Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2007
10/31/2007CN101065270A 电子装置 Electronic devices
10/31/2007CN101064995A Method and device for removing substrate solder
10/31/2007CN101064993A Circuit apparatus
10/31/2007CN101064992A Printed circuit board and wiring method
10/31/2007CN101064989A Multi-layer flexible circuit board and its producing method
10/31/2007CN101064294A Circuit device and method for manufacturing circuit device
10/31/2007CN101064264A Conductive ball arraying apparatus
10/31/2007CN101064262A Rectilinear motion buffer gear of welded head flexible joint
10/31/2007CN101064078A Dial module, its manufacturing process and meter employing that dial module
10/31/2007CN101063831A Conveying device
10/31/2007CN101062608A Trace forming method, droplet ejection apparatus, and circuit module
10/31/2007CN100346682C Electronics housing with integrated thermal dissipater
10/31/2007CN100346680C Multilayer printed wiring board and method for mfg. same
10/31/2007CN100346679C Circuit board, electronic equipment using the circuit board and method of sorting circuit board
10/31/2007CN100346678C Enhancement of current-carrying capacity of a multilayer circuit board
10/31/2007CN100346676C Printing circuit board and method for producing printing circuit board
10/31/2007CN100346476C Semiconductor device and mixed integrated circuit device
10/31/2007CN100346452C Electronic components and their manufacture
10/31/2007CN100346230C Material for preservative formation
10/31/2007CN100346184C Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method
10/31/2007CN100346007C Device and method for monitoring an electrolytic process
10/31/2007CN100346006C Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated
10/31/2007CN100345679C Lightweight circuit board with conductive constraining cores
10/30/2007US7289337 Electronic card with braced structure
10/30/2007US7289192 Projection exposure device
10/30/2007US7288954 Compliant contact pin test assembly and methods thereof
10/30/2007US7288953 Method for testing using a universal wafer carrier for wafer level die burn-in
10/30/2007US7288950 Contacting component, method of producing the same, and test tool having the contacting component
10/30/2007US7288831 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
10/30/2007US7288739 Method of forming an opening or cavity in a substrate for receiving an electronic component
10/30/2007US7288729 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/30/2007US7288724 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
10/30/2007US7288723 Circuit board including isolated signal transmission channels
10/30/2007US7288722 Packaging structure and packaging method of electronic components
10/30/2007US7288587 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
10/30/2007US7288474 Suspension for filling via holes in silicon and method for making the same
10/30/2007US7288471 Bumping electronic components using transfer substrates
10/30/2007US7288441 Method for two-stage transfer molding device to encapsulate MMC module
10/30/2007US7288437 Conductive pattern producing method and its applications
10/30/2007US7288436 Semiconductor chip package manufacturing method including screen printing process
10/30/2007US7288287 Circuit formation part and manufacturing method for this circuit formation part
10/30/2007US7288178 Electrochemistry extrusion; three-dimensional structure; conformable contact masking
10/30/2007US7287326 Methods of forming a contact pin assembly
10/30/2007US7287324 Method, system, and article of manufacture for implementing metal-fill on an integrated circuit
10/30/2007US7287323 Materials and structure for a high reliability BGA connection between LTCC and PB boards
10/30/2007US7287322 Lithographic contact elements
10/30/2007US7287320 Method for programming a routing layout design through one via layer
10/30/2007US7287312 Method of manufacturing a magnetic head device
10/25/2007WO2007119651A1 Alkaline development-type solder resist, cured product of the same, and print circuit board produced using the same
10/25/2007WO2007119637A1 Flexible circuit board and electrical connection device
10/25/2007WO2007119608A1 Printed circuit board, packaging board, and electronic device
