Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2007
10/10/2007CN101052272A Multilayer circuit board
10/10/2007CN101052271A Circuit board and liquid discharging apparatus
10/10/2007CN101052270A Wiring basal plate
10/10/2007CN101052269A Wired circuit board and production method thereof
10/10/2007CN101052266A Printed circuit board and manufacturing method thereof
10/10/2007CN101051615A Base plate with buried passive element and its producing method
10/10/2007CN101051557A Miniature coils on core with printed circuit
10/10/2007CN101051472A 磁头组件 Head assembly
10/10/2007CN101050846A Method for producing flexible light source and flexible base board and flexible solid state light source
10/10/2007CN101049771A Method for preparing laser locating points of template, and laser template produced by the method
10/10/2007CN100342768C Electronic component with shielding case and method of manufacturing the same
10/10/2007CN100342760C Laser drilling,particular laser drilling method with a perforated mask
10/10/2007CN100342590C Conduvtive elastic contact system having anti overstress column
10/10/2007CN100342526C Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof
10/10/2007CN100342395C Method for manufacturing RFID labels
10/10/2007CN100342281C Imaging device packaging, camera module and the producing process of the camera module
10/10/2007CN100341992C Semiconductor process residue removal composition and process
10/10/2007CN100341938C Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board
10/10/2007CN100341901C Synthesis of polymer and film of the polymer
10/10/2007CN100341629C Method for patterning carbon nanotube coating and carbon nanotube wiring
10/09/2007US7280716 Printed circuit board including waveguide and method of producing the same
10/09/2007US7280372 Stair step printed circuit board structures for high speed signal transmissions
10/09/2007US7280202 Ingredient analysis method and ingredient analysis apparatus
10/09/2007US7279914 Circuit board checker and circuit board checking method
10/09/2007US7279798 High wireability microvia substrate
10/09/2007US7279794 Semiconductor device and electronic device, and methods for manufacturing thereof
10/09/2007US7279788 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
10/09/2007US7279784 Semiconductor package
10/09/2007US7279781 Two-stage transfer molding device to encapsulate MMC module
10/09/2007US7279776 Method of manufacturing semiconductor device and semiconductor device
10/09/2007US7279771 Wiring board mounting a capacitor
10/09/2007US7279412 Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same
10/09/2007US7279365 Method of manufacturing heat conductive substrate
10/09/2007US7279216 Identifiable flexible printed circuit board and method of fabricating the same
10/09/2007US7279195 Addition polymerization of a polymer having a crosslinkable side chain on a support, graft polymerization with another monomer that can contain a metal ion or salt, and reducing the metal ion or salt to form a fine metal particle; for electric wiring, electromagnetic wave-blocking films, magnetic films
10/09/2007US7279108 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate
10/09/2007US7278725 Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus
10/09/2007US7278564 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
10/09/2007US7278459 Common carrier
10/09/2007US7278207 Method of making an electronic package
10/09/2007US7278205 Multilayer printed wiring board and production method therefor
10/09/2007US7278193 Device for coupling PCB sheet
10/04/2007WO2007111729A2 An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements
10/04/2007WO2007111314A1 Method for manufacturing multilayer printed wiring board and composite film
10/04/2007WO2007111268A1 Process for producing copper wiring polyimide film, and copper wiring polyimide film
10/04/2007WO2007111236A1 Photoelectric wiring board, optical communication device and method for manufacturing optical communication device
10/04/2007WO2007110985A1 Composite substrate and method of manufacturing composite substrate
10/04/2007WO2007110719A2 Improved alkaline solutions for post cmp cleaning processes
10/04/2007WO2007110153A1 Method for transporting printing material, and printing table for a flatbed printing press
10/04/2007WO2007093710A3 Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
10/04/2007WO2007079121A3 Interconnected ic packages with vertical smt pads
10/04/2007US20070232096 Arrangement With a Contract Element
