| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/27/2007 | EP1470176B1 No flow underfill composition |
| 06/27/2007 | EP1364220A4 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 06/27/2007 | EP1338182B1 Electrical component, arrangement for said component and method for producing said arrangement |
| 06/27/2007 | CN2917190Y Ceramic baseplate |
| 06/27/2007 | CN2917150Y Keeping structure, insulation structure, and heating unit of heater |
| 06/27/2007 | CN1989793A Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil |
| 06/27/2007 | CN1989650A Composite via structures and filters in multilayer printed circuit boards |
| 06/27/2007 | CN1989503A Method for optimizing high frequency performance of via structures |
| 06/27/2007 | CN1989457A Photosensitive element, method of forming resist pattern with the same, and process for producing printed wiring board |
| 06/27/2007 | CN1989274A Electrolytically recoverable etching solution |
| 06/27/2007 | CN1988998A Processing method, processing apparatus, and fine structure produced by the method |
| 06/27/2007 | CN1988788A Heat equalizing sheet element and its producing method |
| 06/27/2007 | CN1988770A Substrate inspection method, printed-wiring board, and electronic circuit device |
| 06/27/2007 | CN1988769A Convex beating method for flexible printed circuit board |
| 06/27/2007 | CN1988768A Printed circuit board and method of manufacturing the same |
| 06/27/2007 | CN1988767A Method for mounting chip component and circuit board |
| 06/27/2007 | CN1988766A Method for making covered film composed of soft printed circuit board and covered film structure |
| 06/27/2007 | CN1988765A Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure |
| 06/27/2007 | CN1988764A Method of making an electronic device cooling system |
| 06/27/2007 | CN1988763A Method of making an electronic device cooling system |
| 06/27/2007 | CN1988762A Control method and its structure for base plate through hole residual section effect |
| 06/27/2007 | CN1988761A Binding method for lifting soft-solid synthetic printed circuit board turn-on hole trust degree |
| 06/27/2007 | CN1988760A Base plate rear section treating method |
| 06/27/2007 | CN1988759A Optic fiber network interlink layer EO-PCB plate and producing method |
| 06/27/2007 | CN1988757A Flexible printed circuit board and its producing method |
| 06/27/2007 | CN1988756A Substrate structure, substrate manufacturing method and electronic device |
| 06/27/2007 | CN1988257A Process for producing radio-frequency antenna by thermoprinting-mould cutting |
| 06/27/2007 | CN1988251A Method for producing radio frequency identifying antenna and its antenna structure |
| 06/27/2007 | CN1988141A Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment |
| 06/27/2007 | CN1988120A Method for manufacturing ic-embedded substrate |
| 06/27/2007 | CN1988085A Thick film capacitors on ceramic interconnect substrates |
| 06/27/2007 | CN1988083A Thin-film capacitor and method for fabricating the same, electronic device and circuit board |
| 06/27/2007 | CN1988069A Process for producing inductive coil by printed circuit board |
| 06/27/2007 | CN1987655A Exposure device of closing type |
| 06/27/2007 | CN1323574C Component and device mounting device |
| 06/27/2007 | CN1323570C Electric contact arrangement and method for preparing same |
| 06/27/2007 | CN1323435C Modular component |
| 06/27/2007 | CN1323420C Process of surface treatment, surface treating device, surface treated plate, and electro-optic device |
| 06/27/2007 | CN1323393C Circuit board transmitting high frequency signal |
| 06/27/2007 | CN1323190C Local electroplating method for substrate |
| 06/27/2007 | CN1323054C Method for producing a ceramic-copper composite substrate |
| 06/27/2007 | CN1322837C Woven electronic textile, yarn and article |
| 06/26/2007 | US7237219 Design aid apparatus, design aid method, and computer-executable program |
| 06/26/2007 | US7236624 Mark for visual inspection upon assembling a display |
| 06/26/2007 | US7236372 Surface mounted power supply circuit apparatus and method for manufacturing it |
| 06/26/2007 | US7236367 Power electronics component |
| 06/26/2007 | US7236070 Electronic component module and manufacturing method thereof |
| 06/26/2007 | US7235886 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 06/26/2007 | US7235885 Semiconductor device and method of manufacturing the same, circuit board and electronic device |
| 06/26/2007 | US7235883 Layered wiring line of silver alloy and method for forming the same and display panel substrate using the same |
| 06/26/2007 | US7235872 Bow control in an electronic package |
| 06/26/2007 | US7235477 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/26/2007 | US7235432 Method for producing an electrical conductor element |
| 06/26/2007 | US7235429 Conductive block mounting process for electrical connection |
| 06/26/2007 | US7235415 Film pattern formation method, device and method for manufacturing the same, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
| 06/26/2007 | US7235350 Alumina insulation for coating implantable components and other microminiature devices |
| 06/26/2007 | US7235148 Selectively roughening conductors for high frequency printed wiring boards |
