Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2007
11/29/2007US20070273820 Liquid crystal display module
11/29/2007US20070273605 Method for forming radio frequency antenna
11/29/2007US20070272761 Method for making smart cards capable of operating with and without contact
11/29/2007US20070272516 Transport device
11/29/2007US20070272433 Electrical assembly
11/29/2007US20070271783 Multilayer core board and manufacturing method thereof
11/29/2007US20070271781 High density integrated circuit apparatus, test probe and methods of use thereof
11/29/2007US20070271780 Method for producing a proximity switch and a proximity switch produced according to the method
11/29/2007US20070271779 Method for covering a plurality of apertures while accommodating passage of devices
11/29/2007US20070271778 Assembly with detachably attachable devices
11/29/2007DE4434846B4 Keramisches Formteil mit einem Prägemuster, Verfahren zu dessen Herstellung sowie seine Verwendung Ceramic molding with an embossing pattern, to processes for its preparation and its use
11/29/2007DE19980532B4 Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat One point connected to an electronic card with printed circuit on a supporting this card metallic substrate
11/29/2007DE10353676B4 Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten A process for producing an ultra-thin module with rough contacts
11/29/2007DE102006024247A1 Drahtlose Kartentyp-Vorrichtung, Antennenspule und Verfahren zum Herstellen eines Kommunikationsmoduls Card type wireless device, antenna coil and method of manufacturing a communication module
11/29/2007DE102006024213A1 Verfahren zum Herstellen eines Bausteins mit einer elektrischen Kontaktierung A method for producing a block with an electrical contact
11/29/2007DE102004018483B4 Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung und Verwendung einer Vorrichtung zum Aufbringen von Beschichtungen auf bandförmigen Strukturen A method for applying coatings to the band-shaped structures in the semiconductor devices fabrication and use of an apparatus for applying coatings on strip-shaped structures
11/29/2007DE10066293B4 Induktiver Sensor Inductive sensor
11/29/2007CA2652480A1 Product having through-hole and laser processing method
11/28/2007EP1860740A1 Electronic component with contact elements
11/28/2007EP1860691A1 Electronic circuit and method for manufacturing same
11/28/2007EP1860170A1 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
11/28/2007EP1859886A1 Jet solder vessel
11/28/2007EP1859662A1 Multilayer wiring structure and method of manufacturing the same
11/28/2007EP1859661A1 Rigid/flexible printed circuit board
11/28/2007EP1859490A1 Composite films suitable for use in opto-electronic and electronic devices
11/28/2007EP1547158B1 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
11/28/2007EP1481575A4 Digital application of protective soldermask to printed circuit boards
11/28/2007EP1342294B1 I-channel surface-mount connector
11/28/2007EP0922300B1 Process for producing semiconductor device provided with low melting point metal bumps
11/28/2007CN200983722Y An adjustable PCB carrying tool
11/28/2007CN200983721Y Carrying tool for SMD making process
11/28/2007CN200981259Y Plate dividing machine
11/28/2007CN200981146Y Ultrasonic bonding machine with laser heating device
11/28/2007CN200981144Y Modified structure for lead-free soldering tin furnace
11/28/2007CN200981036Y Leakage-proof adhesive device for adhesive sealing machine
11/28/2007CN101080962A Thermal attach and detach methods and systems for surface-mounted components
11/28/2007CN101080960A Process for producing laminated ceramic substrate
11/28/2007CN101080959A Method for creating circuit assemblies
11/28/2007CN101080958A Component-containing module and method for producing the same
11/28/2007CN101080956A Printed wiring board
11/28/2007CN101080800A Semiconductor package having non-ceramic based window frame
11/28/2007CN101080164A Board joint method of dual-side printed circuit board
11/28/2007CN101080162A Electromagnetic shielding soft base material
11/28/2007CN101080146A A method for making L2 blind hole of high-density interconnection circuit board
11/28/2007CN101080145A Control device of circuit board hole blower knife and its control method
11/28/2007CN101080144A A method for making elastic circuit with the non-weaving cloth as base
