| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/24/2007 | CN200965422Y An air tightness device with the fine adjustable space |
| 10/24/2007 | CN200964439Y Etching device for circuit board |
| 10/24/2007 | CN101061762A Multilayer substrate with built-in capacitor, method for manufacturing same, and cold cathode tube lighting device |
| 10/24/2007 | CN101061761A Substrate processing device, carrying device and processing method |
| 10/24/2007 | CN101061760A Flexible printing circuit board and its production method |
| 10/24/2007 | CN101060757A Technique of forming stubless printed circuit board and its formed printed circuit board |
| 10/24/2007 | CN101060755A Printed circuit board and its making method |
| 10/24/2007 | CN101060208A Anisotropic conductive sheet and method of manufacturing the same |
| 10/24/2007 | CN101060092A Passive component adhesion process method |
| 10/24/2007 | CN101060091A Method and system for providing conductive bonding material |
| 10/24/2007 | CN101060089A Method and system for electric material injecting multiple hollow cavity in non-rectangular mould |
| 10/24/2007 | CN101060067A Method, device and system for electric material injecting surface multiple hollow cavity |
| 10/24/2007 | CN101058344A Method of manufacturing electronic and electric product of plane displaying device and band-shaped package used for the same |
| 10/24/2007 | CN101058343A Method of manufacturing electronic and electric product of plane displaying device and band-shaped package used for the same |
| 10/24/2007 | CN100345467C Method and element for realizing resonance oscillation attenuation with electromagnetic compatible shielding |
| 10/24/2007 | CN100345466C Multilayer substrate including components therein |
| 10/24/2007 | CN100345434C Substrate inspection apparatus |
| 10/24/2007 | CN100345348C 激光加工系统及激光加工方法 Laser processing system and a laser processing method |
| 10/24/2007 | CN100345291C Semiconductor device and electronic device, and methods for manufacturing thereof |
| 10/24/2007 | CN100345279C Component built-in module and method of manufacturing the same |
| 10/24/2007 | CN100345268C 半导体装置 Semiconductor device |
| 10/24/2007 | CN100345095C Transparent touch panel |
| 10/24/2007 | CN100344699C Polyamide acidic composition and polyimide/copper foil laminated material |
| 10/24/2007 | CN100344695C Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 10/24/2007 | CN100344528C Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material |
| 10/24/2007 | CN100344445C Bonding layer for bonding resin on copper surface |
| 10/24/2007 | CN100344444C Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them |
| 10/24/2007 | CN100344383C Dimensionally stable composite article and method of making the same |
| 10/23/2007 | US7286370 Wired circuit board and connection structure of wired circuit board |
| 10/23/2007 | US7286367 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board |
| 10/23/2007 | US7286361 Heatsink |
| 10/23/2007 | US7285917 Connection member and driving device of plasma display panel |
| 10/23/2007 | US7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 10/23/2007 | US7285858 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
| 10/23/2007 | US7285856 Package for semiconductor devices |
| 10/23/2007 | US7285803 Light-emitting diode lamp having a terminal portion with a notch portion |
| 10/23/2007 | US7285734 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 10/23/2007 | US7285730 Ceramic circuit board and method for manufacturing the same |
| 10/23/2007 | US7285728 Electronic parts packaging structure and method of manufacturing the same |
| 10/23/2007 | US7285727 Flexible wiring boards for double-side connection |
| 10/23/2007 | US7285507 Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same |
| 10/23/2007 | US7285494 Multiple stage electroless deposition of a metal layer |
| 10/23/2007 | US7285486 Ball transferring method and apparatus |
| 10/23/2007 | US7285447 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations |
| 10/23/2007 | US7285321 Vaiations in glass transition temperature between layers; electroconductive layer |
| 10/23/2007 | US7285305 Producing the board having an interlayer insulation film between the wiring layers that is deposited using a liquid drop discharge system and an interlayer conducting post for conducting between the wiring patterns the interlayer insulation film |
| 10/23/2007 | US7285229 Etching aqueous solution containing hydrochloric acid, nitric acid and cupric compound; process control |
| 10/23/2007 | US7285175 Adhesive sheet stamping device, adhesive sheet stamping method |
| 10/23/2007 | US7285152 Method of manufacturing chain-structure metal powder |
| 10/23/2007 | US7284991 Flexible scrub ring contact |
| 10/23/2007 | US7284990 PCB and connector design |
| 10/23/2007 | US7284837 Fluid ejection device with micro-electromechanical fluid ejection actuators |
| 10/23/2007 | US7284323 Process of fabricating conductive column |
| 10/23/2007 | US7284322 Process for producing electro-optic hybrid circuit board |
| 10/23/2007 | US7284321 Method for testing a chip with a package and for mounting the package on a board |
| 10/23/2007 | US7284320 Multilayer printed wiring board and method of manufacturing the same |
