| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/26/2007 | WO2007083811A1 Conductive paste, multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate |
| 07/26/2007 | WO2007083710A1 Conductive paste and wiring board using same |
| 07/26/2007 | WO2007083690A1 Active energy ray-curable resin composition and use thereof |
| 07/26/2007 | WO2007083606A1 Printing mask and solar cell manufacturing method using same |
| 07/26/2007 | WO2007083378A1 Chip component mounting structure, chip component mounting method and electronic device |
| 07/26/2007 | WO2007082886A1 Printed circuit board contact-connection |
| 07/26/2007 | WO2007082776A1 Method for representing release forces |
| 07/26/2007 | WO2007064204A3 Method and system for processing frozen adhesive particles |
| 07/26/2007 | WO2007061448A9 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| 07/26/2007 | US20070173135 Printed wiring board for mounting semiconductor |
| 07/26/2007 | US20070173053 Method for manufacturing wiring and method for manufacturing semiconductor device |
| 07/26/2007 | US20070173052 Electroplating method by transmitting electric current from a ball side |
| 07/26/2007 | US20070173048 Method of manufacturing an electrical component |
| 07/26/2007 | US20070173034 Method for manufacturing integrated circuit |
| 07/26/2007 | US20070172992 Methods for fabricating stiffeners for flexible substrates |
| 07/26/2007 | US20070172756 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed wiring board |
| 07/26/2007 | US20070172704 Patterned medium and method of manufacturing the same |
| 07/26/2007 | US20070171621 Circuit board with embedded passive component and fabricating process thereof |
| 07/26/2007 | US20070170942 Methods for fabricating fences on interposer substrates |
| 07/26/2007 | US20070170598 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 07/26/2007 | US20070170592 Apparatus for solder crack deflection |
| 07/26/2007 | US20070170566 Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument |
| 07/26/2007 | US20070170227 Soldering method |
| 07/26/2007 | US20070170064 Method of electrolytically depositing materials in a pattern directed by surfactant distribution |
| 07/26/2007 | US20070169960 Multilayer stacked wiring board |
| 07/26/2007 | US20070169958 Mask for exposure |
| 07/26/2007 | US20070169879 Method and apparatus for producing a detail |
| 07/26/2007 | US20070169343 Methods of fabricating substrates including one or more conductive vias |
| 07/26/2007 | US20070169342 Connection pad layouts |
| 07/26/2007 | US20070169341 Circuit board design |
| 07/26/2007 | DE4407508B4 Verfahren zum Einbetten von elektrischen Leiterbahnen in einen Kunststoff A method of embedding electrical interconnects in a plastic |
| 07/26/2007 | DE102006037273A9 Abgeflachte, mit Harz beschichtete gedruckte Leiterplatte Flattened resin-coated printed circuit board |
| 07/26/2007 | DE102006003348A1 Verfahren zur Darstellung von Trennkräften A process for the preparation of separation forces |
| 07/26/2007 | DE102004055955B4 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing |
| 07/25/2007 | EP1811825A1 Multilayer printed wiring board with filled viaholes |
| 07/25/2007 | EP1811824A1 Multilayer printed wiring board and process for producing the same |
| 07/25/2007 | EP1811823A1 Multilayer printed wiring board |
| 07/25/2007 | EP1811822A2 Solder component assembly |
| 07/25/2007 | EP1811821A1 Method of recycling waste printed circuit boards |
| 07/25/2007 | EP1811554A2 Foamable underfill encapsulant |
| 07/25/2007 | EP1810554A1 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| 07/25/2007 | EP1810553A1 Flexible multi-layer circuit board provided with opposing flexible conductive structures and method for the production thereof |
| 07/25/2007 | EP1810385A2 Microelectronics package and method |
| 07/25/2007 | EP1738626B1 Process for manufacturing a power electronic appliance by bending |
| 07/25/2007 | EP1460644B1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating |
| 07/25/2007 | EP1430757B1 Throughplating of flexible printed boards |
| 07/25/2007 | EP0971570B1 Printed wiring board and its manufacturing method |
| 07/25/2007 | CN1328934C Printed circuit board for mounting a quad flat package IC, method of soldering a quad flat package IC, and air conditioning apparatus with such a printed circuit board |
| 07/25/2007 | CN1328824C Solder-bearing articles and method of retaining a solder mass thereon |
| 07/25/2007 | CN1328785C Method of manufacturing heat conductive substrate |
| 07/25/2007 | CN1328784C COF flexible printed circuit board and method for making said circuit board |
| 07/25/2007 | CN1328769C COF film carrier tape and its manufacturing method |
| 07/25/2007 | CN1328733C Conductor for flat cabal and its producing method and flat cabal |
| 07/25/2007 | CN1328196C Etching solution for forming an embedded resistor |
| 07/25/2007 | CN1328001C Laser machining method |
| 07/25/2007 | CN101006352A Substrate with patterned conductive layer |
| 07/25/2007 | CN101006125A A method of recycling mixed streams of ewaste (WEEE) |
| 07/25/2007 | CN101005918A Flux for soldering |
| 07/25/2007 | CN101005917A Solder composition, connection method and structure utilizing welding |
| 07/25/2007 | CN101005735A Alignment plate |
| 07/25/2007 | CN101005734A Alignment plate |
| 07/25/2007 | CN101005733A Method for producing thin semiconductor lighting plane integrated optic source module |
| 07/25/2007 | CN101005732A 印刷电路板组件 Printed circuit board assembly |
| 07/25/2007 | CN101004980A 外部电极形成方法 The external electrode forming method |
| 07/25/2007 | CN101004979A Double layer capacitor and its combination and method for mounting it on print circuit board |
| 07/25/2007 | CN101004402A Method for monitoring porefilling capability of copper electroplating solution |
| 07/25/2007 | CN101003199A Half-tone screen device |
| 07/25/2007 | CN101003191A Composite sheet |
| 07/24/2007 | US7249337 Method for optimizing high frequency performance of via structures |
| 07/24/2007 | US7249028 Manufacturing labor cost estimator |
| 07/24/2007 | US7248482 Module with built-in circuit component and method for producing the same |
| 07/24/2007 | US7248355 Using special visibility materials proximate candidate component locations to enhance recognition |
| 07/24/2007 | US7248274 Thermal head having adhesive layer partially disposed on heat sink and method for manufacturing such thermal head |
| 07/24/2007 | US7247942 Techniques for joining an opto-electronic module to a semiconductor package |
| 07/24/2007 | US7247941 Printed circuit board assembly with strain-alleviating structures |
| 07/24/2007 | US7247938 Carrier, method of manufacturing a carrier and an electronic device |
| 07/24/2007 | US7247800 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 07/24/2007 | US7247590 Blend of liquid crystalline aromatic polyester and dielectric ceramics |
| 07/24/2007 | US7247563 Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) |
| 07/24/2007 | US7247557 Method and composition to minimize dishing |
| 07/24/2007 | US7247508 Semiconductor device with intermediate connector |
| 07/24/2007 | US7247381 used to bond and fix a semiconductor chip to a substrate |
| 07/24/2007 | US7247363 Supported greensheet structure and method in MLC processing |
| 07/24/2007 | US7247178 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same |
| 07/24/2007 | US7247031 Electric junction box and its assembling process |
| 07/24/2007 | US7246910 Vehicle rearview mirror system with compass sensor and method of making same |
| 07/24/2007 | US7246878 Method of generating ejection pattern data, and head motion pattern data; apparatus for generating ejection pattern data; apparatus for ejecting functional liquid droplet; drawing system; method of manufacturing organic EL device, electron emitting device, PDP device, electrophoresis display device, color filter, and organic EL; and method of forming spacer, metal wiring, lens, resist, and light diffuser |
| 07/24/2007 | US7246431 Methods of making microelectronic packages including folded substrates |
| 07/19/2007 | WO2007081006A1 Solder alloy, solder ball and solder joint using same |
| 07/19/2007 | WO2007080956A1 Pressure bonding device and mounting method |
| 07/19/2007 | WO2007080943A1 Three-dimensional circuit board and its manufacturing method |
| 07/19/2007 | WO2007080863A1 Semiconductor device, printed wiring board mounted with such semiconductor device, and connection structure for those |
| 07/19/2007 | WO2007080713A1 Printed wiring board with built-in semiconductor element, and process for producing the same |
| 07/19/2007 | WO2007080698A1 Photosensitive resin composition, photosensitive transfer film, and method for pattern formation |
| 07/19/2007 | WO2007047940A3 Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof |
| 07/19/2007 | US20070167041 Modules forfixing flexible printed circuit boards and flat display devices utilizing the same |
| 07/19/2007 | US20070167037 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board |
| 07/19/2007 | US20070166886 Method for manufacturing an electronic module |
| 07/19/2007 | US20070166876 Components, methods and assemblies for multi-chip packages |
| 07/19/2007 | US20070166642 Photosensitive resin composition, and cured product and use thereof |