| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/09/2007 | WO2007088695A1 Soldering apparatus, soldering method and method for manufacturing semiconductor device |
| 08/09/2007 | WO2007088647A1 Method of mounting electric part |
| 08/09/2007 | WO2007087982A1 Printed circuit board with additional functional elements, method of production and use |
| 08/09/2007 | WO2007087981A1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use |
| 08/09/2007 | WO2005041624A3 Method for printed circuit board panelization |
| 08/09/2007 | WO2004062477A3 Improved surface for use on implantable device |
| 08/09/2007 | US20070185297 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet |
| 08/09/2007 | US20070185286 Organic solvent, polyimidesiloxane soluble therein, curable component such as an epoxy compound or a polyvalent isocyanate compound, and silicone defoamer; provides polyimidesiloxane solution excellent in defoaming ability and that can maintain wettability of outer lead bonded on wiring board |
| 08/09/2007 | US20070185243 Conductive adhesive |
| 08/09/2007 | US20070184968 Flat panel direct methanol fuel cell and method of making the same |
| 08/09/2007 | US20070184743 Methods and devices for manufacturing of electrical components and laminated structures |
| 08/09/2007 | US20070184604 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board |
| 08/09/2007 | US20070182059 Resin molded article with reduced dielectric loss tangent and production method therefor |
| 08/09/2007 | US20070182016 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion |
| 08/09/2007 | US20070182010 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor |
| 08/09/2007 | US20070182000 Module part |
| 08/09/2007 | US20070181994 Circuit board manufacturing method and circuit board |
| 08/09/2007 | US20070181858 Silver powder and method for producing same |
| 08/09/2007 | US20070181844 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 08/09/2007 | US20070181644 Component mounting method and component mounting apparatus |
| 08/09/2007 | US20070181431 Methods and Apparatus for Monitoring Deposition Quality During Conformable Contact Mask Plating Operations |
| 08/09/2007 | US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing |
| 08/09/2007 | US20070181218 Solder composition and method of bump formation therewith |
| 08/09/2007 | US20070181060 Direct Write™ System |
| 08/09/2007 | DE19757938B4 Isolationskamm für Multikontaktstecker Insulation comb for multi-contact connectors |
| 08/09/2007 | DE10327581B4 Konstruktion zum Montieren eines Aschlusses, ein Leiterplattenverbinder und Verfahren zum Montieren desselben The same structure for mounting a Aschlusses, a printed circuit board connector and method for mounting |
| 08/09/2007 | DE102007004088A1 Verfahren zum Herstellen einer Dünnfilmantenne A method of fabricating a thin film antenna |
| 08/09/2007 | DE102006025219A1 Produkt mit Leiter aus Zink oder einer Zink-Aluminium-Legierung Product manager with zinc or zinc-aluminum alloy |
| 08/09/2007 | DE102006015686B3 Printing goods e.g. solar cell wafer, transporting method, involves reapplying conveyor belt section for positioning printing goods in working area or movement of another belt section in working area depending on verification results |
| 08/09/2007 | DE102006004521A1 Setting up a connector of a flexible printed circuit comprises fixing an auxiliary support over the connector, using the auxiliary support to erect the connector at an angle about a bending line and undermolding the support |
| 08/09/2007 | DE102006004320A1 Leiterplatte mit funktionalen Elementen und selektiv gefüllten und thermisch leitfähigen Durchsteigelöchern sowie Herstellverfahren und Anwendung PCB with functional elements and selectively filled and thermally conductive step-through holes or production process and application |
| 08/09/2007 | DE102006003735A1 Anordnung zum Befestigen von elektronischen Bauelementen auf einem Träger Arrangement for mounting of electronic components on a carrier |
| 08/09/2007 | DE10134562B4 System und Verfahren zur elektrischen Kontaktierung und mechanischen Befestigung von Leiterplatten System and method for the electrical contacting and the mechanical fastening of printed circuit boards |
| 08/09/2007 | DE10008572B4 Verbindungseinrichtung für Leistungshalbleitermodule Connector for power semiconductor modules |
| 08/08/2007 | EP1816905A2 Printed wiring board and method of manufacturing the same |
| 08/08/2007 | EP1816904A1 Memory module with rubber spring connector |
| 08/08/2007 | EP1816653A1 Conductive paste and method for manufacturing multilayer printed wiring board using same |
| 08/08/2007 | EP1815968A1 Processing method, processing apparatus, and fine structure produced by the method |
| 08/08/2007 | EP1814764A1 Electronic device |
| 08/08/2007 | EP1814447A2 Process for through hole plating an electrically insulating substrate material |
| 08/08/2007 | EP1709849B1 Method of manufacturing a circuit carrier and the use of the method |
