| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/07/2007 | EP1852910A1 Mounting substrate and manufacturing method thereof |
| 11/07/2007 | EP1852525A1 Palladium plating solution |
| 11/07/2007 | EP1852209A2 Laser machining apparatus and method for manufacturing a multilayered printed wiring board |
| 11/07/2007 | EP1852208A2 Laser machining apparatus and method for manufacturing a multilayered printed wiring board |
| 11/07/2007 | EP1852004A2 Recycling printed circuit boards |
| 11/07/2007 | EP1852003A1 Method for forming electrically conductive patterns on an insulating substrate, and resulting device |
| 11/07/2007 | EP1852002A1 Method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and resulting device |
| 11/07/2007 | EP1851778A2 Method of making multilayered construction for use in resistors and capacitors |
| 11/07/2007 | EP1850997A1 Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder ; a wave soldering machine with such nozzle ; a method of improving the flow of solder out of a wave solder nozzle |
| 11/07/2007 | EP1741322B1 Method for the production of circuit boards and/or corresponding constructs |
| 11/07/2007 | EP1704761B1 Method for gluing a circuit component to a circuit board |
| 11/07/2007 | EP1652232B1 Multichip circuit module and method for the production thereof |
| 11/07/2007 | EP1440606B1 Laminated model for a multilayer printed circuit wafer blank |
| 11/07/2007 | EP1101228A4 Polymer thick-film resistor printed on planar circuit board surface |
| 11/07/2007 | CN200973204Y Dry film press |
| 11/07/2007 | CN200973202Y 电子元件 Electronic component |
| 11/07/2007 | CN101069459A Multilayer printed wiring board and process for producing the same |
| 11/07/2007 | CN101069458A Multilayer printed wiring board |
| 11/07/2007 | CN101069457A Multilayer printed wiring board |
| 11/07/2007 | CN101069456A Mounting structure for electronic component |
| 11/07/2007 | CN101069276A Ceramic aggregate substrate, ceramic substrate and ceramic aggregate substrate fabrication method |
| 11/07/2007 | CN101068462A Heating device assembling system, device and communication equipment |
| 11/07/2007 | CN101068014A Method for forming metal wiring, method for manufacturing active matrix substrate, and appratus |
| 11/07/2007 | CN101067212A Electrolytic copper foil surface low-coarsing processing method |
| 11/07/2007 | CN100348079C Controlled depth etched dielectric film |
| 11/07/2007 | CN100347853C Lead frame and its manufacturing method and semiconductor device |
| 11/07/2007 | CN100347839C Equipment for arranging and distributing welding flux column according to array |
| 11/07/2007 | CN100347837C Semiconductor substrate structure and process method thereof |
| 11/07/2007 | CN100347794C Flexible flat cable and method of manufacturing the same |
| 11/07/2007 | CN100347339C Non-electrolysis gold plating solution |
| 11/07/2007 | CN100347338C Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 11/07/2007 | CN100347134C Process for the manufacture of metal-ceramic compound material in particular metal-ceramic substrates and metal-ceramic compound material especially metal-ceramic substrate manufactured according to t |
| 11/07/2007 | CN100346912C 钻头 Drill |
| 11/06/2007 | US7292308 System and method for patterning a flexible substrate in a lithography tool |
| 11/06/2007 | US7291912 Circuit board |
| 11/06/2007 | US7291901 Packaging method, packaging structure and package substrate for electronic parts |
| 11/06/2007 | US7291795 Flexible printed circuits with many tiny holes |
| 11/06/2007 | US7291791 Resin substrate |
| 11/06/2007 | US7291790 Apertures for signal shaping using ground and signal PTH back-drilling |
| 11/06/2007 | US7291549 Method and structure to reduce risk of gold embrittlement in solder joints |
| 11/06/2007 | US7291444 Photosensitive ceramic composite and method for manufacturing multilayer substrate including the composite |
| 11/06/2007 | US7291427 Exposing a substrate bonded to a polymer via a grafted chain that includes a substrate-bonding group and and also a phototcleavable group to cleave the group in exposed areas and removing the graft chain from those areas; a conductor may then be adhered to the areas having the graft polymer chains |
| 11/06/2007 | US7291393 Insulating particles are chemically bonded to a metal particle having an electrically conductive urface via a bonding functional group so that a single coating layer is formed; superior connection reliability |
| 11/06/2007 | US7291385 Conductive film and method for preparing the same |
| 11/06/2007 | US7291372 Attached to the surface of a flexible printed circuit board, suppresses contamination of the surface of a printed circuit board with solvents and foreign substances and formation of flaws on the surface, leaves little adhesive residue on the adherend after being peeled off and suppresses curling |
| 11/06/2007 | US7291283 Combined wet etching method for stacked films and wet etching system used for same |
| 11/06/2007 | US7291200 Passing liquid solder metal through a porous glass membrane so as to disperse the resulting liquid metal particles in a continuous liquid phase |
| 11/06/2007 | US7290911 Vehicular lamp |
