| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/12/2007 | WO2007038156A3 Led lighting with integrated heat sink and process for manufacturing same |
| 07/12/2007 | WO2006110634A3 Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method |
| 07/12/2007 | WO2006103979A8 (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof |
| 07/12/2007 | US20070161228 Wiring substrate and semiconductor device, and method of manufacturing wiring substrate |
| 07/12/2007 | US20070161209 Method for producing a strong bond between two layers of a multilayer system, and multilayer system |
| 07/12/2007 | US20070160865 blackened surface with a uniform hue, no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, high in transmittance, for a plasma display panel; 1st and 2nd layer of of Cu, a Cu-Co alloy, a Co- Ni alloy and a Cu-Co-Ni alloy, 3rd layer of Co, Ni, In or alloy |
| 07/12/2007 | US20070160858 Ceramic circuit board, method for making the same, and power module |
| 07/12/2007 | US20070160810 Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component |
| 07/12/2007 | US20070159511 Method of manufacturing an ink jet head |
| 07/12/2007 | US20070158387 Heater, reflow apparatus, and solder bump forming method and apparatus |
| 07/12/2007 | US20070158105 Multilayer wiring board capable of reducing noise over wide frequency band with simple structure |
| 07/12/2007 | US20070158104 Printed wiring board and production method thereof |
| 07/12/2007 | US20070158103 Multilayer board with built-in chip-type electronic component and manufacturing method thereof |
| 07/12/2007 | US20070158100 Insulated implantable electrical circuit |
| 07/12/2007 | US20070157845 Containing an optionally substituted bis(1H-tetrazole), e.g., 5,5'-bi(1H-tetrazole); 5,5'-azobis(mercaptotetrazole); and 5,5'-dithiobis(1-chlorotetrazole); improved heat resistance, adhesion to resin and solder wettability |
| 07/12/2007 | US20070157841 Patterning method and method for manufacturing liquid crystal display device using the same |
| 07/12/2007 | US20070157465 Method of fabricating a pressure sensor |
| 07/12/2007 | US20070157464 Soldering driving elements in LCD panels |
| 07/12/2007 | US20070157463 Method for gluing a circuit component to a circuit substrate |
| 07/12/2007 | US20070157462 Electronic component mounting apparatus and electronic component mounting method |
| 07/12/2007 | DE202007000583U1 Leitende Antennenanordnung und Vorrichtung zum Herstellen einer leitenden Antenne Conductive antenna array and apparatus for producing a conductive antenna |
| 07/12/2007 | DE102006059159A1 Mehrschichtige Leiterplatte und Verfahren zum Herstellen derselben Multilayer printed wiring board and method for producing same |
| 07/12/2007 | DE102006052505A1 Kameramodul umfassend eine gedruckte Schaltung mit Absatzbereich Camera module comprising a printed circuit board with the heel area |
| 07/12/2007 | DE102006030010A1 Verfahren zum Herstellen eines LCD sowie dabei verwendetes Musterstrukturierverfahren A method of manufacturing a LCD and thereby used Musterstrukturierverfahren |
| 07/12/2007 | DE102006016276B3 Method for applying solder particles on to contact surfaces for forming electrical connection, involves taking solder particles through self-organization process on contact surfaces |
| 07/12/2007 | DE102006002428A1 Production of structured layers of transparent conducting oxides on semiconductor layers or carbon modifications used in opto-electronic components comprises structuring the semiconductor layer and sputtering the conducting oxide |
| 07/12/2007 | DE102006000959A1 Electrical device for motor vehicle, has pressing pin that is pressed with end section into switch carrier to establish electrical connection, and another end section of pin is pressed into another carrier to establish connection |
| 07/12/2007 | DE102005063148A1 Vorrichtung und Verfahren zum Aufbringen eines Druckmediums auf einen Träger Apparatus and method for applying a printing medium to a carrier |
| 07/12/2007 | DE102004024753B4 Flachdrahtbaugruppe Flat wire assembly |
| 07/12/2007 | DE102004021156B4 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production |
| 07/11/2007 | EP1806959A1 Method of making a circuitized substrate |
| 07/11/2007 | EP1806958A1 Ceramic multilayer substrate and its producing method |
| 07/11/2007 | EP1806957A1 Multilayer substrate incorporating chip type electronic component and production method therefor |
| 07/11/2007 | EP1806956A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 07/11/2007 | EP1806038A2 Printed circuit board printing system and method |
| 07/11/2007 | EP1806037A1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 07/11/2007 | EP1806036A1 Packaging and manufacturing of an integrated circuit |
| 07/11/2007 | EP1506701B1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 07/11/2007 | EP1446990A4 Multilayer flexible fr4 circuit |
| 07/11/2007 | CN2922384Y Tunnel circuit board bake machine |
| 07/11/2007 | CN2922383Y Device used for diminishing printed-circuit board reflux deformation |
