Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2007
09/26/2007CN100340141C Manufacturing method of pin structural
09/26/2007CN100340140C Flexible printed circuit board and process for producing the same
09/26/2007CN100340031C Housing, apparatus and method for housing assembling, and connector structure having housing
09/26/2007CN100339987C Electronic member, method for making the same, and semiconductor device
09/26/2007CN100339982C Multi-layer ceramic package device and mfg method thereof
09/26/2007CN100339980C Semiconductor component comprising surface metallization
09/26/2007CN100339965C TAB tape carrier and producing method thereof
09/26/2007CN100339950C Planar stage device
09/26/2007CN100339715C 接触探针 The touch probe
09/26/2007CN100339446C Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish
09/26/2007CN100339226C Thermal head and method for manufacturing such thermal head
09/26/2007CN100339195C Sheet-cutting apparatus
09/25/2007US7274837 Optical transmitter
09/25/2007US7274570 Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment
09/25/2007US7274533 Disk device
09/25/2007US7274105 Thermal conductive electronics substrate and assembly
09/25/2007US7274100 Battery protection circuit with integrated passive components
09/25/2007US7274048 Substrate based ESD network protection for a flip chip
09/25/2007US7273988 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
09/25/2007US7273987 Flexible interconnect structures for electrical devices and light sources incorporating the same
09/25/2007US7273900 Styrenic crosslinking agent such as 1,2-Bis(vinylphenyl)ethane (BVPE), a polymer such as butadiene-styrene copolymer, an inorganic filler, and a treating agent such as a trialkoxysilane compound; reduces the dielectric loss
09/25/2007US7273821 Method for producing a porous coating
09/25/2007US7273802 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
09/25/2007US7273540 Electrolytic plating using a solution of water, a sulfonic acid, and tin, copper, and silver ions, and an organic complexing agent; separating a solution around a soluble anode from the plating solution on a cathode side by a non-ionic micro-porous membrane
09/25/2007US7273401 Grouped element transmission channel link with pedestal aspects
09/25/2007US7273380 Flexible ring interconnection system
09/25/2007US7273135 Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials
09/25/2007US7272889 Production method of suspension board with circuit
09/25/2007US7272888 Method of fabricating semiconductor chip assemblies
09/25/2007CA2292528C Device and methods for wound treatment
09/20/2007WO2007106362A2 Laser delamination of thin metal film using sacrificial polymer layer
09/20/2007WO2007106180A2 Photovoltaic contact and wiring formation
09/20/2007WO2007105763A1 Circuit board, electronic circuit device, and display
09/20/2007WO2007105716A1 Substrate and device
09/20/2007WO2007105713A1 Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
09/20/2007WO2007105687A1 Paste transfer apparatus and electronic component mounting apparatus
09/20/2007WO2007105555A1 Noise suppressing structure, multilayer printed circuit board and method for manufacturing such multilayer printed circuit board
09/20/2007WO2007105535A1 Electronic part mounting structure and its manufacturing method
09/20/2007WO2007105361A1 Electronic component module
09/20/2007WO2007105009A2 Improvements in circuits comprising a substrate carrying a conductive track
09/20/2007WO2007104702A1 An electronic device for ambient lighting and a manufacturing process thereof
09/20/2007WO2007104700A2 A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby
09/20/2007WO2007104229A1 Method and system for evaluating the corrosion risk of a circuit board
09/20/2007US20070218957 Touch Panel And Protective Panel For Display Window Of Electronic Device Using The Same
09/20/2007US20070218721 Electrical Equipment for Junction and Method of Manufacturing the Same
09/20/2007US20070218315 Laminate for hdd suspension and process for producing the same
09/20/2007US20070218305 Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same
09/20/2007US20070218277 Adhesive Film, Flexible Metal-Clad Laminate, and Processes for Producing These
09/20/2007US20070218257 Circuit board, its manufacturing method, and joint box using circuit board
09/20/2007US20070218220 Methods of forming tracks and track arrangements
09/20/2007US20070217168 Method, System And Apparatus For Controlled Impedance At Transitional Plated-Through Hole Via Sites Using Barrel Inductance Minimization
09/20/2007US20070217167 Component Placement Substrate and Production Method Thereof
09/20/2007US20070216914 Method for Providing a Substrate With a Printed Pattern
