Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2007
11/22/2007US20070268677 System and method for processor power delivery and thermal management
11/22/2007US20070268675 Electronic device substrate, electronic device and methods for fabricating the same
11/22/2007US20070268087 High speed, controlled impedance air dielectric electronic backplane systems
11/22/2007US20070267298 Selective catalytic activation of non-conductive substrates
11/22/2007US20070267217 Method for manufacturing a miniaturized three-dimensional electric component
11/22/2007US20070267138 Methods for Fabricating Three-Dimensional All Organic Interconnect Structures
11/22/2007US20070267136 Method for Manufacturing an Electronics Module
11/22/2007US20070266886 Printed wiring board and its manufacturing method
11/22/2007US20070266559 Method for forming stacked via-holes in a multilayer printed circuit board
11/22/2007US20070266558 Electronic Component and Method of Producing the Same
11/22/2007US20070266557 Method and apparatus for automatically detecting and correcting misalignment of a semiconductor chip
11/22/2007US20070266556 Mounter Device, Part Cartridge for the Device, and Method of Holding and Carrying Substrate
11/22/2007US20070266555 Apparatus for making circuitized substrates in a continuous manner
11/22/2007US20070266550 Magnetic recording head with overlaid leads
11/22/2007US20070266548 Method of manufacturing an acoustic mirror
11/22/2007DE19523364B4 Leiterplatte Circuit board
11/22/2007DE10358147C5 Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen Method and apparatus for treating a level well in continuous flow systems
11/22/2007DE102007008508A1 Verfahren zur Herstellung einer geschichteten gedruckten Leiterplatte A method of manufacturing a layered printed circuit board
11/22/2007DE102006021560A1 Flat strip conductor for use in automobile, has conductor wires with insulation, and electrical circuit fastened to base via hot stamping, where insulation is injection molded with base, and circuit is impressed on base
11/22/2007DE102004043478B4 Abschirmgehäuse Shield
11/22/2007DE102004007701B4 Elektrischer Isolator mit Oberflächenbeschichtung An electrical insulator with surface coating
11/22/2007DE10116797B4 Elektrischer Verbinder The electrical connector
11/22/2007DE10111033B4 Siebdruckverfahren Screen printing
11/21/2007EP1858308A1 Multilayer printed wiring board
11/21/2007EP1858307A1 Multilayer printed wiring board
11/21/2007EP1856723A2 Simultaneous and selective partitioning of via structures using plating resist
11/21/2007EP1856309A2 Selective catalytic activation of non-conductive substrates
11/21/2007EP1856167A1 Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
11/21/2007EP1749425B1 Transport device
11/21/2007CN200980229Y A stencil printing device for FPC patch
11/21/2007CN200980206Y A substrate for wave soldering parameter acquisition unit
11/21/2007CN200980205Y A leakage reduction device for processing slot in circuit board
11/21/2007CN200977744Y Feeding positioning and printing device for electric material base plate
11/21/2007CN200977585Y Double spike solder tin furnace
11/21/2007CN200977499Y Surface processing device for printing circuit board
11/21/2007CN101076883A Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
11/21/2007CN101076572A Conductive silver dispersions and uses thereof
11/21/2007CN101076452A Printing mask and solar cell, and flat panel display and chip capacitor
11/21/2007CN101076446A Compound metallic substrate casting and solder composition and method
11/21/2007CN101076229A Method for producing printing-circuit board conducting hole
11/21/2007CN101076228A Wave guide tube printed circuit board structure for printing
11/21/2007CN101076227A Method for crimping soft-hard combined circuit board by thermal solid gel
11/21/2007CN101076226A Method for flexible circuit board lining protective membrane and skin material
11/21/2007CN101076225A Printed circuit board assembly and method of producing the same
11/21/2007CN101076224A Aluminum-base printing circuit board and its production
11/21/2007CN101076223A Metal circuit board of aluminum baseplate magnetic-controlled sputtering-jetted and LED illuminating device
