| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/03/2007 | CN101047161A Design of low inductance embedded capacitor layer connections |
| 10/03/2007 | CN101047136A Manufacturing method of mobile storage equipment |
| 10/03/2007 | CN101047090A Image correction device and coating unit thereof |
| 10/03/2007 | CN101047067A Thin film capacitor and method of manufacturing the thin film capacitor |
| 10/03/2007 | CN101047062A Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
| 10/03/2007 | CN101045360A Silk-screen printing device |
| 10/03/2007 | CN101045271A 激光加工方法 The laser processing method |
| 10/03/2007 | CN100341391C Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| 10/03/2007 | CN100341388C Device and method for aligning assembly with electric circuit board |
| 10/03/2007 | CN100341387C Method for automatic generating device mark in printed circuit board design |
| 10/03/2007 | CN100341242C Master slice and substrate element and producing method therefor |
| 10/03/2007 | CN100341148C Wiring substrate |
| 10/03/2007 | CN100341141C Wiring substrate |
| 10/03/2007 | CN100341137C Semiconductor multi-layer wiring plate and forming method thereof |
| 10/03/2007 | CN100341126C Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| 10/03/2007 | CN100341125C Eqipment and method for mounting electronic part |
| 10/03/2007 | CN100340922C Impression mask photoetching |
| 10/03/2007 | CN100340864C Apparatus and method for testing circuit board |
| 10/03/2007 | CN100340685C Lead-free tin-silver-copper alloy solder composition |
| 10/03/2007 | CN100340632C Method for roughening copper surfaces for bonding to substrates |
| 10/03/2007 | CN100340384C Stamping device for generally flat articles |
| 10/02/2007 | US7276840 Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure |
| 10/02/2007 | US7276793 Semiconductor device and semiconductor module |
| 10/02/2007 | US7276673 Solder bonding method and solder bonding device |
| 10/02/2007 | US7276445 Method for forming pattern using printing method |
| 10/02/2007 | US7276438 Method of manufacturing wiring substrate |
| 10/02/2007 | US7276436 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 10/02/2007 | US7276397 Integrated circuit package separator methods |
| 10/02/2007 | US7276388 Method, system, and apparatus for authenticating devices during assembly |
| 10/02/2007 | US7276296 Liquid alloy, which in turn solidifies to form a tenacious deposit on a substrate; tin-bismuth solders for electronic packaging; bath includes an organic diluent having a boiling point higher than an eutectic point in a phase diagram of the first and second metals |
| 10/02/2007 | US7276292 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40. |
| 10/02/2007 | US7276267 The first supporting substrate is a metallizeable plastic and the second supporting substrate a non-metallizeable plastic that is able to be activated by a laser beam to produce a metallization pattern connected with uncovered areas of the first substrate |
| 10/02/2007 | US7276185 Easily ensure the conductivity at the same level as an Ag bulk by a low temperature treatment |
| 10/02/2007 | US7275937 Optoelectronic module with components mounted on a flexible circuit |
| 10/02/2007 | US7275811 High nozzle density inkjet printhead |
| 10/02/2007 | US7275676 Apparatus for locating conductive spheres utilizing screen and hopper of solder balls |
| 10/02/2007 | US7275316 Method of embedding passive component within via |
| 10/02/2007 | US7275315 Method for repair soldering of multi-pole miniature plug connectors |
| 10/02/2007 | US7275314 Electronic component mounting apparatus and electronic component mounting method |
| 10/02/2007 | US7275298 Ultrasonic printed circuit board transducer |
| 10/02/2007 | CA2275214C Process to electrolytically deposit copper layers |
| 10/02/2007 | CA2211875C Low dielectric loss glasses |
| 09/27/2007 | WO2007109483A1 Shifted segment layout for differential signal traces to mitigate bundle weave effect |
| 09/27/2007 | WO2007108946A1 Thermally printable electrically conductive ribbon and method |
| 09/27/2007 | WO2007108539A1 Flexible wiring board and heat seal connector |
| 09/27/2007 | WO2007108290A1 Bump forming method and bump forming apparatus |
| 09/27/2007 | WO2007108237A1 Multilayer printed-circuit board, and its parts mounting method |
| 09/27/2007 | WO2007108188A1 Electroconductive ink |
| 09/27/2007 | WO2007108184A1 Temporary fixing device |
| 09/27/2007 | WO2007087981B1 Flexible printed circuit board with additional functional element and a milled notch, method of production and use |
| 09/27/2007 | WO2007079156A3 Substrates for electronic circuitry type applications |
| 09/27/2007 | WO2005091817A3 Method and apparatus for venting an electronic control module |
