| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/06/2007 | WO2007138798A1 Method and apparatus for inspecting wiring pattern of flexible printed wiring board |
| 12/06/2007 | WO2007138765A1 Manufacturing method of multilayer wiring substrate, and multilayer wiring substrate |
| 12/06/2007 | WO2007137817A1 Device for soldering in the vapour phase |
| 12/06/2007 | WO2007110719A3 Improved alkaline solutions for post cmp cleaning processes |
| 12/06/2007 | WO2007095439A3 Electrochemical etching of circuitry for high density interconnect electronic modules |
| 12/06/2007 | US20070281505 Rigid-Flexible Board and Method for Manufacturing the Same |
| 12/06/2007 | US20070281459 Multilayer Substrate Manufacturing Method |
| 12/06/2007 | US20070279890 Stacked mounting structure and method of manufacturing stacked mounting structure |
| 12/06/2007 | US20070279876 Device for passivating at least one component by a housing and method for manufacturing a device |
| 12/06/2007 | US20070278654 Method of making an electronic package |
| 12/06/2007 | US20070278315 Flat Transponder And Method For The Production Thereof |
| 12/06/2007 | US20070278278 Light Beam Bonding |
| 12/06/2007 | US20070277375 Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Printed Wiring Board, and, Method for Manufacturing Multi-Layer Printed Wiring Board |
| 12/06/2007 | US20070277374 Method for fabrication of hermetic electrical conductor feedthroughs |
| 12/06/2007 | US20070277373 Formation method of metal layer on resin layer, printed wiring board, and producution method thereof |
| 12/06/2007 | DE102007024435A1 Multi-layer plate, has electrical device connected with one of the intermediate layer connectors and/or conductive samples and including electrode made of material that has melting point higher than temperature in heating process |
| 12/06/2007 | DE102006023660A1 Method for producing structural combination particularly electrical or electronic equipment, involves providing housing half which has area of exposure for spring force or screw connection-technology |
| 12/06/2007 | DE102004057182B4 Verfahren zum Verlöten eines Steckverbinders mit einer Leiterplatte, Steckverbinder und Montagewerkzeug A method of soldering a connector to a circuit board, connectors, and installation tool |
| 12/05/2007 | EP1863327A1 Process for producing wiring board, and wiring board |
| 12/05/2007 | EP1863326A1 Printed wiring board |
| 12/05/2007 | EP1862505A2 Resin composition for printed wiring board film and use thereof |
| 12/05/2007 | EP1862042A1 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
| 12/05/2007 | EP1862040A2 Manufacturing process: how to construct constraining core material into printed wiring board |
| 12/05/2007 | EP1861871A1 Treatment of items |
| 12/05/2007 | EP1861867A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 12/05/2007 | EP1523868B1 Process for creating holes in polymeric substrates |
| 12/05/2007 | EP1430163B1 Precious metal recovery |
| 12/05/2007 | EP1366124B1 Conductive coating composition |
| 12/05/2007 | EP1359175B1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 12/05/2007 | CN200987238Y Fixing clamp for circuit board Circuit board fixing clamp |
| 12/05/2007 | CN200987237Y Waterproof air knife for printed circuit board wet manufacture process soft plate equipment |
| 12/05/2007 | CN200986010Y Cylindrical gear used for plate sending device final transmission of printed circuit boards wet manufacture process equipment |
| 12/05/2007 | CN200985984Y Driving mechanism of printed circuit boards wet manufacture process equipment plate sending device |
| 12/05/2007 | CN200985202Y Board feeding device for printed circuit board wet process equipment |
| 12/05/2007 | CN101084703A Multilayer printed circuit board and method for manufacturing same |
| 12/05/2007 | CN101084702A Flexible circuits and method of making same |
| 12/05/2007 | CN101084470A Material for pattern formation, apparatus for pattern formation, and method for pattern formation |
| 12/05/2007 | CN101084083A Solder precoating method and work for electronic device |
| 12/05/2007 | CN101083878A Method for welding FPC plate with PCB plate and its dedicated clamp |
| 12/05/2007 | CN101083877A Multi-head buried welding integration machine and its method for buried welding |
| 12/05/2007 | CN101083876A Nano spraying circuit board producing method and equipment and material configuration |
| 12/05/2007 | CN101083875A Perforating device for printed circuit wiring board and reference perforating method |
| 12/05/2007 | CN101083872A Printed wiring board, its manufacturing method, and electronic equipment |
| 12/05/2007 | CN101083232A Rfid tag and method of manufacturing the same |
| 12/05/2007 | CN101083214A Manufacturing method of a package substrate |
| 12/05/2007 | CN101083213A Method and structure for preparing printed circuit board for light emitting diode |