| 06/26/2007 | US7234960 Guide pin with transverse protrusions for properly positioning a guide pin for attachment to a printed circuit board |
| 06/26/2007 | US7234789 Apparatus for ejecting droplets, actuator controller used in the apparatus, and method for controlling the actuator |
| 06/26/2007 | US7234234 Method of manufacturing bandpass filters for GHz bands |
| 06/26/2007 | US7234233 Method of manufacturing an electromagnetic relay |
| 06/26/2007 | US7234232 Methods for designing and tuning one or more packaged integrated circuits |
| 06/26/2007 | US7234217 Device for coupling PCB sheet having position deciding jig part |
| 06/26/2007 | US7234215 Stacking method of green sheet and a manufacturing method of multilayer ceramic electronic device |
| 06/26/2007 | CA2286326C Article, method, and apparatus for electrochemical fabrication |
| 06/21/2007 | WO2007069789A1 Multilayer printed wiring plate, and method for fabricating the same |
| 06/21/2007 | WO2007069754A1 Screen printing apparatus and screen printing method |
| 06/21/2007 | WO2007069705A1 Apparatus and method for soldering flat work piece |
| 06/21/2007 | WO2007069606A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 06/21/2007 | WO2007069585A1 Positive resist composition for circuit board, and positive dry film for circuit board, and process for producing circuit board with use thereof |
| 06/21/2007 | WO2007069510A1 Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material |
| 06/21/2007 | WO2007068172A1 Forming methods of film label or packing material |
| 06/21/2007 | WO2007044368A3 Minimized profile circuit module systems and methods |
| 06/21/2007 | US20070141515 coating with a photoimageable ink on a carrier film, forming a photoresist layer, then exposed to developing |
| 06/21/2007 | US20070141507 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
| 06/21/2007 | US20070141380 substrate contains a reactive element, such as titanium, silicon or magnesium between the support and release layer, so blistering is eliminated during heat treatment; use in making circuit boards |
| 06/21/2007 | US20070141377 Copper foil having blackened surface or layer |
| 06/21/2007 | US20070141263 Process and an apparatus for coating printed circuit boards with laser-structurable, thermally curable solder stop lacquers and electroresists |
| 06/21/2007 | US20070140509 Structure for mounting multifuctional vibrating actuator on circuit board |
| 06/21/2007 | US20070139896 Modular heat-radiation structure and controller including the structure |
| 06/21/2007 | US20070139859 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor |
| 06/21/2007 | US20070138690 Process for producing synthetic resin film having molecular orientation controlled in md direction |
| 06/21/2007 | US20070138633 Thick film capacitors on ceramic interconnect substrates |
| 06/21/2007 | US20070137890 Printed wiring board |
| 06/21/2007 | US20070137889 Multi-strand substrate for ball-grid array assemblies and method |
| 06/21/2007 | US20070137887 Adhesive for bonding circuit members, circuit board and process for its production |
| 06/21/2007 | US20070137558 Method and apparatus for applying viscous medium onto a substrate |
| 06/21/2007 | DE19702485B4 Objektivmechanismus für eine Kamera Lens mechanism for a camera |
| 06/21/2007 | DE112005001894T5 Verfahren und Vorrichtungen zum Prägen von Substanzen Methods and apparatus for embossing substances |
| 06/21/2007 | DE112004002722T5 Halbleitergehäuse mit perforiertem Substrat Semiconductor package with perforated substrate |
| 06/21/2007 | DE10296639B4 Laserbearbeitungsgerät A laser processing apparatus |
| 06/21/2007 | DE102005061049A1 Metall-Keramik-Substrat A metal-ceramic substrate |
| 06/21/2007 | DE102005060688A1 Device for cleaning the free spaces between wall surfaces of different heights e.g. solder sites of electronic components comprises a bell-like hood, an inlet channel for a cleaning fluid, a suction channel and an elastic barrier element |
| 06/21/2007 | DE102005054029B3 Formation of linear aperture in plastics-fibre reinforced substrate for conductor plate involves guiding laser beam to flat processing area and then forward to one edge before returning to starting point and then onward to second edge |
| 06/21/2007 | DE102005015109B4 Verfahren zum Montieren von Halbleiterchips auf einem Substrat und entsprechende Anordnung A method of mounting semiconductor chips on a substrate and corresponding arrangement |
| 06/20/2007 | EP1799018A2 Electrical circuit board, board device, motor, motor device, electric pump, and method of connecting motor and electrical circuit board or board device |
| 06/20/2007 | EP1798767A2 Circuit board and production method therefor |
| 06/20/2007 | EP1798314A1 Leveler compounds |
| 06/20/2007 | EP1797749A1 Component provided with an assembly of hard conductive microtips and method for electrical connection of said component and a component provided with ductile conductive protrusions |
| 06/20/2007 | EP1797748A1 Component with buried ductile conductive bumps and method for electric connection between said component and a component provided with hard conductive tips |