attaching a coaxial cable to a printed circuit board and the corresponding printed circuit board
06/13/2007EP1796446A2 Solder resist composition and printed circuit boards
06/13/2007EP1796445A2 Multilayer printed circuit board
06/13/2007EP1796217A1 Method for producing electrical connections between circuit boards
06/13/2007EP1796137A2 Apparatus and clocked method for pressure sintering
06/13/2007EP1796026A1 A radio frequency device
06/13/2007EP1795296A1 Flux for soldering
06/13/2007EP1795058A1 Flexible cable for high-speed interconnect
06/13/2007EP1794351A2 Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
06/13/2007EP1794217A1 Process for the preparation of a fibre-reinforced resin-coated sheet
06/13/2007EP1614125B1 Method for producing soldering globules on an electrical component
06/13/2007EP1521862B1 Immersion plating of silver
06/13/2007EP1436818B1 Process relating to polymers
06/13/2007EP1150551B1 Conductive connecting pin and package board
06/13/2007EP0928129B1 Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate
06/13/2007CN2912207Y Feeding module of automatic terminal feeding apparatus
06/13/2007CN2912194Y Internal layer adhesive mould of flexible circuit board
06/13/2007CN2912193Y Negative presoaking apparatus
06/13/2007CN1981566A Method for producing printed circuit board structures comprising via holes, electronic device unit, and use of a flexible strip conductor film in this device unit
06/13/2007CN1980970A 改性聚酰亚胺树脂和可固化的树脂组合物 Modified polyimide resin and a curable resin composition
06/13/2007CN1980799A Photogravure press and method for manufacturing multilayer ceramic electronic component
06/13/2007CN1980770A Gripper for holding a piece to be machined in a grinding machine
06/13/2007CN1980767A Methods of drilling through-holes in homogenous and non-homogeneous substrates
06/13/2007CN1980566A Positioning method and device for flexble printed circuit wiring plate relative cramping means
06/13/2007CN1980547A Electronic apparatus and method of manufacturing the same
06/13/2007CN1980542A Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
06/13/2007CN1980541A Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
06/13/2007CN1980540A Circuit board structure and making method
06/13/2007CN1980539A Method for electric connection end of circuit
06/13/2007CN1980538A Method for forming circuit-board electric connection end
06/13/2007CN1980537A Crimp jointing method of flexible circuit and filling layer special for said method
06/13/2007CN1980536A Production method of increasing electronic element heat-resisting effect for network and communication use, and product thereof
06/13/2007CN1980535A Apparatus and method for clearing circuit board drill bits
06/13/2007CN1980534A Protrusion forming method
06/13/2007CN1980533A Method of forming circuit pattern on printed circuit board
06/13/2007CN1980532A Arc-shape winding system and method
06/13/2007CN1980531A Circuit board conductive lug structure and making method
06/13/2007CN1980530A Method for making circuit-board conductive lug structure
06/13/2007CN1980529A Circuit information verifying method and system for circuit lay-out
06/13/2007CN1980528A Power-supply learthing circuit auxiliary wiring method for circuit lay-out
06/13/2007CN1980527A Differential signal circuit displaying method for circuit lay-out
06/13/2007CN1980525A Circuit-board welding plate of connecting element welding leg, its connection structure and connection method
06/13/2007CN1980522A Optical identifying welding plate for printed circuit board and mfg. method
06/13/2007CN1980519A Static electricity discharge structure for organic display device and fabricating method of there
06/13/2007CN1979673A Wired circuit board and producing method thereof
06/13/2007CN1321550C Flexible wiring plate and producing method thereof
06/13/2007CN1321549C Flexible printed circuit base material
06/13/2007CN1321481C Connection structure for display module and printed base plate and semiconductor device, display module and electronic member
06/13/2007CN1321289C Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid
06/13/2007CN1321226C Plating machine and process for producing film carrier tapes for mounting electronic parts
06/13/2007CN1320996C Bonding sheet and one-side metal-clad laminate
06/12/2007US7230818 Printed circuit board and manufacturing method thereof
06/12/2007US7230339 Copper ring solder mask defined ball grid array pad
06/12/2007US7230330 Semiconductor die packages with recessed interconnecting structures
06/12/2007US7230278 Optoelectronic semiconductor device and light signal input/output device
06/12/2007US7230188 Printed wiring board and its manufacturing method
06/12/2007US7230187 Printed wire board and associated mobile terminal
06/12/2007US7229939 Multilayer ceramic substrate and method for manufacture thereof
06/12/2007US7229933 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
06/12/2007US7229913 Stitched micro-via to enhance adhesion and mechanical strength
06/12/2007US7229857 Method for producing a protection for chip edges and system for the protection of chip edges
06/12/2007US7229856 Method of manufacturing electronic part packaging structure
06/12/2007US7229748 Method for forming a micro pattern, micro pattern, method for fabricating a mold for forming the micro pattern through transcription, and mold for forming the micro pattern through transcription
06/12/2007US7229297 Method and system for making and using an electrical connection between a conductor and a circuit board
06/12/2007US7229291 Flexible ring interconnection system
06/12/2007US7229145 Method of jetting viscous medium
06/12/2007US7229018 Manufacture of RFID tags and intermediate products therefor
06/12/2007US7228623 Process for fabricating a multi layer circuit assembly
06/12/2007US7228620 Tape guide and magazine at a component machine
06/12/2007CA2303318C Cover member for sealed circuit board assembly
06/07/2007WO2007064628A1 Circuit substrate and method of manufacture
06/07/2007WO2007063949A1 Mounting board capable of evaluating wiring pattern characteristics
06/07/2007WO2007063692A1 Ceramic substrate, electronic device, and process for producing ceramic substrate
06/07/2007WO2007043544A9 Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition prepared therefrom
06/07/2007WO2007036610A8 Attachment of conductor structure to object
06/07/2007WO2007023030A3 Method for soldering smd components, printed circuit board and reflow soldering furnace therefor
06/07/2007US20070129816 Component feeder exchange diagnostic tool
06/07/2007US20070129502 Curable resin composition
06/07/2007US20070128924 Flat connector
06/07/2007US20070128911 Design and method for plating pci express (pcie) edge connector
06/07/2007US20070128905 Transparent conducting structures and methods of production thereof
06/07/2007US20070128772 Metal-base circuit board and its manufacturing method
06/07/2007US20070128371 Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
06/07/2007US20070127224 Electronic circuit device and method of manufacturing the same
06/07/2007US20070126725 Display apparatus and assembly of its driving circuit
06/07/2007US20070126534 Dielectric resonator device, oscillator and transmitter-receiver apparatus
06/07/2007US20070126110 Circuit film with bump, film package using the same, and related fabrication methods
06/07/2007US20070126089 Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein
06/07/2007US20070125989 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
06/07/2007US20070125833 Method for improved high current component interconnections
06/07/2007US20070124929 Method for manufacturing printed wiring board and printed wiring board
06/07/2007US20070124928 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
06/07/2007US20070124927 Apparatus and method for assembling electronic circuits
06/07/2007US20070124926 Circuit board and method for manufacturing the same
06/07/2007US20070124918 Method For Fabricating Embedded Thin Film Resistors Of Printed Circuit Board
06/06/2007EP1793658A1 Wiring board and wiring board module
06/06/2007EP1793657A1 Method for manufacturing ceramic electronic component