11/21/2007CN101075813A High-speed signal transmission-line structure of connected-pole parallel series
11/21/2007CN101075698A Antenna structure and method of manufacturing antenna
11/21/2007CN101075090A Dry film corrosion resisting agent
11/21/2007CN101074484A Method for surface treating calender copper foil of printing circuit board
11/21/2007CN101073841A Tool bits having plasma deposited metal carbide coatings
11/21/2007CN100350823C Vibrator holder
11/21/2007CN100350822C Vibrator holder
11/21/2007CN100350821C Signal transmission device with hole and tin ball
11/21/2007CN100350820C Process for thick film circuit patterning
11/21/2007CN100350677C 连接装置 Connecting device
11/21/2007CN100350606C Voltage variable material for direct application and devices employing same
11/21/2007CN100350603C Encapsulation of pin solder for maintaining accuracy in pin position
11/21/2007CN100350556C Processing apparatus
11/21/2007CN100350542C Connection structure and method of plasma display panel
11/21/2007CN100350517C 层压体及其用途 Laminate and its use
11/21/2007CN100350078C Method for copperizing continuously
11/21/2007CN100349966C Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/21/2007CN100349723C System and method for bending a substantially rigid substrate
11/20/2007US7298887 System for and method of analyzing surface condition of PCB using RGB colors
11/20/2007US7298042 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/20/2007US7298039 Electronic circuit device
11/20/2007US7297878 High frequency laminated component and its manufacturing method
11/20/2007US7297877 Substrate with micro-via structures by laser technique
11/20/2007US7297876 Circuit board and method of manufacturing the same
11/20/2007US7297875 Fusion bonded assembly with attached leads
11/20/2007US7297757 A mixture for activating the surface of a first resin to enhance a close contact of the surface with a surface of a metal or a second resin containing a trivalent or tetravalent cerium compound; increased adhesive strength between, e.g., a polyimide based resin film with metal wires or another resin
11/20/2007US7297627 Multilayer substrate
11/20/2007US7297572 Fabrication method for electronic system modules
11/20/2007US7297563 Method of making contact pin card system
11/20/2007US7297562 Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
11/20/2007US7297007 Conductive terminal and the electrical connector using the conductive terminal
11/20/2007US7296754 IC card module
11/20/2007US7296727 Apparatus and method for mounting electronic components
11/20/2007US7296346 Plating buss and a method of use thereof
11/20/2007US7296345 Method for manufacturing a memory device
11/20/2007US7296340 Apparatus of recycling printed circuit board
11/20/2007CA2388520C Solder ball terminal
11/20/2007CA2192326C Lottery ticket verification system
11/15/2007WO2007129966A1 Production of antenna devices
11/15/2007WO2007129711A1 Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
11/15/2007WO2007129589A1 Photosensitive resin composition
11/15/2007WO2007129545A1 Circuit wiring board incorporating heat resistant substrate
11/15/2007WO2007129526A1 Inductor and electric power source using same
11/15/2007WO2007129073A1 Tool holder spindles
11/15/2007WO2007128981A1 Screen printing head, system and method
11/15/2007WO2007128592A1 Conductor track carrier
11/15/2007WO2007084888A3 Method of dispensing small amounts of liquid material
11/15/2007WO2006112474A3 Fiber-resin composite material, multilayer body, printed wiring board, amd method for manufacturing printed wiring board
11/15/2007US20070264813 Process for producing a film carrier tape for mounting an electronic part
11/15/2007US20070264160 Detection difficulties associates with non-uniformities present on the card surface are overcome using a detection system incorporating a compliantly mounted microscopic head
11/15/2007US20070263157 Planar display module
11/15/2007US20070263031 Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus
11/15/2007US20070262467 Semiconductor Device Having a Chip Stack on a Rewiring Plate
11/15/2007US20070261595 Active Filler particles in Inks
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