Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2007
12/19/2007CN100356512C Method of manufacturing wiring board
12/19/2007CN100355829C Resin composition, prepreg, laminate sheet and printed wiring board using the same
12/19/2007CN100355587C Method for producing a partially metallised film-type element
12/18/2007US7310438 Systems for detecting defects in printed solder paste
12/18/2007US7309924 UBM for fine pitch solder ball and flip-chip packaging method using the same
12/18/2007US7309917 Multilayer board and a semiconductor device
12/18/2007US7309724 Thermosetting resin compositions containing maleimide and/or vinyl compounds
12/18/2007US7309657 Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board
12/18/2007US7309559 Resist pattern, process for producing same, and utilization thereof
12/18/2007US7309243 Board mounted electrical connector
12/18/2007US7308754 Methods for trimming electrical parameters in an electrical circuit
12/18/2007CA2392322C Differential signal electrical connectors
12/18/2007CA2249973C Electrical connector
12/13/2007WO2007143127A1 Potassium monopersulfate solutions
12/13/2007WO2007142714A1 Systems, devices, and methods for increasing current carrying capacity
12/13/2007WO2007142175A1 Method of bonding
12/13/2007WO2007142112A1 Multilayer ceramic substrate, method for producing the same and electronic component
12/13/2007WO2007141883A1 Method of forming electrical wiring and method of repairing the same
12/13/2007WO2007140496A1 Method for manufacturing a conducting or conductive structure, and structure
12/13/2007WO2007140495A2 Method for manufacturing a circuit carrier
12/13/2007WO2007140494A1 Circuit carrier
12/13/2007WO2005062689A3 Suspension assembly method and the manufacture process
12/13/2007US20070287230 Electronic device and production method thereof
12/13/2007US20070286943 Method of Forming Uniform Lines on a Substrate
12/13/2007US20070285907 Wiring Board and Semiconductor Device
12/13/2007US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
12/13/2007US20070284738 Wiring board method for manufacturing the same, and semiconductor device
12/13/2007US20070284725 Integrated Circuit (IC) Carrier Assembly Incorporating Serpentine Suspension
12/13/2007US20070284587 Flexible electronic device and production method of the same
12/13/2007US20070284140 Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
12/13/2007US20070284136 Method for Production of Electronic Circuit Board
12/13/2007DE112006000153T5 Befestigung für eine elektronische Komponente Mounting for an electronic component
12/13/2007DE102006027027A1 Lötverfahren Soldering
12/13/2007CA2659695A1 Circuit carrier
12/13/2007CA2653971A1 Systems, devices, and methods for increasing current carrying capacity
12/13/2007CA2652151A1 Potassium monopersulfate solutions
12/12/2007EP1865760A2 Soldering method
12/12/2007EP1865550A1 Flip chip mounting method and method for connecting substrates
12/12/2007EP1864562A2 System and method for advanced mezzanine card connection
12/12/2007EP1864559A1 Production method of solder circuit board
12/12/2007EP1864326A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls
12/12/2007EP1864143A2 Mini wave soldering system and method for soldering wires and pin configurations
12/12/2007EP1498013B1 Flexible interconnect structures for electrical devices and light sources incorporating the same
12/12/2007EP1410700B1 Integrated circuit carrier with recesses
12/12/2007EP1328605B1 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion
12/12/2007EP1016106A4 Ceramic multilayer printed circuit boards with embedded passive components
12/12/2007CN101088162A Packaging for electronic modules
12/12/2007CN101088156A Flexible electronic circuit articles and methods of making thereof
12/12/2007CN101087673A 焊膏及电子装置 Paste and electronic equipment
12/12/2007CN101087496A Side wall printing method of porcelain block
12/12/2007CN101087495A Making method of multi-layer printed circuit board without leading hole
12/12/2007CN101087494A Method for making circuit board
12/12/2007CN101087493A Manufacturing method of circuit board encapsulated by accumulation circuit
12/12/2007CN101087492A Multi-layer plate
12/12/2007CN101087491A Electronic device, display apparatus, flexible circuit board and fabrication method thereof
12/12/2007CN101087038A RF antenna, electronic label and method for making RF antenna
12/12/2007CN101086970A Wiring circuit substrate, method of manufacturing the same, and method of manufacturing the used substrate
12/12/2007CN101085566A Novel leaking net plate
12/12/2007CN100355327C A printed circuit board and production method thereof
12/12/2007CN100355153C 显示设备 Display device
12/12/2007CN100355147C Self-aligned transition between a transmission line and a module
12/12/2007CN100355048C Adhesive sheet stamping device, adhesive sheet stamping method, part mounter, and display panel manufacturing method
12/12/2007CN100355032C Substrate dividing method
12/12/2007CN100355031C Method for deviding substrate
12/12/2007CN100354735C Liquid crystal display device
12/12/2007CN100354731C Display device and producing method thereof
12/12/2007CN100354730C Flexible base, board, electrooptical device and electronic device
12/12/2007CN100354717C 液晶显示器 LCD Monitor
12/12/2007CN100354712C Flat-board display device and method and device for making same
12/12/2007CN100354380C Conductive ink composition, reflective member, circuit substrate, and electronic apparatus
12/12/2007CN100354185C Manufacturing method for electronic or electric products such as flat-panel display devices and band-shaped package therefor
12/12/2007CN100354125C Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same
12/12/2007CN100354115C Method for producing laminate
12/11/2007US7308129 Characteristic amount calculating device for soldering inspection
12/11/2007US7307854 Flexible wired circuit board
12/11/2007US7307852 Printed circuit board and method for manufacturing printed circuit board
12/11/2007US7307850 Soldermask opening to prevent delamination
12/11/2007US7307848 Memory card with raised portion
12/11/2007US7307826 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
12/11/2007US7307691 Maskless direct exposure system and user interface
12/11/2007US7307354 Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer
12/11/2007US7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
12/11/2007US7307222 Printed circuit board test access point structures and method for making the same
12/11/2007US7307221 Fabrication method and structure of PCB assembly, and tool for assembly thereof
12/11/2007US7307123 For stereolithography, allow for variation in color, opacity, and surface properties, form opaque white or colored objects
12/11/2007US7306895 graft polymerization on supports having polymerization initiation layers obtained by fixing or crosslinking polymers
12/11/2007US7306742 Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
12/11/2007US7306353 Mounting arrangement for light emitting diodes
12/11/2007US7306161 Memory card with chamfer
12/11/2007US7306160 Memory card with adapter
12/11/2007US7305761 Method for manufacturing wiring substrate
12/11/2007US7305743 Method of producing piezoelectric ceramic device
12/06/2007WO2007140477A2 Polyimide insulative layers in multi-layered printed electronic features
12/06/2007WO2007140463A2 Solderable pads utilizing nickel and silver nanoparticle ink jet inks
12/06/2007WO2007140365A2 Solder flux composition
12/06/2007WO2007139129A1 Brushless motor for washing machine and washing machine having the brushless motor mounted therein
12/06/2007WO2007139005A1 Heat curable composition for protective film, cured product, and liquid crystal display device
12/06/2007WO2007138895A1 Coaxial via connecting structure and method for manufacturing same
12/06/2007WO2007138843A1 Circuit board device, method for connecting wiring boards, and circuit substrate module device
12/06/2007WO2007138826A1 Method for manufacturing ceramic multilayer substrate