| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/30/2007 | EP1791410A2 Multilayer printed circuit board |
| 05/30/2007 | EP1791408A1 Method for producing porous resin substrate having hole bored therethrough and porous resin substrate provided with hole having inner wall surface imparted with electroconductivity |
| 05/30/2007 | EP1791407A1 Method for manufacturing multilayer printed circuit board with through hole |
| 05/30/2007 | EP1791406A1 Method of forming a composite standoff on a ciruit board |
| 05/30/2007 | EP1791405A2 Wiring board and method of manufacturing same |
| 05/30/2007 | EP1791069A1 Method for designing electronic component |
| 05/30/2007 | EP1790044A2 Electrical connector with stepped housing |
| 05/30/2007 | EP1790022A1 Depositing material on photosensitive material |
| 05/30/2007 | EP1789527A1 Cleaning compositions for microelectronics substrates |
| 05/30/2007 | EP1789205A1 Method of forming uniform lines on a substrate |
| 05/30/2007 | EP1714533B1 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board |
| 05/30/2007 | EP1468041B1 Resin composition |
| 05/30/2007 | EP1446993A4 I-channel surface-mount connector with extended flanges |
| 05/30/2007 | EP1427591A4 Connection module |
| 05/30/2007 | EP1392495B1 Three-dimensional nonwoven substrate for circuit board |
| 05/30/2007 | EP1324867A4 Multi-layered structures and methods for manufacturing the multi-layered structures |
| 05/30/2007 | EP1272019B1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| 05/30/2007 | EP1259103B1 Multilayer printed wiring board and method for producing multilayer printed wiring board |
| 05/30/2007 | EP1062850B1 Method for producing printed conductor structures |
| 05/30/2007 | EP0966185B1 Method of manufacturing a printed wiring board |
| 05/30/2007 | CN2907176Y Flexible circuit board pressing device and quick pressing machine using the same |
| 05/30/2007 | CN1973590A Printed circuit board and manufacturing method thereof |
| 05/30/2007 | CN1973589A Method for production of electronic circuit board |
| 05/30/2007 | CN1973588A Method for forming electrical conductors on a substrate |
| 05/30/2007 | CN1973587A Hybrid electronic component and method for manufacturing the same |
| 05/30/2007 | CN1973369A Process for producing a ceramic printed-circuit board |
| 05/30/2007 | CN1972779A Solder paste and process |
| 05/30/2007 | CN1972571A Method for manufacturing multilayer wiring substrate with cable |
| 05/30/2007 | CN1972570A Manufacture process of conductive structure formation of circuit board |
| 05/30/2007 | CN1972569A A manufacturing method of via-hole of circuit board |
| 05/30/2007 | CN1972568A A manufacturing method of formation of circuit board electricity connection end |
| 05/30/2007 | CN1972567A Welding substrate processing clamp and method for attaching the solder powder to electronic circuit substrate |
| 05/30/2007 | CN1972566A Flow tray, solder flow device and soldering method |
| 05/30/2007 | CN1972565A System for mounting components |
| 05/30/2007 | CN1972564A Method forming via hole that utilizes lazer drill |
| 05/30/2007 | CN1972563A Conductor-clad laminate, wiring circuit board, and processes for producing the same |
| 05/30/2007 | CN1972562A A manufacturing method of pad on circuit board substrate and pad |
| 05/30/2007 | CN1972560A A flexible printed circuit board and its manufacturing method |
| 05/30/2007 | CN1972559A Hybrid multilayered circuit board and its manufacturing method |
| 05/30/2007 | CN1972557A Flexible copper clad laminate, film carrier tape manufactured using the same, and method for manufacturing same, and flexible printed circuit board, and semiconductor device |
| 05/30/2007 | CN1972556A Via stub termination structures and methods for making same |
| 05/30/2007 | CN1971899A Package substrate |
| 05/30/2007 | CN1971401A Camera module using a printed circuit board having the end difference |
| 05/30/2007 | CN1970290A Method and apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers |
| 05/30/2007 | CN1319428C Electronic circuit unit |
| 05/30/2007 | CN1319426C Method for preparing circuit board |
| 05/30/2007 | CN1319425C Plane display capable of preventing heat expansion effect accumulating and its printing circuit board |
| 05/30/2007 | CN1319423C Printed wiring board and semiconductor device |
| 05/30/2007 | CN1319422C Hybrid module and making method thereof and mounting method thereof |
