Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2007
10/17/2007EP1110268B1 Method for vertical connection of conductors in a device in the microwave range
10/17/2007EP1059019A4 Components with releasable leads
10/17/2007EP1009202B1 Soldering member for printed wiring boards
10/17/2007CN200962711Y A circuit board clamp transport claw
10/17/2007CN200962693Y Driving structure of film presser
10/17/2007CN200962692Y Surface processing device for the printed circuit board
10/17/2007CN200962691Y A line board clamping transport claw
10/17/2007CN200962689Y Printed board connection structure
10/17/2007CN101057531A Single or multi-layer printed circuit board with improved via design
10/17/2007CN101057325A Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly
10/17/2007CN101057315A Exposure equipment
10/17/2007CN101057006A Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
10/17/2007CN101056758A Metal-clad laminate and method for production thereof
10/17/2007CN101056504A Printed circuit board using bump and method for manufacturing thereof
10/17/2007CN101056503A Electronic component felting method and device using the same
10/17/2007CN101056502A Electronic device for avoiding excessive glue pollution
10/17/2007CN101056501A Circuit board and manufacturing method thereof
10/17/2007CN101056500A Application of epoxy resin-aluminium nitride composite material preparing high density printed circuit board
10/17/2007CN101056072A Staggered vertical comb drive fabrication method
10/17/2007CN101055966A Fixing member for electric conductors, electric conductor structure component and method for producing such a component
10/17/2007CN101055862A Wiring board, semiconductor device using the same, and method for manufacturing wiring board
10/17/2007CN101055859A Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device
10/17/2007CN101055830A Making method of self-limited boundary film graphics
10/17/2007CN101054707A Improved method for non conductive base material direct metallizing
10/17/2007CN100344212C Improved method for forming conductive traces and printed circuits made thereby
10/17/2007CN100344033C Laser processing device and method for controlling the laser processing device
10/17/2007CN100343966C Welding disk vision identifying and positioning system for flexible laser ball implanting machine
10/17/2007CN100343853C System for generating printed board three-dimensional shape data
10/17/2007CN100343682C Testing device sensor and testing device
10/17/2007CN100343356C Process for improving polymer to metal adhesion
10/17/2007CN100343354C Thermally-formable and cross-linkable precursor of a thermally conductive material
10/17/2007CN100343313C Method of making liquid crystal polymer films
10/17/2007CN100343200C Methods of roughening ceramic surface
10/17/2007CN100343013C 自动化机床 Automation tools
10/17/2007CN100343009C Method and apparatus for supporting a substrate
10/16/2007US7283660 Multi-layer printed circuit board fabrication system and method
10/16/2007US7282932 Compliant contact pin assembly, card system and methods thereof
10/16/2007US7282787 Laminated multiple substrates
10/16/2007US7282649 Printed circuit board
10/16/2007US7282389 Semiconductor device manufacturing method and manufacturing apparatus
10/16/2007US7282257 Resin composition and adhesive film for multi-layered printing wiring board
10/16/2007US7282255 Flexible printed circuit board and process for producing the same
10/16/2007US7282174 Lead-free solder and soldered article
10/16/2007US7281931 Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device
10/16/2007US7281871 Image forming apparatus and image forming method
10/16/2007US7281472 Screen printing apparatus and screen printing method
10/16/2007US7281327 Method for manufacturing double-sided printed circuit board
10/16/2007US7281325 Method of manufacturing circuit board
10/16/2007US7281324 Method of simultaneously fabricating circuit blocks
10/16/2007US7281323 Method for mounting electronic components
10/16/2007US7281322 Component mounting method
10/16/2007US7281321 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
10/11/2007WO2007115061A2 Bidding for on-line survey placement
10/11/2007WO2007114569A1 Pcb coating supporter
10/11/2007WO2007114464A1 Resin composition for forming insulating layer
10/11/2007WO2007114462A1 Resin composition for insulating layer
10/11/2007WO2007114342A1 Method of manufacturing electronic part
10/11/2007WO2007114334A1 Circuit board, method for testing circuit board, and method for manufacturing circuit board
10/11/2007WO2007114123A1 Process for manufacturing circuit board and circuit board obtained by the process
10/11/2007WO2007114111A1 Multilayer wiring board and its manufacturing method
10/11/2007WO2007114014A1 Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board
10/11/2007WO2007113877A1 Apparatus and method to metalize supports for photovoltaic cells
10/11/2007WO2007113182A1 Method for applying solder particles to contact surfaces as well as solder particles suitable for this and components with contact surfaces
10/11/2007WO2007090589A3 Holder for a flexible circuit board
10/11/2007WO2007050333A3 Article comprising conductive conduit channels
10/11/2007US20070237976 Surface Treated Copper Foil, Flexible Copper-Clad Laminate Manufactured Using the Same, and Film Carrier Tape
10/11/2007US20070237890 Bilayer Laminated Film for Bump Formation and Method of Bump Formation
10/11/2007US20070237480 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
10/11/2007US20070235881 Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device
10/11/2007US20070234563 Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
10/11/2007US20070234562 Method and apparatus for forming multi-layered circuits using liquid crystalline polymers
10/11/2007US20070234561 Mounting method of passive component
10/11/2007US20070234560 Method and apparatus for forming multi-layered circuits using liquid crystalline polymers
10/11/2007US20070234538 Plurality of capacitors employing holding layer patterns and method of fabricating the same
10/11/2007DE102004021122B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
10/10/2007EP1843650A2 Multilayered printed circuit board and manufacturing method therefor
10/10/2007EP1843649A2 Multilayered printed circuit board and manufacturing method therefor
10/10/2007EP1843391A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component
10/10/2007EP1842939A1 Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom
10/10/2007EP1842406A2 Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method
10/10/2007EP1842405A1 Apparatus and method for making an antenna for a radiofrequency identifying device
10/10/2007EP1842403A1 Electrical power substrate
10/10/2007EP1842402A2 Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section
10/10/2007EP1841396A1 Assembly, production and quality assurance processes respecting electronic compliance monitor (ecm) tags
10/10/2007EP1584365B1 Transmitter for wireless control
10/10/2007EP1561368B1 Multi-layer circuit assembly and process for preparing the same
10/10/2007EP1334647B1 Integrated circuit carrier
10/10/2007CN200959698Y Supporter
10/10/2007CN200957696Y Track width adjuster of integrating-circuit printer
10/10/2007CN101053288A Method for electric connecting for punching grid
10/10/2007CN101053287A Laminated ceramic component and method for manufacturing the same
10/10/2007CN101053286A Electrochemical method for filling hole with metal, especially with copper filling hole of printed circuit board
10/10/2007CN101053142A Machinery processing main shaft and rotary shaft
10/10/2007CN101052293A Control method for reflux welding curve on surface sticking process production line
10/10/2007CN101052279A Method of manufacturing terminal set of circuit basic plate
10/10/2007CN101052278A Metal wiring method based on mask print
10/10/2007CN101052277A Multiple head line burying machine
10/10/2007CN101052276A Method for manufacturing capacitor embedded in pcb
10/10/2007CN101052275A Method for design back board and back board
10/10/2007CN101052273A PCB plate connection structure and connection method
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