| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/05/2007 | CN100336425C Hybrid integrated circuit device |
| 09/05/2007 | CN100336424C 印刷电路板 A printed circuit board |
| 09/05/2007 | CN100336423C Circuit board consisting of grain structure magnetic film |
| 09/05/2007 | CN100336291C Switching power supply unit |
| 09/05/2007 | CN100336272C 连接器 Connector |
| 09/05/2007 | CN100336209C Hybrid integrated circuit device and manufacturing method of the same |
| 09/05/2007 | CN100336183C Method for production of dielectric layers using polyfunctional carbosilanes |
| 09/05/2007 | CN100336139C Formation of thin film resistors |
| 09/05/2007 | CN100335970C Material and method for making an electroconductive pattern |
| 09/05/2007 | CN100335582C Wiring-connecting material and wiring-connected board production process using the same |
| 09/04/2007 | US7266802 Drawing apparatus and drawing method |
| 09/04/2007 | US7266262 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
| 09/04/2007 | US7265994 Underfill film for printed wiring assemblies |
| 09/04/2007 | US7265804 Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix |
| 09/04/2007 | US7265563 Test method for semiconductor components using anisotropic conductive polymer contact system |
| 09/04/2007 | US7265446 Mounting structure for semiconductor parts and semiconductor device |
| 09/04/2007 | US7265315 Method of joining terminals by soldering |
| 09/04/2007 | US7265046 Method of making a solder ball |
| 09/04/2007 | US7265044 Method for forming bump on electrode pad with use of double-layered film |
| 09/04/2007 | US7265043 Methods for making microwave circuits |
| 09/04/2007 | US7265033 Laser beam processing method for a semiconductor wafer |
| 09/04/2007 | US7265032 Protective layer during scribing |
| 09/04/2007 | US7264997 Semiconductor device including inclined cut surface and manufacturing method thereof |
| 09/04/2007 | US7264842 Method of manufacturing a wiring substrate for a display panel |
| 09/04/2007 | US7264487 Electrical connector assembly with pick up cap |
| 09/04/2007 | US7264483 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same |
| 09/04/2007 | US7264482 Anisotropic conductive sheet |
| 09/04/2007 | US7263890 Vacuum clamping detection method and vacuum clamping detector |
| 09/04/2007 | US7263768 Method of making a semiconductor device having an opening in a solder mask |
| 09/04/2007 | US7263766 Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate |
| 09/04/2007 | US7263752 Method for manufacturing an ink-jet head |
| 08/30/2007 | WO2007097440A1 Printed wiring board and process for producing the same |
| 08/30/2007 | WO2007097405A1 Thermosetting resin composition containing low-chlorine multifunctional aliphatic glycidyl ether compound, cured product of such composition and use thereof |
| 08/30/2007 | WO2007097366A1 Multilayer printed wiring board and method for manufacturing same |
| 08/30/2007 | WO2007097335A1 Plating apparatus and method of plating |
| 08/30/2007 | WO2007097249A1 Porous film and layered product including porous film |
| 08/30/2007 | WO2007097234A1 Method for fabricating connecting jig, and connecting jig |
| 08/30/2007 | WO2007097223A1 Mounting method |
| 08/30/2007 | WO2007097209A1 Epoxy resin composition |
| 08/30/2007 | WO2007097163A1 Method for forming circuit pattern |
| 08/30/2007 | WO2007097134A1 Process for manufacturing soldering mounted structure and apparatus therefor |
| 08/30/2007 | WO2007095880A1 Method for encapsulating electrical and/or electronic components in a housing |
| 08/30/2007 | WO2007078799A3 Low resistivity package substrate and its manufacturing method |
| 08/30/2007 | WO2006138667A3 Rf front-end module for picocell and microcell base station transceivers |
| 08/30/2007 | US20070202716 Soldering Nest For A Bus Bar |
| 08/30/2007 | US20070202713 Connector Employing Flexible Printed Board |
| 08/30/2007 | US20070202693 Electrochemical deposition of one or more materials according to desired cross-sectional configurations so as to build up three dimensional structures from a plurality of at least partially adhered layers of deposited material; simplification |
| 08/30/2007 | US20070202246 Designing a plated pattern in printed wiring board |
| 08/30/2007 | US20070201214 Core board comprising nickel layer, multilayer board and manufacturing method thereof |
| 08/30/2007 | US20070200554 Solid or three-dimensional circuit board |
| 08/30/2007 | US20070200227 Power semiconductor arrangement |
| 08/30/2007 | US20070200217 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 08/30/2007 | US20070199733 Circuit board and method for manufacturing the same |
| 08/30/2007 | US20070199195 Method for making a multilayered circuitized substrate |
