| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/24/2007 | US20070117423 Camera module using printed circuit board with step portion |
| 05/24/2007 | US20070117417 Pcb connector |
| 05/24/2007 | US20070117403 Method of Fabricating an RF Substrate with Selected Electrical Properties |
| 05/24/2007 | US20070117365 Plating method and apparatus |
| 05/24/2007 | US20070117339 Via including multiple electrical paths |
| 05/24/2007 | US20070117277 Methods for fabricating protective layers on semiconductor device components |
| 05/24/2007 | US20070117271 Methods and compositions for the formation of recessed electrical features on a substrate |
| 05/24/2007 | US20070117262 Low Profile Stacking System and Method |
| 05/24/2007 | US20070117234 Sputtered Spring Films With Low Stress Anisotropy |
| 05/24/2007 | US20070116938 Polymer composite formed article, printed wiring board using the formed article, and methods of producing them |
| 05/24/2007 | US20070116932 Device and method of making a device having a flexible layer structure |
| 05/24/2007 | US20070116794 Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof |
| 05/24/2007 | US20070114673 Wiring substrate and electronic parts packaging structure |
| 05/24/2007 | US20070114653 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 05/24/2007 | US20070114649 Low Profile Stacking System and Method |
| 05/24/2007 | US20070114266 Method and device to elongate a solder joint |
| 05/24/2007 | US20070114058 Circuit board and its manufacturing method |
| 05/24/2007 | US20070114056 Electrical isolation of PCBs gasketing using controlled depth drilling |
| 05/24/2007 | US20070113972 Method of manufacturing flexible laminate substrate |
| 05/24/2007 | US20070113966 Process for forming at least a portion of a package or an envelope bearing a printed indicia |
| 05/24/2007 | US20070113930 Novel imidazole compound and use thereof |
| 05/24/2007 | US20070113399 Thermally Conductive Interface |
| 05/24/2007 | DE10228509B4 Lotstruktur zur elektrischen und/oder mechanischen Kontaktierung sowie Vorrichtung und Verfahren zu ihrer Herstellung Lotstruktur for electrical and / or mechanical contact, as well as apparatus and methods for their preparation |
| 05/24/2007 | DE102005054862A1 Anordnung zur elektrischen Kotaktierung Arrangement for electrically Kotaktierung |
| 05/24/2007 | DE102005053779A1 Trägerelement zur Verwendung in der Elektronikindustrie Support member for use in the electronics industry |
| 05/23/2007 | EP1788852A2 Method for packaging flash memory cards |
| 05/23/2007 | EP1788640A1 Light emitting module and production method therefor |
| 05/23/2007 | EP1786626A1 A method and a system to deposit drops |
| 05/23/2007 | EP1487759B1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate |
| 05/23/2007 | EP1266926B1 Adhesive polyimide resin and adhesive laminate |
| 05/23/2007 | EP1238445B1 System comprising at least two printed circuit boards |
| 05/23/2007 | EP1197128B1 Thermal vias arranged in a printed circuit board to conduct heat away from surface mounted components through the board |
| 05/23/2007 | EP1173051B1 Flexible printed wiring board and its production method |
| 05/23/2007 | CN2904573Y Diaphragm pressing and isolating device for flexible circuitboard |
| 05/23/2007 | CN2904572Y Device for separating different material layers of printed circuitboard in supercritical fluid |
| 05/23/2007 | CN2904571Y Unit of sealing off separating device for use in liquid heat conducting medium of printed circuit board |
| 05/23/2007 | CN2904570Y Vacuum high pressure cabin for circuit |
| 05/23/2007 | CN2904569Y Multilayer heat radiation type aluminium foil composite cover plate |
| 05/23/2007 | CN1969597A Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| 05/23/2007 | CN1969423A Circuitry module |
| 05/23/2007 | CN1969231A Method of forming plated product using negative photoresist composition and photosensitive composition used therein |
| 05/23/2007 | CN1969065A Device and method for electrolytically treating flat work pieces |
| 05/23/2007 | CN1969064A Tin-based plating film and method for forming the same |
| 05/23/2007 | CN1968822A Printing of organometallic compounds to form conductive traces |
| 05/23/2007 | CN1968577A Printed circuit board using paste bump and manufacturing method thereof |
| 05/23/2007 | CN1968576A Fabricating method of printed circuit board having embedded component |
| 05/23/2007 | CN1968575A Wet film coating process for flexible circuit board |
| 05/23/2007 | CN1968574A Punching device for connector and method and system |
