| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/26/2007 | CN101094587A Recognition of product changes in PCB assembly |
| 12/26/2007 | CN101094565A Method of manufacturing multilayer printed wiring board |
| 12/26/2007 | CN101094564A Method for preparing multilayer soft print circuit board with no conduction through hole |
| 12/26/2007 | CN101094563A Direct metallization of electrically non-conductive polyimide substrate surfaces |
| 12/26/2007 | CN101094562A Method for deep drilling print circuit board |
| 12/26/2007 | CN101094560A PC board and its manufacturing method |
| 12/26/2007 | CN101093366A Conveyer |
| 12/26/2007 | CN100358401C Printed wiring board and method for manufacturing same |
| 12/26/2007 | CN100358400C Soft circuit board structure and electronic device for preventing soft circuit board from centralized stress when bending |
| 12/26/2007 | CN100358399C Flexible circuit board film press |
| 12/26/2007 | CN100358398C Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer |
| 12/26/2007 | CN100358123C Clamping device for processing electronic devices |
| 12/26/2007 | CN100358114C Method for forming penetrating electrode and chip with penerating electrode |
| 12/26/2007 | CN100358101C Circuit device and manufacturing method thereof |
| 12/26/2007 | CN100358053C Conductor component for electronic circuit |
| 12/26/2007 | CN100357967C Electronic circuit comprising conductive bridges and method for making such bridges |
| 12/26/2007 | CN100357496C Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and |
| 12/26/2007 | CN100357382C Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 12/26/2007 | CN100357338C Biaxially oriented polyester film and laminates thereof with copper |
| 12/26/2007 | CN100357336C Capsule type hardener and composition |
| 12/26/2007 | CN100357103C Ink-jet head |
| 12/25/2007 | US7312533 Electronic component with flexible contacting pads and method for producing the electronic component |
| 12/25/2007 | US7312404 Conductive contamination reliability solution for assembling substrates |
| 12/25/2007 | US7312400 Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
| 12/25/2007 | US7312261 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 12/25/2007 | US7312145 Electronic member, method for making the same, and semiconductor device |
| 12/25/2007 | US7312103 Method for making an integrated circuit substrate having laser-embedded conductive patterns |
| 12/25/2007 | US7311937 Method for forming a line pattern, line pattern, and electro-optic device |
| 12/25/2007 | US7311530 Dual segment molded lead frame connector for optical transceiver modules |
| 12/25/2007 | US7311241 Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method |
| 12/25/2007 | US7311240 Electrical circuits with button plated contacts and assembly methods |
| 12/25/2007 | US7310872 Computer enclosure |
| 12/25/2007 | US7310869 Flat connector, ink jet head and method of manufacturing them |
| 12/21/2007 | WO2007146546A2 Single or multi-layer printed circuit board with improved edge via design |
| 12/21/2007 | WO2007146481A2 Imprint circuit patterning |
| 12/21/2007 | WO2007145237A1 Heat dissipating wiring board and method for manufacturing same |
| 12/21/2007 | WO2007145189A1 Laminated ceramic electronic component |
| 12/21/2007 | WO2007145156A1 Substrate inspecting device |
| 12/21/2007 | WO2007145123A1 Wiring board, electron source, image display apparatus, and image reproducing apparatus |
| 12/21/2007 | WO2007144322A1 Method for producing electrically conductive surfaces on a carrier |
| 12/21/2007 | WO2007116057A3 Method for applying a metal on a substrate |
| 12/21/2007 | WO2004047510A3 A method of supporting electronic components and an electronic device with elastic support for an electronic component |
| 12/21/2007 | CA2659663A1 Circuit board |
| 12/21/2007 | CA2654797A1 Method for producing electrically conductive surfaces on a carrier |
| 12/20/2007 | US20070293099 Connector assembly for an implantable medical device and process for making |
| 12/20/2007 | US20070293038 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 12/20/2007 | US20070292994 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
| 12/20/2007 | US20070292697 Metal Base Circuit Substrate For An Optical Device And Method Manufacturing The Aforementioned Substrate |
| 12/20/2007 | US20070292668 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| 12/20/2007 | US20070292603 Processes and systems for engineering a barrier surface for copper deposition |