| 08/08/2007 | EP1451732A4 Parallel electronic design automation: shared simultaneous editing |
| 08/08/2007 | EP1344396A4 Folder type multi display device |
| 08/08/2007 | EP1252654B1 A method for transferring and stacking of semiconductor devices |
| 08/08/2007 | EP0927507B1 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same |
| 08/08/2007 | EP0884128B1 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
| 08/08/2007 | CN2932917Y Wave soldering furnace for electronic component assembly |
| 08/08/2007 | CN2932916Y An anti-pest circuit device |
| 08/08/2007 | CN2932618Y Spherical grating array chip balling and rework device |
| 08/08/2007 | CN2932617Y Thin membrane stripping equipment |
| 08/08/2007 | CN2931407Y Bearing shelf tilt angle adjusting device for inclined stand type retraction plate machine |
| 08/08/2007 | CN2930938Y Wave soldering equipment |
| 08/08/2007 | CN1331377C Wave soldering equipment |
| 08/08/2007 | CN1331376C Conductive sheet, product using the same, and manufacturing method thereof |
| 08/08/2007 | CN1331375C Multi-layer structure unit and its manufacturing method |
| 08/08/2007 | CN1331228C Mixed type module |
| 08/08/2007 | CN1331227C Circuit board and production method therefor |
| 08/08/2007 | CN1331225C Device for shielding transmission line to ground or power supply |
| 08/08/2007 | CN1331218C Packaging assembly and method of assembling the same |
| 08/08/2007 | CN1331204C Lead-free solder structure and method for high fatigue life |
| 08/08/2007 | CN1331191C Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, |
| 08/08/2007 | CN1331170C Multi-layer and user-configurable micro-printed circuit board |
| 08/08/2007 | CN1331164C Chip resistor and method of manufacturing the same |
| 08/08/2007 | CN1330494C Electronic-component alignment method and apparatus therefor |
| 08/08/2007 | CN1330482C Apparatus and method of printing screen |
| 08/08/2007 | CN1330429C Ultrafine fluid jet apparatus |
| 08/08/2007 | CN101015236A 配线板 Wiring board |
| 08/08/2007 | CN101015235A Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 08/08/2007 | CN101015073A Depositing material on photosensitive material |
| 08/08/2007 | CN101014442A Solder composition, connecting process using soldering, and connection structure using soldering |
| 08/08/2007 | CN101014231A Flexible metal clad laminate and manufacturing method thereof |
| 08/08/2007 | CN101014230A Method for manufacturing printed circuit board with thin film capacitor embedded therein |
| 08/08/2007 | CN101014229A Method and equipment for disassembling components entirely from waste circuit board |
| 08/08/2007 | CN101014228A Method and equipment for disassembling circuit board using non-contacted impact |
| 08/08/2007 | CN101014227A Method and equipment for disassembling circuit board using contacted impact |
| 08/08/2007 | CN101014225A 多层印刷电路板及其制造方法 Multilayer printed wiring board and its manufacturing method |
| 08/08/2007 | CN101013768A Ablative method for forming RF ceramic block filters |
| 08/08/2007 | CN101013686A Interconnect substrate, semiconductor device, and method of manufacturing the same |
| 08/08/2007 | CN101013685A Package substrate |
| 08/08/2007 | CN101013658A Material supplying device and method |
| 08/08/2007 | CN101011780A Method of forming via hole using laser beam |
| 08/08/2007 | CN101011779A Laser processing method, laser soldering method, and laser processing apparatus |
| 08/07/2007 | US7253883 Machine for exposing printed circuit panels with gas balloons and mechanical spacers |
| 08/07/2007 | US7253526 Semiconductor packaging substrate and method of producing the same |
| 08/07/2007 | US7253512 Organic dielectric electronic interconnect structures and method for making |
| 08/07/2007 | US7253510 Ball grid array package construction with raised solder ball pads |
| 08/07/2007 | US7253364 Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same |
| 08/07/2007 | US7253079 Coplanar mounting member for a MEM sensor |
| 08/07/2007 | US7253029 Non-magnetic, hermetically-sealed micro device package |
| 08/07/2007 | US7253027 Method of manufacturing hybrid integrated circuit device |
| 08/07/2007 | US7253023 Multilayer wiring circuit board |
| 08/07/2007 | US7252923 Lithography; offset printing; using metal oxide photocatalyst |
| 08/07/2007 | US7252891 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
| 08/07/2007 | US7252883 Accuracy connectors; surface treated metal particles as core overcoated with polymer |
| 08/07/2007 | US7252881 Multilayer structure and multilayer wiring board using the same |
| 08/07/2007 | US7252861 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids |
| 08/07/2007 | US7252699 Forming patterned film by exposure to radiation; three-dimensional microstructure; one step |
| 08/07/2007 | US7252366 Inkjet printhead with high nozzle area density |
| 08/07/2007 | US7251885 Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board |
| 08/07/2007 | US7251883 Electronic-component alignment method and apparatus therefor |