| 05/23/2007 | CN1968573A Flexible PCB envelop forming method and its system |
| 05/23/2007 | CN1968572A 电路板制造方法 The method of manufacturing a circuit board |
| 05/23/2007 | CN1968571A Circuit board manufacturing method |
| 05/23/2007 | CN1968570A Multilayer printed wiring board and method for producing the same |
| 05/23/2007 | CN1968569A Composite wiring board and manufacturing method thereof |
| 05/23/2007 | CN1968568A Circuit board and electronic device using the same |
| 05/23/2007 | CN1968567A Printed circuit board and method for manufacturing the same |
| 05/23/2007 | CN1968566A Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board |
| 05/23/2007 | CN1968565A High density printed circuit board and method of manufacturing the same |
| 05/23/2007 | CN1968564A Printed circuit board with dual type inner structure |
| 05/23/2007 | CN1967831A Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/23/2007 | CN1967830A Mounting structure and method of electronic component |
| 05/23/2007 | CN1967781A Pattern forming method, device, active matrix type substrate manufacture method |
| 05/23/2007 | CN1966376A Super long film conveying device and method |
| 05/23/2007 | CN1317927C Mounting structure for circuit board in electronic device and mounting method thereof |
| 05/23/2007 | CN1317925C Heating device and heating method |
| 05/23/2007 | CN1317924C Surface installation device and method |
| 05/23/2007 | CN1317923C A base plate structure having built-in capacitor |
| 05/23/2007 | CN1317922C Wiring circuit board |
| 05/23/2007 | CN1317770C Device making method and apparatus, device and electronic machine thereof |
| 05/23/2007 | CN1317759C Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/23/2007 | CN1317753C Device for holding chip in package |
| 05/23/2007 | CN1317750C Wiring base board and its producing method, semiconductor device and electronic machine |
| 05/23/2007 | CN1317715C Lead of flexible distribution and bonding pad for connection |
| 05/23/2007 | CN1317714C Method for changing conductive polymer to essential unconductive polymer |
| 05/22/2007 | US7221868 Camera and photographing lens barrel |
| 05/22/2007 | US7221626 Magneto-optical head and magneto-optical storage device |
| 05/22/2007 | US7221324 Antenna coupling structure for a mobile terminal |
| 05/22/2007 | US7221058 Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip |
| 05/22/2007 | US7221049 Circuit device and manufacturing method thereof |
| 05/22/2007 | US7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
| 05/22/2007 | US7221043 Integrated circuit carrier with recesses |
| 05/22/2007 | US7220922 Electronic component, component mounting equipment, and component mounting method |
| 05/22/2007 | US7220915 Memory card and its manufacturing method |
| 05/22/2007 | US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles |
| 05/22/2007 | US7220682 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 05/22/2007 | US7220666 Interconnection element for BGA housings and method for producing the same |
| 05/22/2007 | US7220615 Alternative method used to package multimedia card by transfer molding |
| 05/22/2007 | US7220507 Flat panel direct methanol fuel cell and method of making the same |
| 05/22/2007 | US7220493 contains 30 to 70 weight percent zinc, greater than 0 to 5 weight percent nickel, and the remaining weight percent tin with a liquid phase temperature of 260 degrees C. or greater |
| 05/22/2007 | US7220490 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 05/22/2007 | US7220481 High dielectric constant composite material and multilayer wiring board using the same |
| 05/22/2007 | US7220370 Plating and production methods for producing a fine metal component using a conductive paste |
| 05/22/2007 | US7219982 Printer nozzle for ejecting ink |
| 05/22/2007 | US7219845 Electronic device having multilayer printed wiring board and method for manufacturing electronic device |
| 05/22/2007 | US7219843 Optical reader having a plurality of imaging modules |
| 05/22/2007 | US7219826 Method for producing metal/ceramic bonding substrate |
| 05/22/2007 | US7219787 Device and method for conveying and holding plate-like member |
| 05/22/2007 | US7219422 Fabrication method of semiconductor integrated circuit device |
| 05/22/2007 | US7219420 Screening of a printed-circuit electronics card mounted on a metal substrate |
| 05/22/2007 | CA2405830C Process for the manufacture of printed circuit boards with plated resistors |
| 05/18/2007 | WO2007056268A1 Imaging system and method for a stencil printer |