| 11/06/2007 | US7290580 Reinforcement combining apparatus and method of combining reinforcement |
| 11/06/2007 | US7290516 Electrical connection device for injection devices of internal combustion engines |
| 11/06/2007 | US7290333 Manufacturing method of a multilayer printed wiring board |
| 11/06/2007 | US7290331 Component mounting apparatus and component mounting method |
| 11/06/2007 | US7290330 Coupling invertible and pluggable module to a circuit board |
| 11/06/2007 | CA2296520C N-propyl bromide based cleaning solvent and ionic residue removal process |
| 11/01/2007 | WO2007124118A1 Processes for producing articles containing titanium dioxide possessing low sinterability |
| 11/01/2007 | WO2007123384A1 Tool for dry cleaning misprinted electronic cards |
| 11/01/2007 | WO2007123237A1 Jet solder tank |
| 11/01/2007 | WO2007123199A1 Pressing head and pressing device |
| 11/01/2007 | WO2007123195A1 Jig for transferring solder bump and method for forming solder bump |
| 11/01/2007 | WO2007123190A1 Method for mounting solder ball and apparatus for mounting solder ball |
| 11/01/2007 | WO2007123062A1 Photosensitive element, method for formation of resist pattern, and method for production of print circuit board |
| 11/01/2007 | WO2007123022A1 Method for forming metal pattern, metal pattern and printed wiring board |
| 11/01/2007 | WO2007123003A1 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| 11/01/2007 | WO2007122868A1 Method for forming bump and device for forming bump |
| 11/01/2007 | WO2007122708A1 Mold release sheet for hot pressing and method for manufacturing flexible printed wiring board using the same |
| 11/01/2007 | WO2007104700A3 A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby |
| 11/01/2007 | WO2007098290A3 Approach for fabricating probe elements for probe card assemblies using a reusable substrate |
| 11/01/2007 | WO2007055669A3 Recyclable etching solution |
| 11/01/2007 | WO2006089255A3 High aspect ratio plated through holes in a printed circuit board |
| 11/01/2007 | US20070255002 Non-Covalent Bonding Agent for Carbon Nanotube Reinforced Polymer Composites |
| 11/01/2007 | US20070254110 Fabrication of metallic microstructures via exposure of photosensitive composition |
| 11/01/2007 | US20070252264 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 11/01/2007 | US20070251088 Substrate processing method and apparatus |
| 11/01/2007 | US20070251087 Shaped lead assembly for optoelectronic devices |
| 10/31/2007 | EP1850648A1 Multilayer printed wiring board for semiconductor device and process for producing the same |
| 10/31/2007 | EP1850647A1 Multilayer printed wiring board |
| 10/31/2007 | EP1850646A1 Jet solder bath |
| 10/31/2007 | EP1850645A1 Module structure |
| 10/31/2007 | EP1850644A1 Surface mount electric part |
| 10/31/2007 | EP1850384A2 Impedance matched photodetector module |
| 10/31/2007 | EP1849548A1 Baffle device, hot air blower for solder treatment, and nozzle for the same |
| 10/31/2007 | EP1849338A1 Adhesive strip conductor on an insulating layer |
| 10/31/2007 | EP1848578A2 Method and apparatus for sealing flex circuits having heat sensitive circuit elements |
| 10/31/2007 | EP1665914B1 Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace |
| 10/31/2007 | EP1527379B1 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
| 10/31/2007 | EP1310525B1 Copper foil with resin and printed wiring boards made by using the same |
| 10/31/2007 | EP1082882B1 Method of manufacturing resistors |
| 10/31/2007 | DE19819054B4 Verfahren und Vorrichtung zur Montage und Justierung von Bauteilen auf einer Befestigungsunterlage Method and device for mounting and adjustment of components on a mounting pad |
| 10/31/2007 | DE102006018354A1 Nutzen mit mehreren Leiterplatten, Verfahren zum Herstellen eines Nutzen und Verfahren zum Trennen von Leiterplatten aus einem Nutzen Use with a plurality of printed circuit boards, processes for producing a utility and method for separating printed circuit boards from a utility |
| 10/31/2007 | DE102006018275A1 Electronic device e.g. camera module, for use in a motor vehicle electronics, has padding layer adapted to thermal expansions of electronic component and printed circuit board with respect to layer`s thermal expansion-coefficient |
| 10/31/2007 | DE102005024133B4 Elastomerisches Verbindungsstück Elastomeric connector |
| 10/31/2007 | DE10052960C5 Bleifreie Nickellegierung Lead-free nickel alloy |
| 10/31/2007 | CN200967133Y Electronic component shaping apparatus |
| 10/31/2007 | CN101066005A Multilayer wiring board and method for manufacturing same |
| 10/31/2007 | CN101066004A Method for producing substrate having through hole filled with conductive material |
| 10/31/2007 | CN101066003A Printed board and designing method therefor and ic package terminal designing method and connecting method therefor |
| 10/31/2007 | CN101066002A Soldering a flexible circuit |
| 10/31/2007 | CN101066001A Wiring board, method for manufacturing same and semiconductor device |
| 10/31/2007 | CN101065843A Method for manufacturing an electronics module |
| 10/31/2007 | CN101065520A Membrane-limited selective electroplating of a conductive surface |