| 07/11/2007 | CN2920648Y Circuit board printing device and steel net thereof |
| 07/11/2007 | CN2920504Y Improved tin ball suction embedding mechanism of ball implantation machine |
| 07/11/2007 | CN1998273A Embedded power management control circuit |
| 07/11/2007 | CN1998036A Adhesive label, adhesive label roll, photosensitive web unit, and apparatus for and method of manufacturing photosensitive laminated body |
| 07/11/2007 | CN1997482A Method for laser drilling a multilayer workpiece |
| 07/11/2007 | CN1997267A The thick copper PCB and method to printed circuit board |
| 07/11/2007 | CN1997266A Resetting method for bad cascaded printed circuit board and its system |
| 07/11/2007 | CN1997265A A production debugging method for the wave peak welder to weld the plug-in printed board |
| 07/11/2007 | CN1997264A Automatic painting method of wave welding assisted agent |
| 07/11/2007 | CN1997261A Electronic carrier board and its packaging structure |
| 07/11/2007 | CN1996686A Laser package adaptor |
| 07/11/2007 | CN1996587A Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same |
| 07/11/2007 | CN1996580A Structure and making method of the base plate integrating the embedded parts |
| 07/11/2007 | CN1996562A Method of making a circuitized substrate |
| 07/11/2007 | CN1996518A Inductor apparatus, circuit board, and electronic device using the same |
| 07/11/2007 | CN1996144A Method for making hole-plugging ink composition for printed circuit board plating through hole and printed circuit board |
| 07/11/2007 | CN1996028A Substrate checking device and method |
| 07/11/2007 | CN1995473A Enivironment-friendly type surface treatment process for electrolytic copper foil |
| 07/11/2007 | CN1995459A Solution for removing printing board surface adhesion palladium and removing method |
| 07/11/2007 | CN1995454A Metal film forming device |
| 07/11/2007 | CN1994839A Static adsorption device |
| 07/11/2007 | CN1994751A Graph printing system and data processing method thereof |
| 07/11/2007 | CN1994661A Soldering driving elements in LCD panels |
| 07/11/2007 | CN1994659A Welding jig for circuit board |
| 07/11/2007 | CN1326436C Method for joining micro members |
| 07/11/2007 | CN1326435C Conductor track structures and method for production thereof |
| 07/11/2007 | CN1326434C Multi-piece substrate and method of manufacturing the same |
| 07/11/2007 | CN1326433C Ball grid array package |
| 07/11/2007 | CN1326432C High-density circuit board without weld pad design and manufacturing method thereof |
| 07/11/2007 | CN1326431C Wiring substrate |
| 07/11/2007 | CN1326222C Selective connection in ic packaging |
| 07/11/2007 | CN1326220C Element installation managing method, installation inspecting device and installation system |
| 07/11/2007 | CN1326213C Mfg. method of circuit substrate |
| 07/11/2007 | CN1326155C Conductive paste, multilayer board including the conductive paste and process for producing the same |
| 07/11/2007 | CN1325968C Liquid display and its making method |
| 07/11/2007 | CN1325699C Method and conveyorized system for electorlytically processing work pieces |
| 07/11/2007 | CN1325583C Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 07/11/2007 | CN1325565C Thermosetting resin composition and articles using the same |
| 07/11/2007 | CN1325255C Method for transferring a picture to a surface |
| 07/11/2007 | CN1325247C Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type |
| 07/11/2007 | CN1325235C Perforating device |
| 07/11/2007 | CN1325220C Method of laser welding |
| 07/10/2007 | US7242592 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics |
| 07/10/2007 | US7242591 Wiring board incorporating components and process for producing the same |
| 07/10/2007 | US7242099 Chip package with multiple chips connected by bumps |
| 07/10/2007 | US7242097 Electromigration barrier layers for solder joints |
| 07/10/2007 | US7242087 Flexible printed circuit board |
| 07/10/2007 | US7242083 Substrate for IC package |
| 07/10/2007 | US7241967 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 07/10/2007 | US7241680 Electronic packaging using conductive interposer connector |
| 07/10/2007 | US7241644 Adhesive, method of connecting wiring terminals and wiring structure |
| 07/10/2007 | US7241490 Enhanced adhesion between the intermediate layer and the film by including in the intermediate layer Mo, Cr, Ni, and/or Si dispersed to a depth of 20 nm or less from the surface; and a copper or copper alloy conductive layer formed on the intermediate layer |
| 07/10/2007 | US7241149 Interposed electrical connector which is intended to connect two stacked electronic circuits and to the method of mounting same |
| 07/10/2007 | US7241148 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same |
| 07/10/2007 | US7240822 Ball mounting method |
| 07/10/2007 | US7240432 Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece |
| 07/10/2007 | US7240430 Manufacturing methods for printed circuit boards |
| 07/10/2007 | US7240429 Manufacturing method for a printed circuit board |
| 07/10/2007 | US7240428 Method for making probes for atomic force microscopy |