| 10/23/2007 | US7284317 Method of producing printed circuit board with embedded resistor |
| 10/23/2007 | US7284311 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 10/21/2007 | CA2575004A1 Electric power saving apparatus comprising semi-conductor device to pass energy of infrared ray synthetic wavelength into electric cable using output pulse signal, electric circuit board structure for implementing the apparatus, and electric power saving method |
| 10/18/2007 | WO2007117040A1 Method for manufacturing screen printing mask with resin, and screen printing mask with resin |
| 10/18/2007 | WO2007116990A1 Components joining method and components joining structure |
| 10/18/2007 | WO2007116855A1 Multilayer printed wiring board and method for manufacturing same |
| 10/18/2007 | WO2007116853A1 Jet solder bath |
| 10/18/2007 | WO2007116793A1 Mold release film, mold release cushion material, and process for manufacturing printed board |
| 10/18/2007 | WO2007116666A1 Reflow furnace |
| 10/18/2007 | WO2007116622A1 Multilayer circuit board having cable portion and method for manufacturing same |
| 10/18/2007 | WO2007116451A1 Process for producing solder-joined product, solder joining apparatus, method of discriminating soldering condition, reflow apparatus and method of solder joining |
| 10/18/2007 | WO2007116057A2 Method for applying a metal on a substrate |
| 10/18/2007 | WO2007116056A2 Method for applying a metal on paper |
| 10/18/2007 | WO2007115520A1 Method for production of an electronic assembly |
| 10/18/2007 | WO2007072379A3 An electronic device, a housing part, and a method of manufacturing a housing part |
| 10/18/2007 | WO2007065445A3 Method for encapsulating electrical components, and housing arrangement |
| 10/18/2007 | US20070243665 Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication |
| 10/18/2007 | US20070243664 Flip-Chip Mounting Method and Bump Formation Method |
| 10/18/2007 | US20070243402 Copper Foil with Ultra Thin Adhesive Layer, and a Method for Manufacturing the Copper Foil with Ultra Thin Adhesive Layer |
| 10/18/2007 | US20070242440 Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board |
| 10/18/2007 | US20070241850 Inductor |
| 10/18/2007 | US20070240899 Circuit device |
| 10/18/2007 | US20070240593 Process and Device for Printing a Substrate |
| 10/18/2007 | US20070240305 Probe card and method for producing the same |
| 10/18/2007 | DE112006000101T5 Siebdruckvorrichtung und Siebdruckverfahren Screen printer and screen printing method |
| 10/18/2007 | DE102007008491A1 Leiterplatte mit innenliegender Duchgangsbohrung und Herstellungsverfahren dafür Circuit board with internal Duch hole and manufacturing method thereof |
| 10/18/2007 | DE102006020600A1 Verfahren und Anordnung zur Positionierung von Hochleistungs-LEDs Method and apparatus for positioning of High Power LEDs |
| 10/18/2007 | DE102006019260A1 Contact pin simultaneous operation device, has base plate attached to positioning unit and arranged at contact pin carrier that is movable by laminated spring arrangement, where pin carrier is flexibly connected with another pin carrier |
| 10/18/2007 | DE102006017695A1 Verfahren zur Herstellung von Kohlenstoffnanoröhrchen in einer Wirbelschicht A process for producing carbon nanotubes in a fluidized bed |
| 10/18/2007 | DE102006017630A1 Verfahren zur Herstellung einer Leiterbahnstruktur sowie eine derart hergestellte Leiterbahnstruktur A method of fabricating a wiring structure and a wiring pattern produced in this way |
| 10/18/2007 | DE102006016964A1 Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe sowie Trägerkörper hierfür A process for preparing an electronic assembly and electronic assembly support body therefor |
| 10/18/2007 | DE102006016275A1 Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger sowie zur Durchführung dieses Verfahrens geeignetes Montagesystem Method of placing electrically contactable components on a circuit carrier and for carrying out this method suitable mounting system |
| 10/18/2007 | DE102006016090A1 Solder material producing method for e.g. flip-chip-connection between substrate and semiconductor, involves converting surface of passivation layer into finely nubby or slightly wettable surface by surface treatment |
| 10/18/2007 | DE102005051806B4 Lichtleiteranordnung und Leiterplatte An optical fiber assembly and PCB |
| 10/17/2007 | EP1845766A1 Hold down device |
| 10/17/2007 | EP1845762A1 Multilayer printed wiring board |
| 10/17/2007 | EP1845761A1 Multilayer printed wiring board |
| 10/17/2007 | EP1845759A1 Conductive connecting pin and package substrate |
| 10/17/2007 | EP1845556A1 Electric component mounting apparatus |
| 10/17/2007 | EP1845170A2 Method for manufacturing a conductor path structure and such a conductor path structure |
| 10/17/2007 | EP1844932A2 Method and apparatus for applying a viscous or paste material onto a substrate |
| 10/17/2007 | EP1844638A2 Structure and method for attaching shield case to circuit board, electronic component module and portable telephone |
| 10/17/2007 | EP1844636A2 Method for connecting two printed circuit boards and printed circuit board therefore |
| 10/17/2007 | EP1509992B1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck |