| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/18/2007 | WO2007055413A1 Screen printing apparatus and screen printing method |
| 05/18/2007 | WO2007055410A1 Method for soldering electronic component and soldering structure of electronic component |
| 05/18/2007 | WO2007055409A1 Screen printing apparatus and screen printing method |
| 05/18/2007 | WO2007055223A1 Method for forming metal film and method for forming metal pattern |
| 05/18/2007 | WO2007055149A1 Work holding vessel and work dismounting method for reflow device |
| 05/18/2007 | WO2007054690A1 Handling of flexible planar material |
| 05/18/2007 | WO2007007623A3 Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit |
| 05/18/2007 | WO2005122695A3 A system for mapping defective printed circuits |
| 05/17/2007 | US20070113305 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof |
| 05/17/2007 | US20070111562 Circuit Board Manufacturing Technique and Resulting Circuit Board |
| 05/17/2007 | US20070111561 Circuit board and method of manufacture thereof |
| 05/17/2007 | US20070111475 Method for the structured application of a laminatable film to a substrate for a semiconductor module |
| 05/17/2007 | US20070111401 Printed wiring board, its manufacturing method, and circuit device |
| 05/17/2007 | US20070111381 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls |
| 05/17/2007 | US20070111136 photopolymerizing compound with two or more acrylic ester bonds in the molecule which further containing ether or carbamate characteristic groups with a bond, breaks when monomer is heated, a photopolyerization initiator, acid generator e.g. halogenonium, sulfonium etc. a binder; curing; plating, etching |
| 05/17/2007 | US20070111016 Laser ablation resistant copper foil |
| 05/17/2007 | US20070110973 reduced precious metallic particles ( Ag, Au, Pt, Pd, Rh, Ir) dispersed in a polymeric(acrylonitrile-butadiene-styrene terpolymer) matrix; high transparency, wear resistance, radiation resistance, electroconductivity; liquid-crystal displays and printed circuit boards |
| 05/17/2007 | US20070110956 Multilayer ceramic substrate and its production method |
| 05/17/2007 | US20070109748 Adjusting device especially for a throttle valve of an internal combustion engine |
| 05/17/2007 | US20070109737 Computer enclosure |
| 05/17/2007 | US20070108588 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
| 05/17/2007 | US20070108584 Transmitter module with improved heat dissipation |
| 05/17/2007 | US20070108424 Conductive pattern forming composition, formation method of conductive pattern and production method of conductive pattern forming composition |
| 05/17/2007 | US20070108419 Conductive paste for an electrode layer of a multi-layered ceramic electronic component and a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component |
| 05/17/2007 | US20070108335 System, Method And Apparatus For Optimizing Power Delivery And Signal Routing In Printed Circuit Board Design |
| 05/17/2007 | US20070108254 Circuit board |
| 05/17/2007 | US20070107935 Method and apparatus for electrically connecting printed circuit boards or other panels |
| 05/17/2007 | US20070107933 Internal conductor connection structure and multilayer substrate |
| 05/17/2007 | US20070107931 Circuit board |
| 05/17/2007 | US20070107930 Printed circuit board and method for manufacturing the same |
| 05/17/2007 | US20070107214 Soldering method |
| 05/17/2007 | US20070107213 Methods for trimming electrical parameters in an electrical circuit |
| 05/17/2007 | US20070107206 Spiral Inductor Formed in a Semiconductor Substrate and a Method for Forming the Inductor |
| 05/17/2007 | US20070107205 Device and method for linking microchip modules with antennas |
| 05/16/2007 | EP1786250A1 Composite wiring board and manufacturing method thereof |
| 05/16/2007 | EP1786249A1 Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same |
| 05/16/2007 | EP1786248A1 Low cost antenna array fabrication technology |
| 05/16/2007 | EP1786247A2 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/16/2007 | EP1786078A1 Method of continuously forming an electrical cable |
| 05/16/2007 | EP1785505A1 Barrier film for flexible copper substrate and sputtering target for forming barrier film |
| 05/16/2007 | EP1785456A2 Protective varnish based on renewable raw material, for climatic protection of electrical and/or electronic assemblies and/or elements |
| 05/16/2007 | EP1785017A1 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 05/16/2007 | EP1785016A2 Multilayer body with differently microstructured areas provided with an electroconductive coating |
| 05/16/2007 | EP1436142B1 Metal-containing web processed with a continuous etch process |
| 05/16/2007 | CN2901785Y Soldering liquid spraying clamp |
| 05/16/2007 | CN1965618A Aluminum substrate for printed circuits, manufacturing method thereof, printed circuit board, and manufacturing method thereof |