| 05/30/2007 | CN1319157C Multilayer circuit board and semiconductor device |
| 05/30/2007 | CN1319140C Circuit device mounitng method |
| 05/30/2007 | CN1319131C Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 05/30/2007 | CN1319130C Apparatus for handling semiconductor substrate, method for handling semiconductor substrate |
| 05/30/2007 | CN1318880C Scanning device |
| 05/30/2007 | CN1318823C Text board assembly and manufacturing method thereof |
| 05/30/2007 | CN1318644C Stack structure of electronic apparatus and method for electroless plating of gold |
| 05/30/2007 | CN1318530C Adhesive agent, method for connecting wiring terminals and wiring structure |
| 05/30/2007 | CN1318474C Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| 05/30/2007 | CN1318473C Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof |
| 05/30/2007 | CN1318228C Printing plate, circuit board and method of printing circuit board |
| 05/30/2007 | CN1318172C Soldering method |
| 05/30/2007 | CN1318154C Figure forming method and manufacturing method of device |
| 05/29/2007 | US7225051 Closed-loop feedback for maximizing Cpk in progressive forming operations |
| 05/29/2007 | US7225018 Flyback transformer wire attach method to printed circuit board |
| 05/29/2007 | US7224846 Image coding apparatus and method, and program and recording medium |
| 05/29/2007 | US7224564 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 05/29/2007 | US7224425 System and method of manufacturing liquid crystal display wherein the bonding of the printed circuit film on the panel assembly is inspected |
| 05/29/2007 | US7224424 Drive IC and display device having the same |
| 05/29/2007 | US7224073 Substrate for solder joint |
| 05/29/2007 | US7224072 Mounting structure for ball grid array type IC |
| 05/29/2007 | US7224071 System and method to increase die stand-off height |
| 05/29/2007 | US7224066 Bonding material and circuit device using the same |
| 05/29/2007 | US7224054 Semiconductor device and system having semiconductor device mounted thereon |
| 05/29/2007 | US7224046 Multilayer wiring board incorporating carbon fibers and glass fibers |
| 05/29/2007 | US7223921 Composite comprised of flat conductor elements |
| 05/29/2007 | US7223703 Method of forming patterns |
| 05/29/2007 | US7223636 Manufacturing method of semiconductor device and semiconductor device |
| 05/29/2007 | US7223633 Method for solder crack deflection |
| 05/29/2007 | US7223631 Windowed package having embedded frame |
| 05/29/2007 | US7223481 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 05/29/2007 | US7223480 a metal layer having a metal oxide film laminated to an insulating layer is to be subjected to an etching processing to form a pattern; measuring concentration of oxygen and metal measured from the surface of the metal layer towards the inside of the metal layer in a time-elapsing manner |
| 05/29/2007 | US7223349 Method and apparatus for surface processing of printed wiring board |
| 05/29/2007 | US7223320 Method and apparatus for expanding a semiconductor wafer |
| 05/29/2007 | US7223316 Method for manufacturing electronic component |
| 05/29/2007 | US7223128 Surface mount modular jack |
| 05/29/2007 | US7222776 Printed wiring board and manufacturing method therefor |
| 05/29/2007 | US7222727 Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials |
| 05/29/2007 | US7222421 Circuit substrate manufacturing method |
| 05/29/2007 | US7222420 Method for making a front and back conductive substrate |
| 05/29/2007 | US7222419 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 05/29/2007 | US7222414 Component transfer systems |
| 05/24/2007 | WO2007059152A1 Circuit material, multi-layer circuits, and methods of manufacture thereof |
| 05/24/2007 | WO2007058988A1 Padless substrate for surface mounted components |
| 05/24/2007 | WO2007058897A1 Method for connecting printed circuit boards |
| 05/24/2007 | WO2007058284A1 Wet etching method and wet etching apparatus |
| 05/24/2007 | WO2007058159A1 Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
| 05/24/2007 | WO2007058147A1 Printed wiring board, method for manufacturing same and use of same |
| 05/24/2007 | WO2007058142A1 Method of manufacturing circuit board having electronic part |
| 05/24/2007 | WO2007057528A1 Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
| 05/24/2007 | WO2007008992A3 Apparatus and methods for continuously depositing a pattern of material onto a substrate |