09/20/2007US20070215820 Methods and systems for thermal-based laser processing a multi-material device
09/20/2007US20070215454 Method for Oxidizing Substance and Oxidation Apparatus Therefor
09/20/2007US20070215376 Method For Printing Electrical And/Or Electronic Structures And Film For Use In Such A Method
09/20/2007US20070214637 Conductive Member for Non-Contact Type Data Carrier and Method and Device for Manufacturing the Same
09/20/2007US20070214622 Surface acoustic wave apparatus and manufacturing method therefor
09/20/2007DE112005002358T5 Bewertung der Mikroviabildung in einem Herstellungsverfahren für Leiterplattensubstrate Evaluation of Mikroviabildung in a manufacturing process for printed circuit board substrates
09/20/2007DE102007007482A1 Printed circuit board processing device for e.g. machine tool, has printed circuit boards mounted on tables, and control unit controlling X-axis and Y-axis drive sections to move X-direction axle and Y-direction axle in direction
09/20/2007DE102006043357A1 Photoempfindliche, hitzehärtbare Harzzusammensetzung, mit einem mit Resistfilm überzogene, geglättete, gedruckte Schaltungsplatine und Verfahren zu ihrer Herstellung A photosensitive thermosetting resin composition, with a resist film coated, smoothed, and printed circuit board processes for their preparation
09/20/2007DE102006012296A1 Etching process, for producing finely-structured printed circuit boards, uses etching solution containing copper chloride, iron chloride and hydrochloric acid, exhausted solution being treated in regeneration cell after adding more copper
09/19/2007EP1835796A1 Interposer bonding device
09/19/2007EP1835792A1 Method of manufacturing printed wiring board
09/19/2007EP1835791A2 Method of laser welding, manufactoring method of control unit, and car electronic control unit
09/19/2007EP1835790A1 Printed wiring board
09/19/2007EP1835052A2 Process for manufacturing a multilayer printed circuit board, and multilayer printed circuit board
09/19/2007EP1834728A1 Lead-free solder flux and solder paste
09/19/2007EP1833928A1 Conductive silver dispersions and uses thereof
09/19/2007EP1731006B1 Liquid crystalline polymer- and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications
09/19/2007EP1470920B1 Ink jet head and manufacturing method thereof
09/19/2007EP1102525B1 Printed wiring board and method for producing the same
09/19/2007CN200950697Y Supports
09/19/2007CN101040573A Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package
09/19/2007CN101040572A Double layer flexible board and method for manufacturing the same
09/19/2007CN101040571A Double layer flexible board and method for manufacturing the same
09/19/2007CN101040062A Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them
09/19/2007CN101039553A Improved adhesion of polymeric materials to metal surfaces
09/19/2007CN101039552A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039551A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039550A Method of forming metal wiring and method of manufacturing active matrix substrate
09/19/2007CN101039549A Manufacturing method of wiring substrate and mask used for printing
09/19/2007CN101039546A Lead-free compatible high frequency copper clad laminate and its preparing method
09/19/2007CN101039545A Wired circuit board and connection structure between wired circuit boards
09/19/2007CN101039532A Reflow-resistance welding electret microphone PCB thickening solder pad and its manufacture method
09/19/2007CN101038982A Device for producing electroconductive antenna
09/19/2007CN101038981A Electroconductive antenna arrangement and its producing method
09/19/2007CN101038887A Method for manufacturing substrate of embedded element
09/19/2007CN101038886A Method for manufacturing substrate of embedded element
09/19/2007CN101038885A Method for manufacturing substrate of embedded element
09/19/2007CN101038881A Method for manufacturing substrate
09/19/2007CN101038880A Method for manufacturing substrate
09/19/2007CN101038797A Large power thick film circuit resistance paste of stainless steel substrate and preparing method thereof
09/19/2007CN101037646A Cleaning agent for removing solder flux and method for cleaning solder flux
09/19/2007CN101037581A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037573A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037572A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037062A Method and apparatus for screen printing
09/19/2007CN101037031A Method and apparatus for film adhesion
09/19/2007CN100338987C Base board operation result checking device and method and electric circuit producing system and method