| 09/27/2007 | US20070224731 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 09/27/2007 | US20070224534 Method for Forming Thick Film Pattern, Method for Manufacturing Electronic Component, and Photolithography Photosensitive Paste |
| 09/27/2007 | US20070224511 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment |
| 09/27/2007 | US20070224397 Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection Method |
| 09/27/2007 | US20070222062 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 09/27/2007 | US20070222058 Stitched micro-via to enhance adhesion and mechanical strength |
| 09/27/2007 | US20070221931 Optoelectronic semiconductor device and light signal input/output device |
| 09/27/2007 | US20070221887 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 09/27/2007 | US20070221712 Thermosetting flux and solder paste |
| 09/27/2007 | US20070221404 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
| 09/27/2007 | US20070221398 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device |
| 09/27/2007 | US20070221315 Common carrier |
| 09/27/2007 | US20070220745 Method for Producing Traverse Connections in Printed Circuit Board Sets |
| 09/27/2007 | US20070220744 Wiring Circuit Board Producing Method and Wiring Circuit Board |
| 09/27/2007 | US20070220743 Electric current bonding apparatus and electric current bonding method |
| 09/27/2007 | US20070220725 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards |
| 09/27/2007 | DE202007010405U1 Anschlusselement Connection element |
| 09/27/2007 | DE202005021341U1 Trenneinrichtung für flächenhafte Werkstücke, insbesondere zum Vereinzeln von bestückten Leiterplatten Separating device for planar workpieces, especially for separating assembled PCBs |
| 09/27/2007 | DE112005002368T5 Eine Vorrichtung und ein Verfahren zum Verbessern der Signalebenenübergänge bei gedruckten Schaltkarten An apparatus and a method for improving the signal level transitions in printed circuit boards |
| 09/27/2007 | DE102006013825A1 Leiterplatten-Nutzen bzw. Leiterplatte mit Bauteilfixierung PCB benefit or printed circuit board with component fixation |
| 09/27/2007 | DE102006005940B3 Kontaktvorrichtung Contact device |
| 09/27/2007 | DE10048873B4 Verfahren und Vorrichtung zur Herstellung einer Mehrschichtstruktur für eine Leiterplatine Method and apparatus for producing a multi-layer structure for a printed circuit board |
| 09/26/2007 | EP1838141A1 Laminated body and method for producing the same |
| 09/26/2007 | EP1837383A1 Die-attach composition for high power semiconductors |
| 09/26/2007 | EP1837119A1 Solder paste and electronic device |
| 09/26/2007 | EP1694886B1 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 09/26/2007 | EP1678351B1 Method and system for selectively coating metal surfaces |
| 09/26/2007 | EP1658313B1 Photopatterning conductive electrode layers with electrically-conductive polymer |
| 09/26/2007 | EP1604178A4 Liquid level sending unit with flexible sensor board |
| 09/26/2007 | EP1597194A4 Templated cluster assembled wires |
| 09/26/2007 | EP1444549A4 Method of patterning electrically conductive polymers |
| 09/26/2007 | CN200953698Y Printed circuit board drawing device |
| 09/26/2007 | CN200953691Y Automatic pin-punching machine |
| 09/26/2007 | CN200953690Y Reinforced pressure clamp device for flexible circuit board |
| 09/26/2007 | CN200953689Y 连接接口 Connection interface |
| 09/26/2007 | CN101044807A Multilayer ceramic substrate, method for making the same, and composite green sheet for making multilayer ceramic substrate |
| 09/26/2007 | CN101044806A Multilayer printed wiring board and method for producing same |
| 09/26/2007 | CN101044805A Hybrid multilayer substrate and method for manufacturing the same |
| 09/26/2007 | CN101044804A Method for producing porous resin substrate having hole bored therethrough and porous resin substrate provided with hole having inner wall surface imparted with electroconductivity |
| 09/26/2007 | CN101044803A Conductive pattern forming apparatus |
| 09/26/2007 | CN101043795A Electronic component having shield case and method for manufacturing the same |
| 09/26/2007 | CN101043794A Circuit device mounting method and press device |
| 09/26/2007 | CN101043793A Connection device |
| 09/26/2007 | CN101043792A Flexible PCB embedded in portable terminal machine and its manufacturing method |
| 09/26/2007 | CN101043791A Insulation structure for high thermal condition and its manufacturing method |
| 09/26/2007 | CN101043787A Wiring board in which silver is deposited near via-conductor and method for manufacturing wiring board |
| 09/26/2007 | CN101042356A Method for confirming maintenance station and making substrates as defect |
| 09/26/2007 | CN101041898A Electron attachment assisted formation of electrical conductors |