| 12/20/2007 | US20070291091 Inkjet nozzle with supply duct dimensioned for viscous damping |
| 12/20/2007 | US20070291070 Inkjet printhead with integral nozzle plate |
| 12/20/2007 | US20070290374 Component with Encapsulation Suitable for Wlp and Production Method |
| 12/20/2007 | US20070290327 Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 12/20/2007 | US20070289867 Apparatus for enhanced electrochemical deposition |
| 12/20/2007 | US20070289129 Selective Encapsulation of Electronic Components |
| 12/20/2007 | US20070289128 Process for producing circuit board |
| 12/20/2007 | DE102006027748A1 Printed circuit board for airbag control device of motor vehicle, has protection section that has passage openings for pressing pins, where passage openings of section lie over passage openings of pressing sockets |
| 12/20/2007 | DE102004005685B4 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component |
| 12/20/2007 | DE10196916B4 Symbol-basierte Signalgebung für ein elektromagnetisch gekoppeltes Bussystem Symbol-based signaling for an electromagnetically-coupled bus system |
| 12/19/2007 | EP1868423A1 Multilayer build-up wiring board |
| 12/19/2007 | EP1868422A2 Electronic component built-in substrate and method of manufacturing the same |
| 12/19/2007 | EP1867424A1 Method for removing fume in reflow furnace and reflow furnace |
| 12/19/2007 | EP1867223A1 Probe pad structure in a ceramic space transformer |
| 12/19/2007 | EP1867222A1 Interlocking means |
| 12/19/2007 | EP1866961A2 Micro solder pot |
| 12/19/2007 | EP1866454A1 Treatment of flexible web material |
| 12/19/2007 | EP1866357A1 (meth)acryloyl group-containing aromatic isocyanate compound and production process thereof |
| 12/19/2007 | EP1763594B1 Method for improving solderability of nickel coatings |
| 12/19/2007 | EP1487605B1 Device and method for laser structuring functional polymers and the uses thereof |
| 12/19/2007 | EP1176641B1 Front-and-back electrically conductive substrate and method for manufacturing same |
| 12/19/2007 | EP0857402B1 High performance flexible laminate |
| 12/19/2007 | CN200994227Y Lifting type reflow furnace |
| 12/19/2007 | CN200994226Y Green laser microscope precision trimming machine |
| 12/19/2007 | CN200991692Y Drive structure of dust adhering machine |
| 12/19/2007 | CN101091422A Printed board and method for manufacturing same |
| 12/19/2007 | CN101090797A Lead-free solder flux and solder paste |
| 12/19/2007 | CN101090610A Process for producing multilayer board |
| 12/19/2007 | CN101090609A Process for producing circuit board |
| 12/19/2007 | CN101090608A Process for producing circuit board |
| 12/19/2007 | CN101090607A Circuit substrate and method for making the same, and circuit assembly using the same |
| 12/19/2007 | CN101090606A Manufacturing method of circuit board |
| 12/19/2007 | CN101090603A Printed circuit board and method for manufacturing a solderless electrical connection |
| 12/19/2007 | CN101090601A Punching hole pad structure for circuit board and its hole punching method |
| 12/19/2007 | CN101090600A Printed circuit board, printed circuit subboard and manufacturing process of printed circuit board |
| 12/19/2007 | CN101090078A Semiconductor package structure and method for manufacturing the semiconduct package structure |
| 12/19/2007 | CN101090076A Process for producing a film carrier tape for mounting an electronic part |
| 12/19/2007 | CN101090075A Manufacturing method for vertical built-in capacity substrate and its structure |
| 12/19/2007 | CN101090074A Printed circuit board for package of electronic components and manufacturing method thereof |
| 12/19/2007 | CN101088692A Tin trough nozzle for wave soldering and wave soldering process |
| 12/19/2007 | CN101088687A Drill bit for PCB |
| 12/19/2007 | CN100356824C Metal mask and method of printing lead-free solder paste using same |
| 12/19/2007 | CN100356823C Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 12/19/2007 | CN100356822C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 12/19/2007 | CN100356560C Semiconductor device and method of manufacturing the device |
| 12/19/2007 | CN100356553C Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 12/19/2007 | CN100356539C RFID tag and method of manufacturing the same |
| 12/19/2007 | CN100356536C Method of microelectrode connection and connected structure of use thereof |
| 12/19/2007 | CN100356535C Flexible wiring base material and process for producing the same |
| 12/19/2007 | CN100356529C Printing apptsl for conductive material, cleaning method of printing mask, and cleaning program of printing mask |