| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/15/2007 | US20070261239 Electroformed integral charge plate and orifice plate for continuous ink jet printers |
| 11/15/2007 | US20070261235 Electronic device removal tool and carrier |
| 11/15/2007 | US20070261234 Method of manufacturing build-up printed circuit board |
| 11/15/2007 | US20070261232 Method for trimming resistors |
| 11/15/2007 | DE112005003280T5 Verglasung Glazing |
| 11/15/2007 | DE102007021064A1 Platine mit eingebetteten Bauteilen und Verfahren zur Erkennung einer fehlerhaften Verdrahtung Board with embedded components and method for detecting faulty wiring |
| 11/15/2007 | DE102006022748A1 Halbleiterbauteil mit oberflächenmontierbaren Bauelementen und Verfahren zu seiner Herstellung A semiconductor device comprising surface mount components and process for its preparation |
| 11/15/2007 | DE102006022443A1 Verfahren zur Herstellung einer Trägerplatte für eine Schaltungsanordnung, Trägerplatte, hergestellt nach einem derartigen Verfahren sowie Schaltungsanordnung mit einer derartigen Trägerplatte A process for producing a carrier plate for a circuit arrangement, the support plate, produced by such a method and such a circuit arrangement with a carrier plate |
| 11/15/2007 | DE102006022290A1 Heizer mit integriertem Temperatursensor auf Träger Heater with integrated temperature sensor carrier |
| 11/15/2007 | DE102006019895A1 Power measuring device for use as battery sensor for measuring e.g. battery power, of vehicle, has connecting unit for connecting contact unit with connector of board, where press fit is provided between connecting unit and hole |
| 11/15/2007 | DE102004052909B4 Gedruckte Leiterplatte mit einem Sensor für ein schwaches Magnetfeld und Verfahren zur Herstellung Printed circuit board having a sensor for weak magnetic field and methods for preparing |
| 11/15/2007 | DE10064969B4 Filtervorrichtung für mindestens eine von außen an ein Gehäuse anzuschließende elektrische Leitung Filter device for at least one to be connected externally to a housing electric line |
| 11/14/2007 | EP1855517A1 Soldering structure of through hole |
| 11/14/2007 | EP1855516A1 Ceramic multilayer board and method for manufacturing same |
| 11/14/2007 | EP1855515A1 Printed board and method for manufacturing same |
| 11/14/2007 | EP1855514A1 Production of antenna devices |
| 11/14/2007 | EP1855512A1 Assembly of a circuit board and a contact support which is held in a fixed spacing thereto |
| 11/14/2007 | EP1855511A1 A process for preparing a heatsink system and heatsink system obtainable by said process |
| 11/14/2007 | EP1855510A1 Flexible layer system |
| 11/14/2007 | EP1854132A2 A method for pattern metalization of substrates |
| 11/14/2007 | EP1853752A1 Device and method for the etching of substrates |
| 11/14/2007 | EP1853657A2 Preparation of metallic particles for electrokinetic or electrostatic deposition |
| 11/14/2007 | EP1749334B1 Flexible scrub ring contact |
| 11/14/2007 | EP1439952A4 Copper foil with low profile bond enhancement |
| 11/14/2007 | EP1396050A4 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 11/14/2007 | EP1185153B1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 11/14/2007 | EP1090401B1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 11/14/2007 | EP0853342B1 Connecting structure between wiring board and plug member |
| 11/14/2007 | CN200976730Y Heat pressing clamp |
| 11/14/2007 | CN200976712Y Tin-falling screen board |
| 11/14/2007 | CN200976635Y L-type single lens image collecting device for full-automatic tin paste printer |
| 11/14/2007 | CN200976391Y Vehicle rear window glass printed antenna |
| 11/14/2007 | CN200974135Y Improved pressure angle stand for printed circuit board drilling machine |
| 11/14/2007 | CN101073297A Electronic component production method and electronic component production equipment |
| 11/14/2007 | CN101073296A Interposer bonding device |
| 11/14/2007 | CN101073295A Printed circuit board production method and equipment |
| 11/14/2007 | CN101073037A Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 11/14/2007 | CN101072886A Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 11/14/2007 | CN101072474A Method of manufacturing build-up printed circuit board |
| 11/14/2007 | CN101072473A Moisture-proof circuit board processing method and product |
| 11/14/2007 | CN101072472A Method of manufacturing printed circuit board for fine circuit formation |
| 11/14/2007 | CN101072471A Glass circuit board and its manufacturing method |
| 11/14/2007 | CN101072470A Glass circuit board and its manufacturing method |
| 11/14/2007 | CN101072467A Component-embedded board device and faulty wiring detecting method for the same |
| 11/14/2007 | CN101072466A Soldering structure of through hole |
| 11/14/2007 | CN101071783A Component mounting apparatus and component mounting method |
| 11/14/2007 | CN101071156A Multi-connecting board bad-product detecting device and method |
| 11/14/2007 | CN101069938A Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
| 11/14/2007 | CN100349499C Drive device of wiring board manufacturing machine |
