| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/21/2007 | US7259466 Low temperature bonding of multilayer substrates |
| 08/21/2007 | US7259465 Semiconductor device with lead-free solder |
| 08/21/2007 | US7259336 Technique for improving power and ground flooding |
| 08/21/2007 | US7259335 Solder-bearing wafer for use in soldering operations |
| 08/21/2007 | US7259333 Composite laminate circuit structure |
| 08/21/2007 | US7259088 Apparatus for singulating and bonding semiconductor chips, and method for the same |
| 08/21/2007 | US7258918 Interposing polyphthalide pressure-sensitive electroconductive polymer between electrodes and applying pressure; polymer becomes electrically conductive when said pressure is applied; poly(phenylene phthalide); poly(arylene phthalide); no corrosion; high density, high precision |
| 08/21/2007 | US7258808 High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same |
| 08/21/2007 | US7258549 Connection member and mount assembly and production method of the same |
| 08/21/2007 | US7258537 Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates |
| 08/21/2007 | US7258423 Recording head unit, method of manufacturing the same, and recording apparatus using the unit |
| 08/21/2007 | US7258264 Methods for manufacturing optical modules using lead frame connectors |
| 08/21/2007 | US7258150 Machine for continuously producing plastic laminates in a cold press |
| 08/21/2007 | US7257892 Method of manufacturing wiring board |
| 08/21/2007 | US7257891 Method for forming bonding pads |
| 08/21/2007 | US7257880 Method for assembling an actuator head suspension |
| 08/21/2007 | US7257857 Apparatus and method for circuit board routing fixture |
| 08/21/2007 | CA2236464C Solder-holding clips for applying solder to connectors |
| 08/16/2007 | WO2007091635A1 Contact-bonding device |
| 08/16/2007 | WO2007091582A1 Method for manufacturing multilayer wiring board |
| 08/16/2007 | WO2007091402A1 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board |
| 08/16/2007 | WO2007090589A2 Holder for a flexible circuit board |
| 08/16/2007 | WO2007073572A3 New pad geometry for printed circuit boards |
| 08/16/2007 | WO2006057713A3 Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
| 08/16/2007 | US20070191513 Hardenable reaction resin system |
| 08/16/2007 | US20070190846 Multilayer printed wiring board and test body for printed wiring board |
| 08/16/2007 | US20070190326 Method for patterning metal using nanoparticle containing precursors |
| 08/16/2007 | US20070190237 Method of manufacturing a wiring substrate |
| 08/16/2007 | US20070189661 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly |
| 08/16/2007 | US20070188693 Drive ic and display device having the same |
| 08/16/2007 | US20070188692 Driver module structure |
| 08/16/2007 | US20070188556 Nozzle For An Inkjet Printer Incorporating A Plunger Assembly |
| 08/16/2007 | US20070188261 Transmission line with a transforming impedance and solder lands |
| 08/16/2007 | US20070188257 Electromagnetically shielded slot transmission line |
| 08/16/2007 | US20070187373 Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam |
| 08/16/2007 | US20070187138 Wire bonding apparatus, record medium storing bonding control program, and bonding method |
| 08/16/2007 | US20070186415 Anticorrosive bipolar fuel cell board and method for manufacturing the same |
| 08/16/2007 | US20070186414 Multilayer wiring board incorporating carbon fibers and glass fibers |
| 08/16/2007 | DE10332573B4 Verfahren zum Erzeugen von Lotkontakten auf Bauelementen A method of generating components on Lotkontakten |
| 08/16/2007 | DE10222958B4 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element A method of manufacturing an organic electro-optical element and an organic electro-optical element |
| 08/16/2007 | DE102006004322A1 Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung Circuit board comprising additional functional elements and production methods and application |
| 08/16/2007 | DE102006004321A1 Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung Bendable board with additional functional element and a Kerbfräsung and manufacturing and application |
| 08/16/2007 | DE10134011B4 Trägersubstrat, das zur Kontaktierung mit einer integrierten Schaltung vorgesehen ist Carrier substrate, which is provided for contacting with an integrated circuit |
| 08/15/2007 | EP1818980A2 Substrate for high voltage modules |
| 08/15/2007 | EP1818122A1 Manufacturing method for monodisperse spherical metal particles |
