| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/12/2007 | CN101035412A Method for manufacturing substrate by imprinting |
| 09/12/2007 | CN101035410A 印刷电路板 A printed circuit board |
| 09/12/2007 | CN101035406A Embedded capacitor core having multilayer structure |
| 09/12/2007 | CN101033550A Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment |
| 09/12/2007 | CN101033376A Adhesive, method of connecting wiring terminals and wiring structure |
| 09/12/2007 | CN101033349A Halogen-free phosphor-free resistance printing ink, producing method and application thereof |
| 09/12/2007 | CN101032880A 网版印刷装置 A screen printing device |
| 09/12/2007 | CN100337327C Semiconductor device and method for making same |
| 09/12/2007 | CN100337148C Anisotropic conductive rubber film sticking device and method |
| 09/11/2007 | US7269032 Shielding for EMI-sensitive electronic components and or circuits of electronic devices |
| 09/11/2007 | US7269031 Board-mounting device |
| 09/11/2007 | US7268776 Flat panel display with signal transmission patterns |
| 09/11/2007 | US7268740 Method for forming radio frequency antenna |
| 09/11/2007 | US7268739 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium |
| 09/11/2007 | US7268637 Low cost RF oscillator devices manufactured from conductive loaded resin-based materials |
| 09/11/2007 | US7268486 Hermetic encapsulation of organic, electro-optical elements |
| 09/11/2007 | US7268479 Low cost lighting circuits manufactured from conductive loaded resin-based materials |
| 09/11/2007 | US7268437 Semiconductor package with encapsulated passive component |
| 09/11/2007 | US7268432 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 09/11/2007 | US7268414 Semiconductor package having solder joint of improved reliability |
| 09/11/2007 | US7268408 Wiring board, method for manufacturing wiring board and electronic component using wiring board |
| 09/11/2007 | US7268303 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| 09/11/2007 | US7268074 Capping of metal interconnects in integrated circuit electronic devices |
| 09/11/2007 | US7268059 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components |
| 09/11/2007 | US7268002 Packaging method, packaging structure and package substrate for electronic parts |
| 09/11/2007 | US7267755 Multilater; dielectric and electroconductive layers |
| 09/11/2007 | US7267259 Method for enhancing the solderability of a surface |
| 09/11/2007 | US7266888 Method for fabricating a warpage-preventive circuit board |
| 09/11/2007 | US7266887 Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation |
| 09/11/2007 | US7266882 Method of manufacturing a miniaturized three- dimensional electric component |
| 09/11/2007 | US7266868 Method of manufacturing liquid delivery apparatus |
| 09/11/2007 | CA2362387C Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 09/11/2007 | CA2207864C Improved photoresists and method of making printing plates |
| 09/07/2007 | WO2007100572A2 System and method of using a compliant lead interposer |
| 09/07/2007 | WO2007100173A1 Multi-layer package structure and fabrication method thereof |
| 09/07/2007 | WO2007100142A1 Component bonding method and component bonding device |
| 09/07/2007 | WO2007100078A1 Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof |
| 09/07/2007 | WO2007100007A1 Pattern-forming device and pattern-forming method |
| 09/07/2007 | WO2007099992A1 Substrate and device |
| 09/07/2007 | WO2007099965A1 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure |
| 09/07/2007 | WO2007099866A1 Electronic component mounted body, electronic component with solder bump, solder resin mixed material, electronic component mounting method and electronic component manufacturing method |
| 09/07/2007 | WO2007099760A1 Anti-flux migration composition for solder |
| 09/07/2007 | WO2007099654A1 Reinforcement plate bonding device, reinforcement plate punch device, cutting device for creating reinforcement plate, flexible substrate, and electronic apparatus |
| 09/07/2007 | WO2007099645A1 Device for sticking reinforcement board, die for punching reinforcement board and flexible board |
| 09/07/2007 | WO2007099641A1 Board structure for product board, product board manufacturing method, and electronic apparatus |
| 09/07/2007 | CA2643153A1 System and method of using a compliant lead interposer |
| 09/06/2007 | US20070207565 Processes for forming photovoltaic features |
| 09/06/2007 | US20070207557 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/06/2007 | US20070207415 Process for producing wiring circuit board |
| 09/06/2007 | US20070207337 Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board |
| 09/06/2007 | US20070207274 Manufacturing method for a circuit pattern, a thin film transistor and an electronic appliance |