| 12/05/2007 | CN101083204A Methods for removing extraneous amounts of molding material from a substrate |
| 12/05/2007 | CN101081903A Prepreg and conductive layer-laminated substrate for printed wiring board |
| 12/05/2007 | CN101081454A Automatic protection device for avoid the overflow of tin |
| 12/05/2007 | CN100353821C Method for manufacturing circuit board |
| 12/05/2007 | CN100353820C Tin cream coating assistant apparatus |
| 12/05/2007 | CN100353819C Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board |
| 12/05/2007 | CN100353818C 信号传输结构 Signal transmission structure |
| 12/05/2007 | CN100353817C Pin-free socket compatible with optical-electrical interconnects |
| 12/05/2007 | CN100353547C Multi-chip circuit module and method for producing the same |
| 12/05/2007 | CN100353539C LSI packaging and assembly method thereof |
| 12/05/2007 | CN100353532C 半导体装置 Semiconductor device |
| 12/05/2007 | CN100353507C Pattern formation substrate and method of pattern formation |
| 12/05/2007 | CN100353375C Chipcard and method for production of a chipcard |
| 12/05/2007 | CN100353223C Panel display and electronic means thereof |
| 12/05/2007 | CN100352662C Thermal head and method for manufacturing such thermal head |
| 12/05/2007 | CN100352601C PCB processing machine main axle tool detecting method |
| 12/05/2007 | CN100352557C Nozzle arrangement |
| 12/04/2007 | US7304853 Apparatus of optical display module for fixing circuit board |
| 12/04/2007 | US7304390 Anisotropic conductive sheet and manufacture thereof |
| 12/04/2007 | US7304377 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
| 12/04/2007 | US7304364 Embossed mask lithography |
| 12/04/2007 | US7304249 Bonding pads for a printed circuit board |
| 12/04/2007 | US7304248 Multi-layer printed circuit board and method for manufacturing the same |
| 12/04/2007 | US7304247 Circuit board with at least one electronic component |
| 12/04/2007 | US7303978 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device |
| 12/04/2007 | US7303932 Support body for semiconductor element, method for manufacturing the same and semiconductor device |
| 12/04/2007 | US7303856 Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer |
| 12/04/2007 | US7303663 Multistep release method for electrochemically fabricated structures |
| 12/04/2007 | US7303640 Orientation equipment with multiple PCBS |
| 12/04/2007 | US7303639 Method for producing Z-axis interconnection assembly of printed wiring board elements |
| 12/04/2007 | US7303402 Connector, method for manufacturing the same, and wiring board structure employing it |
| 12/04/2007 | US7303400 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 12/04/2007 | US7303337 Optical communications module |
| 12/04/2007 | US7303244 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 12/04/2007 | US7302757 Micro-bumps to enhance LGA interconnections |
| 12/04/2007 | CA2356943C Electrically conductive ceramics |
| 11/29/2007 | WO2007136009A1 Bonding material, electronic component, bonding structure and electronic device |
| 11/29/2007 | WO2007135955A1 Object having through-hole formed therein and laser processing method |
| 11/29/2007 | WO2007135930A1 Metal surface treatment agent and use of same |
| 11/29/2007 | WO2007135894A1 Photosensitive composition, sheet for photosensitive resist, method for forming resist pattern, and method for manufacturing printed wiring board |
| 11/29/2007 | WO2007135879A1 Circuit board device, wiring board connecting method, and circuit board module device |
| 11/29/2007 | WO2007135737A1 Wiring board with built-in component and method for manufacturing wiring board with built-in component |
| 11/29/2007 | WO2007135604A2 Interconnection arrangement and method for interconnecting a high-cuurent carrying cable with a metal thin-film |
| 11/29/2007 | WO2007134740A1 Soldering apparatus |
| 11/29/2007 | WO2007116056A3 Method for applying a metal on paper |
| 11/29/2007 | WO2007112971A3 Electrolytic method for filling holes and cavities with metals |
| 11/29/2007 | WO2007106362A3 Laser delamination of thin metal film using sacrificial polymer layer |
| 11/29/2007 | WO2007078865A3 Method for providing a printed circuit board using laser assisted metallization and patterning of a substrate, printed circuit board, and system comprising a printed circuit board |
| 11/29/2007 | US20070275572 Connector for making electrical contact at semiconductor scales |
| 11/29/2007 | US20070275159 Process for producing an article with a coating of electrically conductive polymer |
| 11/29/2007 | US20070274060 Wiring board, semiconductor device, and method for manufacturing wiring board |
| 11/29/2007 | US20070274056 Circuit Assembly and Method of its Manufacture |
| 11/29/2007 | US20070274055 Surface Mountable Device |
| 11/29/2007 | US20070274047 Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material |