10/04/2007US20070231964 Methods of forming semiconductor assemblies
10/04/2007US20070228566 Ball grid array package construction with raised solder ball pads
10/04/2007US20070228562 Electronic packaging using conductive interproser connector
10/04/2007US20070228547 Integrated Circuit (IC) Carrier Assembly Incorporating An Integrated Circuit (IC) Retainer
10/04/2007US20070228333 Adhesion promotion in printed circuit boards
10/04/2007US20070228207 Anisotropic Conductive Film Carrying Tape and Packaging Method
10/04/2007US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
10/04/2007US20070227761 Heat Conduction From an Embedded Component
10/04/2007US20070227625 Adhesion promotion in printed circuit boards
10/04/2007US20070226998 Multi-layer circuit assembly and process for preparing the same
10/04/2007US20070226997 Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member
10/04/2007US20070226996 Hybrid integrated circuit device and method of manufacturing the same
10/04/2007US20070226972 Common carrier
10/04/2007DE202005021343U1 Trenneinrichtung für flächenhafte Werkstücke, insbesondere zum Vereinzeln von bestückten Leiterplatten Separating device for planar workpieces, especially for separating assembled PCBs
10/04/2007DE19912605B4 Leiterplattenverstärkungsglied und elektronische Baugruppe Circuit board reinforcing member and electronic assembly
10/04/2007DE102007014433A1 Trägerkörper für Bauelemente oder Schaltungen Body for devices and circuits
10/04/2007DE102006015508A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester mit besonderer Eignung für Folien-Hinterspritzverfahren (In-mold-labeling), Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation of thermoplastic polyester film which is particularly suitable for film insert molding process (in-mold labeling), processes for their preparation and their use
10/04/2007DE10144704B4 Verfahren zum Verbinden eines Bauelements mit einem Träger A method for connecting a component with a carrier
10/03/2007EP1841301A2 System and method for making printed electronic circuits
10/03/2007EP1841299A2 Connecting device for electronic components
10/03/2007EP1841298A2 Plated vias exit structure for printed circuit board
10/03/2007EP1841020A2 Pin protection
10/03/2007EP1840952A1 Devices with microjetted polymer standoffs
10/03/2007EP1840914A1 Capacitor layer forming material, process for producing the same, and printed wiring board having built-in capacitor layer obtained using the material
10/03/2007EP1840149A1 Curable resin composition and interlayer insulating film
10/03/2007EP1839833A1 Cushioning material for heat press
10/03/2007EP1839467A1 Anti-static spacer for high temperature curing process of flexible printed circuit board
10/03/2007EP1839466A2 Improved matched-impedance surface-mount technology footprints
10/03/2007EP1838897A2 Method for depositing palladium layers and palladium bath therefor
10/03/2007EP1790044A4 Electrical connector with stepped housing
10/03/2007EP1157821B1 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same
10/03/2007EP0888701B1 Thin film fabrication technique for implantable electrodes
10/03/2007CN200956688Y Circuit board connector pressing machine positioning device
10/03/2007CN200956687Y Circuit board connector pressing machine
10/03/2007CN101049058A Ceramic multilayer substrate and method for manufacturing the same
10/03/2007CN101049057A Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
10/03/2007CN101049056A Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
10/03/2007CN101048866A Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
10/03/2007CN101048282A Method and apparatus for supporting and clamping a substrate
10/03/2007CN101048042A Reflow oven
10/03/2007CN101048041A Method for connecting flexible printed circuit board and flexible circuit component and correlation structure
10/03/2007CN101048040A Method for fabricating a PCB
10/03/2007CN101048038A Electronic unit and electronic apparatus having the same
10/03/2007CN101048037A Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer
10/03/2007CN101048036A Built-in film risitance and its manufacturing method, multi-layer substrate
10/03/2007CN101048035A Adjustable resistance in multi-layer substrate and forming method thereof
10/03/2007CN101048034A Circuitboard interconnection system, connector component, circuit board and circuit board processing method
10/03/2007CN101048031A Printing plate, printing board, and printing method for printed board
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