| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/07/2007 | US7251882 Method for assembling micro-components to binding sites |
| 08/07/2007 | US7251880 Method and structure for identifying lead-free solder |
| 08/02/2007 | WO2007086568A1 Resin film, adhesive sheet, wiring substrates, and electronic devices |
| 08/02/2007 | WO2007086555A1 Boring method and boring device |
| 08/02/2007 | WO2007086551A1 Printed-circuit board, and method for manufacturing the same |
| 08/02/2007 | WO2007086525A1 Substrate structure and electronic device |
| 08/02/2007 | WO2007086510A1 Plating apparatus and plating method |
| 08/02/2007 | WO2007086509A1 Method of manufacturing printed wiring board |
| 08/02/2007 | WO2007086508A1 Method and apparatus for mounting solder ball |
| 08/02/2007 | WO2007086498A1 Substrate with built-in semiconductor element and built-in semiconductor element type multilayered circuit board |
| 08/02/2007 | WO2007086454A1 Additive added to solution for electrolytic copper plating using anode of phosphorated copper, solution for electrolytic copper plating and method of electrolytic copper plating |
| 08/02/2007 | WO2007086433A1 Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods |
| 08/02/2007 | WO2007086385A1 Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board |
| 08/02/2007 | WO2007086359A1 Method for electroconductive circuit formation |
| 08/02/2007 | WO2007086184A1 Method for regulating capacitance value of built-in capacitor in multilayered ceramic substrate, and multilayered ceramic substrate and process for producing the same |
| 08/02/2007 | WO2007086152A1 Substrate structure |
| 08/02/2007 | WO2007085563A1 Method of applying a solder deposit consisting of a solder material to a substrate by cold gas spraying, and powdery solder material, wherein the solder material contains powdery soft solder and powdery aluminium |
| 08/02/2007 | WO2007031712A3 Method of forming conductive tracks |
| 08/02/2007 | WO2006038011A3 Active filler particles in inks |
| 08/02/2007 | US20070180420 Designing a circuit apparatus with multiple propagation speeds of signals |
| 08/02/2007 | US20070179332 Method of processing multicomponent, composite and combined materials and use of so separated components |
| 08/02/2007 | US20070178774 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity |
| 08/02/2007 | US20070178721 Press-Fitting Head |
| 08/02/2007 | US20070178280 Method of pattern coating |
| 08/02/2007 | US20070178232 Tape compositions for the deposition of electronic features |
| 08/02/2007 | US20070178226 Printed circuit board |
| 08/02/2007 | US20070176619 Probe For Semiconductor Devices |
| 08/02/2007 | US20070176294 Thorough wiring board and method of manufacturing the same |
| 08/02/2007 | US20070176150 Reacting silver oxide with an amine compound and one or more of lactones, lactams or carbonates; ink jet printing ink at low cost to form a conductive film and circuit giving higher adhesion to a substrate, printability and conductivity after heat treatment than conventional methods |
| 08/02/2007 | US20070175658 High performance chip carrier substrate |
| 08/02/2007 | US20070175579 Anisotropic conductive adhesive sheet and connecting structure |
| 08/02/2007 | US20070175499 Method for cleaning surfaces using parallel flow |
| 08/02/2007 | US20070175296 Method of forming conductors at low temperatures using metallic nanocrystals and product |
| 08/02/2007 | US20070175025 Method of manufacturing multi-layer wiring board |
| 08/02/2007 | US20070175024 Electronic component transporting method |
| 08/02/2007 | US20070175023 Tamper barrier for electronic device |
| 08/02/2007 | DE4418426B4 Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls The semiconductor power module and method of manufacturing the semiconductor power module |
| 08/02/2007 | DE102006002729A1 Lötbauteilanordnung Lötbauteilanordnung |
| 08/02/2007 | DE102006002457A1 Leiterplattenkontaktierung PCB connections |
| 08/01/2007 | EP1814373A1 Multilayer printed wiring board and its manufacturing method |
| 08/01/2007 | EP1814372A1 Multilayer printed wiring board |
| 08/01/2007 | EP1814371A1 Printed circuit board and method of use thereof |
| 08/01/2007 | EP1814370A1 Printed circuit board and its designing method and designing method of ic package terminal and its connecting method |
| 08/01/2007 | EP1814369A1 Long film circuit board, and production method and production device therefor |
| 08/01/2007 | EP1813863A1 A HEAT-DISPERSING STRUCTURE FOR THE LEDs LAMP |
| 08/01/2007 | EP1813137A1 Method for electrically contacting punched grids |