| 11/14/2007 | CN100349348C Offset pathway arrangements for energy conditioning |
| 11/14/2007 | CN100348401C Forming part, injection moulding method and device |
| 11/13/2007 | US7296299 Tamper-evident and/or tamper-resistant electronic components |
| 11/13/2007 | US7295885 Multi-exposure drawing method and apparatus thereof for dividing an exposing area into exposed zones and un-exposed zones based on odd-numbered and even-numbered vector-graphic data |
| 11/13/2007 | US7295196 Liquid crystal display panel with signal transmission patterns |
| 11/13/2007 | US7295083 Structure for electromagnetically shielding a substrate |
| 11/13/2007 | US7294929 Solder ball pad structure |
| 11/13/2007 | US7294928 Components, methods and assemblies for stacked packages |
| 11/13/2007 | US7294909 Electronic package repair process |
| 11/13/2007 | US7294904 Integrated circuit package with improved return loss |
| 11/13/2007 | US7294532 Method for manufacturing semiconductor device |
| 11/13/2007 | US7294451 Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board |
| 11/13/2007 | US7294393 Sheet material and wiring board |
| 11/13/2007 | US7294358 forming a patterned adhesive layer corresponds to the pattern of the patterned screen or mask on the substrate, depositing a plurality of conductive particles on the patterned adhesive layer, applying an insulating matrix layer on the conductive particles |
| 11/13/2007 | US7294289 Conductive powder and method for preparing the same |
| 11/13/2007 | US7293999 Housing of circuit boards |
| 11/13/2007 | US7293997 Transceiver mounting adapters |
| 11/13/2007 | US7293692 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 11/13/2007 | US7293691 Electronic substrate printing |
| 11/13/2007 | US7293567 Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's |
| 11/13/2007 | US7293354 Apparatus for mounting columns for grid array electronic packages |
| 11/13/2007 | US7293353 Method of fabricating rigid flexible printed circuit board |
| 11/13/2007 | CA2317931C Interconnection unit for electronic components |
| 11/13/2007 | CA2280115C Low temperature method and compositions for producing electrical conductors |
| 11/08/2007 | WO2007127202A1 Molded sip package with reinforced solder columns |
| 11/08/2007 | WO2007126130A1 Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 11/08/2007 | WO2007126090A1 Circuit board, electronic device and method for manufacturing circuit board |
| 11/08/2007 | WO2007125993A1 Electroconductive particle placement sheet and anisotropic elctroconductive film |
| 11/08/2007 | WO2007125922A1 Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 11/08/2007 | WO2007125921A1 Photosensitive resin composition and photosensitive film |
| 11/08/2007 | WO2007125830A1 Adhesive tape |
| 11/08/2007 | WO2007125806A1 Thermosetting resin composition and use thereof |
| 11/08/2007 | WO2007125799A1 Laser processing method and laser processing apparatus |
| 11/08/2007 | WO2007125791A1 Method for producing wiring board |
| 11/08/2007 | WO2007125722A1 Print inspection method, print inspection device and printer |
| 11/08/2007 | WO2007102597B1 Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate |
| 11/08/2007 | US20070259481 Process for fabricating chip package structure |
| 11/08/2007 | US20070258225 Printed circuit board and method of manufacturing printed ciruit board |
| 11/08/2007 | US20070258223 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 11/08/2007 | US20070258222 Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium |
| 11/08/2007 | US20070257360 Apparatus and method for precise alignment of packaging caps on a substrate |
| 11/08/2007 | US20070257090 Method and device for applying a solder to a substrate |
| 11/08/2007 | US20070256298 Boring device for boring via holes for connecting contact regions of multilayer printed circuit boards |
| 11/08/2007 | US20070256297 Method of manufacturing printed wiring board with component mounting pin |
| 11/08/2007 | US20070256291 Electronic devices with small functional elements supported on a carrier |
| 11/08/2007 | DE112004000048B4 Laserbearbeitungsvorrichtung Laser processing apparatus |
| 11/08/2007 | DE102006021335A1 Printed circuit board for measuring device of industrial measuring technique and automation, has pre-shaped filler inserted in contact surfaces, where filler forms non-conducting bridging of contact surfaces in reflow-soldering furnace |
| 11/08/2007 | DE102006018731A1 Multilayer printed circuit board manufacturing method, involves applying conductive strips on substrate, and applying powder mixture on surface of substrate by electrostatic loading, where mixture has large portion of copper powder |
| 11/08/2007 | DE10156263B4 Schaltungsanordnung in einem Gehäuse und Verfahren zur Herstellung einer in einem Gehäuse angeordneten Schaltungsanordnung A circuit arrangement in a housing, and method for manufacturing a housing arranged in a circuit arrangement |
| 11/08/2007 | CA2648900A1 An electronic inlay module for electronic cards and tags |
| 11/07/2007 | EP1853096A2 Metal carrier for leds in lamp assembly |