| 05/16/2007 | CN1965617A Printed wiring board and method for mounting component on the printed wiring board |
| 05/16/2007 | CN1965401A Component mounting method and component mounting apparatus |
| 05/16/2007 | CN1965267A Photosensitive resin composition, and cured product and use thereof |
| 05/16/2007 | CN1965227A Method of assessing the risk of whiskers appearing on the surface of a metallic deposit |
| 05/16/2007 | CN1965044A Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 05/16/2007 | CN1965039A Block copolymerized polyimide ink composition for printing |
| 05/16/2007 | CN1964949A Phenylnaphthylimidazoles for use on copper surfaces during soldering |
| 05/16/2007 | CN1964618A Circuit board with microelectronic elements assembled thereon and method for producing such circuit board |
| 05/16/2007 | CN1964616A A positioning device with electronic component sticked on the surface and its using method |
| 05/16/2007 | CN1964604A Method of manufacturing multilayer printed wiring board |
| 05/16/2007 | CN1964603A Method of manufacturing multilayer printed wiring board |
| 05/16/2007 | CN1964602A A multilayer circuit board and its manufacture method |
| 05/16/2007 | CN1964601A A board stacking method pressed by flexible PCB and its board stacking structure |
| 05/16/2007 | CN1964600A A steam atomizing film-pressing system |
| 05/16/2007 | CN1964599A Manufacturing method of a three-dimensional circuit board |
| 05/16/2007 | CN1964598A Electronic parts mounting structure |
| 05/16/2007 | CN1964596A A multilayer PCB and its manufacture method |
| 05/16/2007 | CN1964165A Dc无刷电动机 Dc brushless motor |
| 05/16/2007 | CN1964008A A processing technique for moisture-proof insulation of preamplifier |
| 05/16/2007 | CN1964006A Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 05/16/2007 | CN1963665A Film peeling off device |
| 05/16/2007 | CN1962962A Plating tank |
| 05/16/2007 | CN1962956A System and method for electrolytic plating |
| 05/16/2007 | CN1316862C Printed circuit board producing method |
| 05/16/2007 | CN1316861C Multi-layer circuit board and mfg. method |
| 05/16/2007 | CN1316860C Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
| 05/16/2007 | CN1316859C Device for manufacture electronic circuit |
| 05/16/2007 | CN1316858C High frequency circuit base board and its producing method |
| 05/16/2007 | CN1316672C High-frequency circuit |
| 05/16/2007 | CN1316647C Cell and mfg. method thereof |
| 05/16/2007 | CN1316612C Electronic assembly with llaterally connected capacitors and mfg. method |
| 05/16/2007 | CN1316581C Encapsulated pin structure for improved reliability of wafer |
| 05/16/2007 | CN1316580C Electrode assembly for the removal of surface oxides by electron attachment |
| 05/16/2007 | CN1316276C Optical/electrical components high speed signaling and optical/electrical printed circuit board |
| 05/16/2007 | CN1316133C Wireless transceiver for automotive vehicle |
| 05/16/2007 | CN1316066C Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 05/16/2007 | CN1315963C Process for producing electrical apparatus |
| 05/15/2007 | US7219322 Multiple propagation speeds of signals in layered circuit apparatus |
| 05/15/2007 | US7218530 Enhanced blind hole termination of pin to PCB |
| 05/15/2007 | US7218529 Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming |
| 05/15/2007 | US7218008 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/15/2007 | US7218002 Electronic device and intermediate product of electronic device |
| 05/15/2007 | US7217999 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board |
| 05/15/2007 | US7217888 Electronic parts packaging structure and method of manufacturing the same |
| 05/15/2007 | US7217645 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition |
| 05/15/2007 | US7217580 Method for processing an integrated circuit |
| 05/15/2007 | US7217504 high-density colour or monochrome images; especially on a transparent support; receiver having at least one radiation absorbing component having pre-determined spectral absorbance properties susceptible to alteration to form an altered radiation absorbing component |
| 05/15/2007 | US7217464 Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method |
| 05/15/2007 | US7217462 Polyimide layer improves thermopress-bonding property, solubility in solvents and heat resistance, and exhibits low dielectric constant; for application to high-frequency printed wiring boards |
| 05/15/2007 | US7217370 Wiring board and process for producing the same |
| 05/15/2007 | US7217334 Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic device |
| 05/15/2007 | US7217121 Method and apparatus for improved process control in combustion applications |
| 05/15/2007 | US7216425 Method of forming a non-continuous conductive layer for laminated substrates |
| 05/15/2007 | US7216424 Method for fabricating electrical connections of circuit board |