| 08/30/2007 | DE202007007200U1 Vorrichtung zum Aufbringen und Aushärten einer Beschichtung auf elektronische Baugruppen u.dgl. An apparatus for applying and curing a coating on electronic assemblies, etc.. |
| 08/30/2007 | DE19807956B4 Verfahren zum Trennen von Isoliersubstraten A method of separating insulating substrates |
| 08/30/2007 | DE10241658B4 Verfahren zur Verzinnung von abisolierten Bereichen der Adern eines Flachkabels A method for tinning of stripped areas of the wires of a flat cable |
| 08/30/2007 | DE102006061850A1 Verbindungsstruktur für eine Wandleranordnung Interconnect structure for a transducer assembly |
| 08/30/2007 | DE102006008779A1 Device for flow soldering of flat components comprises nozzle arrangements for fitting the flat components and arranged in a nozzle gun which supports an axle |
| 08/30/2007 | DE102006007813A1 Sensor unit and printed circuit board contacting method, involves providing feed-throughs in sensor unit and circuit board and inserting pin into feed-throughs, where pin is electrically and/or mechanically connected with sensor unit |
| 08/30/2007 | DE102006007535A1 Vorrichtung zur elektrisch leitenden Verbindung A device for electrically conductive connection |
| 08/30/2007 | DE10196822B4 Oberflächenmontierter Verbinderanschluß The surface mount connector terminal |
| 08/30/2007 | DE10157443B4 Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil, Verwendung der Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil und Vefahren zur Herstellung eines elektronischen Vielschicht-Keramikbauteils Glass-ceramic composition for a ceramic electronic part, use of the glass-ceramic composition for a ceramic electronic component and Vefahren of manufacturing an electronic multilayer ceramic component |
| 08/29/2007 | EP1827069A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1827068A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1827067A2 Flexible circuit substrate for flip-chip-on-flex applications |
| 08/29/2007 | EP1827066A2 Electron attachment assisted formation of electrical conductors |
| 08/29/2007 | EP1827065A2 Printed wiring board and method of manufacturing the same |
| 08/29/2007 | EP1827062A2 Electronic device |
| 08/29/2007 | EP1827061A2 Facility and method for high-performance circuit board connection |
| 08/29/2007 | EP1825731A1 Thermal attach and detach methods and systems for surface-mounted components |
| 08/29/2007 | EP1825726A1 A printed circuit board with combined digital and high frequency applications |
| 08/29/2007 | EP1825591A1 Resonator for a voltage controlled oscillator and manufacturing method thereof |
| 08/29/2007 | EP1825588A1 Machining spindles and shafts |
| 08/29/2007 | EP1825332A1 Process and apparatus for the production of collimated uv rays for photolithographic transfer |
| 08/29/2007 | EP1824638A1 Pb free solder alloy |
| 08/29/2007 | EP1661207B1 Flexible conformal antenna |
| 08/29/2007 | EP1266426B1 Method for forming radio frequency antenna using conductive inks |
| 08/29/2007 | CN200941733Y Welding apparatus |
| 08/29/2007 | CN200941732Y Welder |
| 08/29/2007 | CN200941708Y Welding part structure of article and circuit board |
| 08/29/2007 | CN200939537Y Hot air welding tip |
| 08/29/2007 | CN101027950A Flexible cable for high-speed interconnect |
| 08/29/2007 | CN101027949A Wiring board and wiring board module |
| 08/29/2007 | CN101027948A Electronics module and method for manufacturing the same |
| 08/29/2007 | CN101027775A Manufacture of a layer including a component |
| 08/29/2007 | CN101027431A Plating method and plating apparatus |
| 08/29/2007 | CN101027427A Method for coating substrates containing antimony compounds with tin and tin alloys |
| 08/29/2007 | CN101026952A Electronic component mounting method and device |
| 08/29/2007 | CN101026936A Printed circuit board button solder pad holing method and its button solder pad |
| 08/29/2007 | CN101026935A Method of soldering wiring members by laser beam irradiation |
| 08/29/2007 | CN101026934A Method for manufacturing separate LED circuitboard |
| 08/29/2007 | CN101026933A Printed circuit board waveguide |
| 08/29/2007 | CN101026932A Module casing structure with dismountable mouth |
| 08/29/2007 | CN101026931A Right-angled signal line making method and its circuit board |
| 08/29/2007 | CN101026929A Printed circuit board having inner via hole and manufacturing method thereof |
| 08/29/2007 | CN101026927A Core board comprising nickel layer, multilayer board and manufacturing method thereof |
| 08/29/2007 | CN101026923A Printed wiring board and connection configuration of the same |
| 08/29/2007 | CN101026922A Circuit brard combination |
| 08/29/2007 | CN101026272A Facility and method for high-performance circuit board connection |