| 08/01/2007 | EP1759039A4 Process for preparing a non-conductive substrate for electroplating |
| 08/01/2007 | EP1700516B1 Arrangement with a contact element |
| 08/01/2007 | EP1563085B1 Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
| 08/01/2007 | EP1495830B1 Solder alloy and soldered joint |
| 08/01/2007 | EP1427585A4 Security tag and process for making same |
| 08/01/2007 | EP1354503B1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 08/01/2007 | EP1113931B1 Method and apparatus for applying a viscous or paste material onto a substrate |
| 08/01/2007 | CN2930197Y Round angle punching structure of circuit board |
| 08/01/2007 | CN2930195Y Flexible and rigid interconnected plate |
| 08/01/2007 | CN1330227C Electromagnetic masking flexible circuit substrate |
| 08/01/2007 | CN1330225C Multilayer printed circuit board |
| 08/01/2007 | CN1330224C Protective circuit for storage battery, and storage battery pack |
| 08/01/2007 | CN1330223C Electronic device and its design method and making process, circuit substrate and electronic equipment |
| 08/01/2007 | CN1329980C Wiring part and its producing method |
| 08/01/2007 | CN1329979C Film carrier tape for electronic part and its producing method |
| 08/01/2007 | CN1329978C Substrate and method for producing same |
| 08/01/2007 | CN1329968C Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 08/01/2007 | CN1329932C Electronic element and inter base plate |
| 08/01/2007 | CN1329777C Clamping piece for clamping printed circuit board to explosure |
| 08/01/2007 | CN1329557C Direct electrolytic metallization of non-conducting substrate |
| 08/01/2007 | CN1329285C Method for producing a product having a structured surface |
| 08/01/2007 | CN1329130C Microdeposition control system and method |
| 08/01/2007 | CN1329111C Printing method using rubber stamp |
| 08/01/2007 | CN101010996A Ceramic multilayer substrate |
| 08/01/2007 | CN101010995A Multilayer body with differently microstructured areas provided with an electroconductive coating |
| 08/01/2007 | CN101010994A Method for manufacturing an electronics module |
| 08/01/2007 | CN101010675A Method for designing electronic component |
| 08/01/2007 | CN101009997A Component suction method |
| 08/01/2007 | CN101009978A Method for manufacturing electronic device |
| 08/01/2007 | CN101009977A Quasi-waveguide printed circuit board structure |
| 08/01/2007 | CN101009976A Method for improving the line precision in the etching technology |
| 08/01/2007 | CN101009975A Method for manufacturing the lamination porcelain base board |
| 08/01/2007 | CN101009973A Resin composite copper foil, printed wiring board, and production process thereof |
| 08/01/2007 | CN101009971A Wired-circuit-board assembly sheet |
| 08/01/2007 | CN101009969A Using method of the printed circuit board and its printed circuit board |
| 08/01/2007 | CN101009406A Backboard connector combination |
| 08/01/2007 | CN101009263A Printed circuit board for semiconductor package and method of manufacturing the same |
| 08/01/2007 | CN101009205A Porous substrate with smooth surface and production method thereof |
| 08/01/2007 | CN101008614A Method of monitoring depositing temperature of cu seed layer and method for forming cu layer by using the same |
| 08/01/2007 | CN101007935A Foamable underfill encapsulant |
| 08/01/2007 | CN101007365A Joining method, method of mounting semiconductor package, and substrate-joining structure |
| 08/01/2007 | CN101006920A Processing method of three-dimensional implantable microelectrode array |
| 07/31/2007 | US7251802 Method and system for deciding a wiring route |
| 07/31/2007 | US7251348 Land appearance inspecting device, and land appearance inspecting method |
| 07/31/2007 | US7250960 Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same |
| 07/31/2007 | US7250827 Circuitry module |
| 07/31/2007 | US7250785 Method and apparatus for inspecting printed circuit boards |
| 07/31/2007 | US7250575 Wiring board, semiconductor device and display module |
| 07/31/2007 | US7250355 Multilayered circuit substrate, semiconductor device and method of producing same |
| 07/31/2007 | US7250352 Methods for manufacturing a hybrid integrated circuit device |
| 07/31/2007 | US7250329 Method of fabricating a built-in chip type substrate |
| 07/31/2007 | US7249485 Substrate processing apparatus |
| 07/31/2007 | US7249411 Methods for mounting surface-mounted electrical components |
| 07/31/2007 | CA2382816C Cartridge type soldering iron with a releasable and replaceable handle |