| 09/06/2007 | US20070206061 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
| 09/06/2007 | US20070205847 Via transmission lines for multilayer printed circuit boards |
| 09/06/2007 | US20070205512 Solder bump structure for flip chip package and method for manufacturing the same |
| 09/06/2007 | US20070205018 Multilayer printed board, electronic apparatus, and packaging method |
| 09/06/2007 | DE4426119B4 Photobildfähige Massen, enthaltend 1,2-dihalogenierte Ethane auf Schichtträgermaterial, zur Verbesserung des Druckbildes Photo image-capable compounds containing 1,2-dihalogenated ethanes on substrate material, to improve the print image |
| 09/06/2007 | DE112005002507T5 Verfahren und Vorrichtung zum Tragen und Einspannen eines Substrats Method and device for supporting and clamping a substrate |
| 09/06/2007 | DE102007005920A1 Leiterplatte mit einem eingebetteten Nacktchip und Verfahren derselben Circuit board with an embedded bare chip and method thereof |
| 09/06/2007 | DE102006011757A1 Verfahren zum Vergießen elektrischer und/oder elektronischer Bauteile in einem Gehäuse A method for encapsulating electrical and / or electronic components in a housing |
| 09/06/2007 | DE102005063403A1 Kleber oder Bondmaterial Adhesive or bonding material |
| 09/05/2007 | EP1830617A2 Multilayer printed wiring board and method for producing the same |
| 09/05/2007 | EP1830616A2 Multilayer printed wiring board and method for producing the same |
| 09/05/2007 | EP1830615A1 Multilayer wiring board and method for manufacturing same |
| 09/05/2007 | EP1830614A1 Method for producing substrate having through hole filled with conductive material |
| 09/05/2007 | EP1830611A1 Printed wiring board and production method of printed wiring borad |
| 09/05/2007 | EP1830439A2 Electrical connector |
| 09/05/2007 | EP1830414A1 Element mounting substrate and method for manufacturing same |
| 09/05/2007 | EP1829848A1 Method for producing metallized ceramic substrate |
| 09/05/2007 | EP1829691A1 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip |
| 09/05/2007 | EP1829639A1 Solder precoating method and work for electronic device |
| 09/05/2007 | EP1829439A1 Flexible circuits and method of making same |
| 09/05/2007 | EP1829096A2 Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method |
| 09/05/2007 | EP1828434A1 Method for improving the electrical connection properties of the surface of a product made from a polymer-matrix composite |
| 09/05/2007 | EP1827849A1 Distortion compensation for printing |
| 09/05/2007 | EP1728414B1 Device provided with an electric motor and a main printed circuit board and mounting method |
| 09/05/2007 | EP1652414B1 Support element for a second printed circuit board arranged on a first circuit board |
| 09/05/2007 | EP1364562B1 Vacuum deposited circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| 09/05/2007 | CN200944705Y Clamping device of circuit board combined machine |
| 09/05/2007 | CN200944704Y Clamp for flexible circuit substrate installation |
| 09/05/2007 | CN200944703Y Circuit board assembly |
| 09/05/2007 | CN200942450Y Square four-footed hot-blast welding tip |
| 09/05/2007 | CN101032194A Multilayer wiring board and method for producing same |
| 09/05/2007 | CN101032193A Assessing micro-via formation in a PCB substrate manufacturing process |
| 09/05/2007 | CN101032191A Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate |
| 09/05/2007 | CN101032015A Capping of metal interconnects in integrated circuit electronic devices |
| 09/05/2007 | CN101031982A Conductive paste and multilayer printed wiring board using same |
| 09/05/2007 | CN101031981A Conductive paste and method for manufacturing multilayer printed wiring board using same |
| 09/05/2007 | CN101031625A Pressure-sensitive adhesive having its adherence lost by actinic energy radiation, adhesive sheet having its adherence lost by actinic energy radiation obtained by application of the pressure-sensitiv |
| 09/05/2007 | CN101031609A Process for the preparation of a fibre-reinforced resin-coated sheet |
| 09/05/2007 | CN101031198A Parts supply device |
| 09/05/2007 | CN101031186A Method for producing automatic-system inputting-outputting circuit board in hydroelectric power station |
| 09/05/2007 | CN101031184A Soldering structure of through hole |
| 09/05/2007 | CN101031183A Suspension board with circuit |
| 09/05/2007 | CN101031182A Printing circuit-board and its designing method |
| 09/05/2007 | CN101031181A Methods and apparatus for in-situ substrate processing |
| 09/05/2007 | CN101030546A Capacitor attachment method |
| 09/05/2007 | CN101029409A Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| 09/05/2007 | CN101028718A Punching device |
| 09/05/2007 | CN101028691A Machining method |
| 09/05/2007 | CN100336426C Multilayer printed wiring board and method ofr producing multilayer printed wiring board |