10/25/2007WO2007119571A1 Solder layer, substrate for device junction utilizing the same, and process for manufacturing the substrate
10/25/2007WO2007119513A1 Shield film and shield printed wiring board
10/25/2007WO2007119312A1 Ceramic laminated device and method for manufacturing same
10/25/2007WO2007119291A1 Plate, patterning device employing the plate, and patterning method
10/25/2007WO2007118312A1 Illuminator
10/25/2007WO2007100572A3 System and method of using a compliant lead interposer
10/25/2007WO2007054847A3 Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device
10/25/2007WO2006084064A3 Selective catalytic activation of non-conductive substrates
10/25/2007WO2006056778A8 Recycling printed circuit boards
10/25/2007US20070250055 Medical device having integral traces and formed electrodes
10/25/2007US20070249188 Device for the Shakeproof Accomodation of Electrical Special Components and/or Electrical Circuits
10/25/2007US20070248798 Circuit board manufacturing process, circuit board manufactured by the process, and circuit board manufacturing apparatus
10/25/2007US20070247827 Board-mounting device
10/25/2007US20070247822 Method for the production of a printed circuit structure as well as a printed circuit structure thus produced
10/25/2007US20070246514 Method for Reflow Soldering
10/25/2007US20070246253 Through Substrate, Interposer and Manufacturing Method of Through Substrate
10/25/2007US20070246251 Novel bonding structure for a hard disk drive suspension using anisotropic conductive film
10/25/2007US20070246250 Wiring Board
10/25/2007US20070246249 Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same
10/25/2007US20070246134 Phenylnaphthylimidazole Compound and Usage of the Same
10/25/2007US20070246064 Method of treating a substrate
10/25/2007US20070245555 Method for Manufacturing a Ceramic Electronic Component
10/25/2007US20070245554 Fabrication Method For Electronic System Modules
10/25/2007US20070245553 Fine pitch microfabricated spring contact structure & method
10/25/2007US20070245552 Probe interposers and methods of fabricating probe interposers
10/25/2007US20070245551 Method Of Manufacturing Coreless Substrate
10/25/2007DE20321502U1 RFID-(Radio Frequenz Identification - Hochfrequenzidentifikations)-Tags und -Etiketten RFID (Radio Frequency Identification - radio frequency identification) tags and labels
10/25/2007DE19804337B4 Instrumententafel von reduzierter Tiefe Instrument panel of reduced depth
10/25/2007DE112005003099T5 Träger für elektrische Bauteile mit angelötetem Kühlkörper Support for electrical components with soldered heat sink
10/25/2007DE102006039623B3 Printed circuit board and LED connecting method, involves reproducing light beam by imaging lens, and dividing beam into number of partial light beams such that partial light beams form number of discrete light spots
10/25/2007DE102006017978A1 Solder paste for soldering electronic components to a circuit board comprises an additive which absorbs infrared radiation
10/25/2007DE10151640B4 Basislaminat für flexible gedruckte Schaltungen und Deckfolie hierfür Base laminate for flexible printed circuits and cover sheet for this purpose
10/25/2007CA2649786A1 Electroplating device and method
10/25/2007CA2643810A1 Illuminator
10/24/2007EP1848257A1 Multilayer printed wiring board
10/24/2007EP1848256A1 Lead wire connection method for touch panel
10/24/2007EP1848255A1 Anisotropic conductive sheet and method of manufactoring the same
10/24/2007EP1848029A1 Carrying structure of electronic components
10/24/2007EP1847162A2 Method and machine for manufacturing electrical circuits
10/24/2007EP1576203A4 Reduction of surface oxidation during electroplating
10/24/2007EP1523229B1 Semiconductor exercising apparatus, test socket apparatus and method of making thereof
10/24/2007EP1504636B1 Cooled power switching device
10/24/2007EP1446992B1 Method of forming a mask on a surface
10/24/2007EP0893945B1 Printed board and manufacturing method therefor
10/24/2007EP0805722B1 Roughening of metal surfaces
10/24/2007EP0795200B1 Mounting electronic components to a circuit board
10/24/2007CN200966205Y Array type placement head for high speed full-automatic placement machine
10/24/2007CN200966189Y A surface attached jumper
10/24/2007CN200966187Y A base plate with high adherence force
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