| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/20/2007 | EP1797479A1 Device obtained by nanoprinting comprising metallic patterns and method for nanoprinting of metallic patterns |
| 06/20/2007 | EP1796863A1 Wave soldering device |
| 06/20/2007 | EP1741323A4 Fusion bonded assembly with attached leads |
| 06/20/2007 | EP1719156B1 Device for singulating and bonding semiconductor chips, and singulating and bonding method |
| 06/20/2007 | EP1552730B1 Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
| 06/20/2007 | EP1275277B1 Process for stacking layers that form a multilayer printed circuit |
| 06/20/2007 | EP0993242B1 Method of producing ceramic multilayer substrate |
| 06/20/2007 | CN2914585Y Tin supply device |
| 06/20/2007 | CN2914584Y Spraying tube structure of printed circuit board wet preparation device |
| 06/20/2007 | CN2914583Y Tank container of printed circuit board wet preparation device |
| 06/20/2007 | CN2914582Y Spraying pipeline device of printed circuit board wet preparation device |
| 06/20/2007 | CN2914581Y Swing soft tube connecting device of printed circuit board wet preparation device |
| 06/20/2007 | CN2914580Y Quick joint of thrust jet of printed circuit board wet preparation device |
| 06/20/2007 | CN2914579Y Spraying structure of wet device of printed circuit board |
| 06/20/2007 | CN2914578Y Pinboard assembling and disassembling structure |
| 06/20/2007 | CN2913995Y Air knife for printed circuit board wet production |
| 06/20/2007 | CN2912885Y Hot-press apparatus |
| 06/20/2007 | CN1985553A Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 06/20/2007 | CN1985552A Conductive member for non-contact type data carrier and method and device for manufacturing the same |
| 06/20/2007 | CN1985366A Method of manufacture of electronic or functional devices |
| 06/20/2007 | CN1985023A Method for improving solderability of nickel coatings |
| 06/20/2007 | CN1984938A Photocurable/thermosetting resin composition and cured product thereof |
| 06/20/2007 | CN1984537A Preparing device for boring contact bores on multi-layer conducting plate |
| 06/20/2007 | CN1984536A Method of manufacturing printed circuit board having landless via hole |
| 06/20/2007 | CN1984535A Method for implanting circuit board |
| 06/20/2007 | CN1984534A Production of flexible printing circuit board |
| 06/20/2007 | CN1984533A Printed circuit board having embedded electronic components and manufacturing method thereof |
| 06/20/2007 | CN1984532A Power module structure, and soild state relay using the same |
| 06/20/2007 | CN1984530A Medium laminated substrate |
| 06/20/2007 | CN1984527A Ultrathin copper foil with carrier and printed circuit board |
| 06/20/2007 | CN1984526A Ultrathin copper foil with carrier and printed circuit board |
| 06/20/2007 | CN1983557A Substrate dividing method |
| 06/20/2007 | CN1983556A Substrate dividing method |
| 06/20/2007 | CN1983542A Method for manufacturing electronic device |
| 06/20/2007 | CN1983534A Method of manufacturing wiring board |
| 06/20/2007 | CN1983484A Switch device having switch element and electric parts and assistant electronic circuit thereof |
| 06/20/2007 | CN1983481A Method for forming an outer electrode |
| 06/20/2007 | CN1983460A Thick film conductor compositions and processing technology thereof for use in multilayer electronic circuits and devices |
| 06/20/2007 | CN1983236A Auxiliary wiring system and method |
| 06/20/2007 | CN1982880A Differential comparison inspection method and apparatus thereof |
| 06/20/2007 | CN1982774A Flashlight |
| 06/20/2007 | CN1982056A 网版印刷装置 A screen printing device |
| 06/20/2007 | CN1982043A Device for pressing workpiece |
| 06/20/2007 | CN1322797C Improved adhesion of polymeric materials to metal surfaces |
| 06/20/2007 | CN1322796C Multilayer printed wiring board |
| 06/20/2007 | CN1322795C Connecting apparatus and producing method thereof |
| 06/20/2007 | CN1322794C Thermosetting electroconductive paste for electroconductive bump use |
| 06/20/2007 | CN1322633C Electronic equipment with distribution substrate with maintaining press fit terminal |
| 06/20/2007 | CN1322630C A method and a device for manufacturing a roll of items |
| 06/20/2007 | CN1322587C Electrical contacts for flexible displays |
| 06/20/2007 | CN1322468C IC card |
| 06/20/2007 | CN1322307C Apparatus for surface inspection and method and apparatus for inspecting substrate |
| 06/20/2007 | CN1322075C A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
| 06/20/2007 | CN1322060C Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 06/20/2007 | CN1321770C Overlapping method for joint foot and welding flux and electronic element using such method |
| 06/19/2007 | US7233072 Electronic part and surface treatment method of the same |
| 06/19/2007 | US7233069 Interconnection substrate and fabrication method thereof |
| 06/19/2007 | US7233066 Multilayer wiring substrate, and method of producing same |
| 06/19/2007 | US7232959 Printed circuit board and interleaving routing scenario thereof |
| 06/19/2007 | US7232958 Apparatus and method for fixing component of circuit substrate |
| 06/19/2007 | US7232957 Hybrid integrated circuit device and method of manufacturing the same |
| 06/19/2007 | US7232876 Phosphorus-containing urethane(meth)acrylate compounds and photosensitive compositions |
| 06/19/2007 | US7232754 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 06/19/2007 | US7232610 Surface-activated film of a polyimide substrate layer and a polyimide surface layer of biphenyltetracarboxylic acid units and p-phenylenediamine; bendable bondings in its molecular structure to produce a network of protrusions, with a metal coating |
| 06/19/2007 | US7232608 Conductive material and manufacturing method thereof |
| 06/19/2007 | US7232528 Surface treatment agent for copper and copper alloy |
| 06/19/2007 | US7232496 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| 06/19/2007 | US7232478 Adhesion promotion in printed circuit boards |
| 06/19/2007 | US7232315 Connection structure for printed wiring board |
| 06/19/2007 | US7231857 Depaneling systems |
| 06/19/2007 | US7231855 Method and related apparatus for cutting a product from a sheet material |
| 06/19/2007 | US7231712 Method of manufacturing a module |
| 06/19/2007 | US7231711 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device |
| 06/19/2007 | US7231707 Method of manufacturing planar inductors |
| 06/14/2007 | WO2007066788A1 Fluororesin laminate substrate |
| 06/14/2007 | WO2007066751A1 Method for producing metal thin body |
| 06/14/2007 | WO2007066564A1 Printed wiring board with component-mounting pin |
| 06/14/2007 | WO2007066563A1 Printed wiring board with component-mounting pins and electronic equipment using the same |
| 06/14/2007 | WO2007044232A3 Pre-treatment to eliminate the defects formed during electrochemical plating |
| 06/14/2007 | WO2006124400A3 Method of making an electronic device using an electrically conductive polymer, and associated products |
| 06/14/2007 | WO2006038907A3 Lead-free solder composition for substrates |
| 06/14/2007 | US20070134952 Method of forming a non-continuous conductive layer for laminated substrates |
| 06/14/2007 | US20070134491 Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances |
| 06/14/2007 | US20070134420 Methods for modifying surfaces |
| 06/14/2007 | US20070134007 Printed circuit board and an image forming apparatus having the printed circuit board |
| 06/14/2007 | US20070132545 Chip resistor and method of making the same |
| 06/14/2007 | US20070132099 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 06/14/2007 | US20070132098 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin |
| 06/14/2007 | US20070132097 Projected contact structures for engaging bumped semiconductor devices |
| 06/14/2007 | US20070131349 Method for manufacturing an electronic module, and an electronic module |
| 06/14/2007 | US20070131141 Surface processing agent for tin or tin alloy material |
| 06/14/2007 | US20070130762 Circuit substrate manufacturing method |
| 06/14/2007 | DE19957326B4 Verfahren zur Herstellung von Kontaktstrukturen A method for producing contact structures |
| 06/14/2007 | DE19837336B4 Verfahren zur Herstellung einer Platte von gekapselten integrierten Schaltkreisen und Form zum Kapseln eines plattenförmigen Substrats von integrierten Schaltkreisen A method for manufacturing a plate of the encapsulated integrated circuits and to form capsules of a plate-shaped substrate of integrated circuits |
| 06/14/2007 | DE19708325B4 Klebeverbindung von elektrisch leitenden Fügeteilen Adhesive bond electrically conductive parts to be joined |
| 06/14/2007 | DE10307309B4 Vorrichtung und Verfahren zur Bearbeitung von elektrischen Schaltungssubstraten mittels Laser Apparatus and method for processing electrical circuit substrates by laser |
| 06/14/2007 | DE10254547B4 Anordnung zum mechanischen Schutz für die Chip-Modul-Montage An arrangement for mechanical protection for the chip module assembly |
| 06/14/2007 | DE102006001254A1 Verfahren zur Herstellung von Lotkugeln mit einer stabilen Oxidschicht durch Steuern der Aufschmelzumgebung A process for producing solder balls having a stable oxide layer by controlling the Aufschmelzumgebung |
| 06/14/2007 | DE102005059360A1 Vorrichtung und Verfahren zum Verguss von Schaltungsanordnungen Apparatus and method for encapsulation of circuits |
| 06/14/2007 | DE102005059082A1 Verfahren zum Vergießen elektrischer Komponenten und Gehäuseanordnung A method for encapsulating electrical components and housing assembly |