| 08/15/2007 | EP1817947A1 Single or multi-layer printed circuit board with improved via design |
| 08/15/2007 | EP1817946A2 Method and device for producing structures from functional materials |
| 08/15/2007 | EP1817443A2 Membrane-limited selective electroplating of a conductive surface |
| 08/15/2007 | EP1629420B1 Method for producing a contactless ticket |
| 08/15/2007 | EP1439017B1 Monodisperse metal spherical particle |
| 08/15/2007 | EP1354326B1 Flexible strip cable and method of manufacturing it |
| 08/15/2007 | EP1309976A4 Photolithographically-patterned out-of-plane coil structures |
| 08/15/2007 | EP1004126B1 Electrical component, specially a chip inductive resistor |
| 08/15/2007 | CN1332591C Radio frequency device |
| 08/15/2007 | CN1332588C Structure of soldering pad for improving stray effect |
| 08/15/2007 | CN1332400C Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure |
| 08/15/2007 | CN1332244C Compact display assembly |
| 08/15/2007 | CN1331902C Dyed fluoropolymers |
| 08/15/2007 | CN1331736C Potassium hydrogen peroxymonosulfate solutions |
| 08/15/2007 | CN1331632C Noise free highly effective electromagnetic pump soft soldered single/double peak generator |
| 08/15/2007 | CN101019476A Method for producing dielectric layer-constituting material, dielectric layer-constituting material produced by such method, method for manufacturing capacitor circuit-forming member using such dielec |
| 08/15/2007 | CN101019475A Method of attaching a solder element to a contact and the contact assembly formed thereby |
| 08/15/2007 | CN101019474A Structured surface using ablatable radiation sensitive material |
| 08/15/2007 | CN101019251A Electric circuit battery support |
| 08/15/2007 | CN101018643A Solder paste and electronic device using same |
| 08/15/2007 | CN101018478A System for handling components at a component mounting machine |
| 08/15/2007 | CN101018477A 表面安装机 Surface mounting machine |
| 08/15/2007 | CN101018456A Bare chip embedded PCB and method of the same |
| 08/15/2007 | CN101018455A Making method of the circuit board for preventing etchant etching aluminum base board |
| 08/15/2007 | CN101018454A Device and method for manufacturing flexible printing substrate |
| 08/15/2007 | CN101018453A Wiring board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 08/15/2007 | CN101018452A Multilayer printed wiring board |
| 08/15/2007 | CN101018447A Circuit base board, its encapsulation structure, and making method of the encapsulation structure |
| 08/15/2007 | CN101018446A A passive base board for the switch power module and its making method |
| 08/15/2007 | CN101018092A Radio communication device |
| 08/15/2007 | CN101017925A The making method of the thin film antenna |
| 08/15/2007 | CN101017806A Package substrate |
| 08/15/2007 | CN101017733A Ic插座 Ic Socket |
| 08/15/2007 | CN101015866A The drilling processing machine for printed circuit boards |
| 08/14/2007 | US7257792 Wiring board design aiding apparatus, design aiding method, storage medium, and computer program |
| 08/14/2007 | US7257281 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom |
| 08/14/2007 | US7256738 Resonant circuits |
| 08/14/2007 | US7256495 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 08/14/2007 | US7256490 Test carrier for semiconductor components having conductors defined by grooves |
| 08/14/2007 | US7256484 Memory expansion and chip scale stacking system and method |
| 08/14/2007 | US7256354 Technique for reducing the number of layers in a multilayer circuit board |
| 08/14/2007 | US7256353 Metal/ceramic bonding substrate and method for producing same |
| 08/14/2007 | US7256345 Cable and manufacturing method therefor |
| 08/14/2007 | US7256115 Asymmetric plating |
| 08/14/2007 | US7255931 Aluminum/ceramic bonding substrate and method for producing same |
| 08/14/2007 | US7255919 Mold release layer transferring film and laminate film |
| 08/14/2007 | US7255837 Airtight apparatus for use in preventing permeation of corrosive gas into container |
| 08/14/2007 | US7255802 Tape substrate and method for fabricating the same |
| 08/14/2007 | US7255782 Selective catalytic activation of non-conductive substrates |
| 08/14/2007 | US7255426 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same |
| 08/14/2007 | US7255424 Ink nozzle |
| 08/14/2007 | US7254889 Interconnection devices |
| 08/14/2007 | US7254888 Method for manufacturing graphite-base heat sinks |
| 08/09/2007 | WO2007089917A1 Off-axis illumination assembly and method |
| 08/09/2007 | WO2007088748A1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package |