11/28/2007CN101080143A Method for removing peripheral metal residues of base board
11/28/2007CN101080142A Method for welding electronic part on base board
11/28/2007CN101080139A Etched capacitor laminate for reducing electrical noise
11/28/2007CN101080138A Printed wiring board, method for forming the printed wiring board, and board interconnection structure
11/28/2007CN101080137A Multilayer printed circuit board and liquid crystal display unit
11/28/2007CN101080136A Printed circuit board and manufacturing method thereof
11/28/2007CN101079439A Wiring board, electronic device, electrooptical device, and electronic apparatus
11/28/2007CN101079407A Wiring board, method for manufacturing the same, and semiconductor device
11/28/2007CN101078886A Image recording method and image recording apparatus
11/28/2007CN100352319C Circuit board with pin made of resin
11/28/2007CN100352318C Wiring board and magnetic disk apparatus
11/28/2007CN100352317C Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment
11/28/2007CN100352071C Light-emitting diode lamp
11/28/2007CN100352056C Optical device and production method thereof
11/28/2007CN100352047C Unmolded package for semiconductor device
11/28/2007CN100352027C Method for manufacturing an electronic circuit device and electronic circuit device
11/28/2007CN100352025C Joining apparatus
11/28/2007CN100352024C Bonding device and method
11/28/2007CN100351863C Method for making a microcircuit card
11/28/2007CN100351719C Quasi-CW diode-pumped, solid-state UV laser system and method employing same
11/28/2007CN100351702C UV curable powder suitable for use as a photoresist
11/28/2007CN100351688C Liquid crystal display
11/28/2007CN100351203C Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition
11/28/2007CN100351088C Drawing method, drawing apparatus and display apparatus
11/27/2007US7301781 Semiconductor module
11/27/2007US7301228 Semiconductor device, method for manufacturing same and thin plate interconnect line member
11/27/2007US7301226 Conductor substrate, semiconductor device and production method thereof
11/27/2007US7301108 Multi-layered interconnect structure using liquid crystalline polymer dielectric
11/27/2007US7300865 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
11/27/2007US7300820 Adhesive assembly for a circuit board
11/27/2007US7300819 Semiconductor device, method for mounting the same, and method for repairing the same
11/27/2007US7299965 Method and apparatus for mounting and removing an electronic component
11/27/2007US7299964 Method and apparatus to create electrical junctions for information routing in textile structures
11/27/2007US7299547 Method for manufacturing tape wiring board
11/27/2007US7299546 Method for manufacturing an electronic module
11/27/2007US7299528 Method for forming a multi-frequency surface acoustic wave device
11/22/2007WO2007133074A1 A process for preparing a heatsink system and heatsink system obtainable by said process
11/22/2007WO2007132739A1 Substrate inspecting jig, and electrode structure of connecting electrode unit in the jig
11/22/2007WO2007132722A1 Electronic component and method for manufacturing the same
11/22/2007WO2007132700A1 Pattern forming method
11/22/2007WO2007132643A1 Tape adhering apparatus
11/22/2007WO2007132612A1 Composite substrate and method for manufacturing same
11/22/2007WO2007132599A1 Multilayer module with case
11/22/2007WO2007132533A1 Method for resist pattern formation, process for producing circuit board, and circuit board
11/22/2007WO2007132301A1 Circuit connectors
11/22/2007WO2007131648A2 Electrical sensor production and use thereof
11/22/2007WO2007131477A1 Method for producing a carrier plate for a circuit, carrier plate produced according to such a method, and circuit comprising such a carrier plate
11/22/2007WO2005038989A3 Fretting and whisker resistant coating system and method
11/22/2007US20070271467 Method for making smart cards capable of operating with and without contact
11/22/2007US20070270536 Conductive adhesive composition
11/22/2007US20070269997 Electronic components with plurality of contoured microelectronic spring contacts
11/22/2007US20070269909 Method for processing an integrated circuit
11/22/2007US20070269665 Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board
11/22/2007US20070269591 Pad Metallisation Process
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