| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/03/2008 | US20080000676 Circuit board |
| 01/03/2008 | US20080000674 Substrate-imprinting apparatus and methods |
| 01/03/2008 | US20080000080 Compliant electrical contacts |
| 01/03/2008 | DE19724664B4 Einbauteil mit speziellem elektrischen Kontaktierungssystem Fitting with special electrical connection system |
| 01/03/2008 | DE10207778B4 Lottragende Kontakte und Herstellungsverfahren dafür sowie Verwendung in einem Lotkugelgittermatrix-Verbinder Pin as contacts and manufacturing method thereof and use in a Lotkugelgittermatrix connector |
| 01/03/2008 | DE10205592B4 Verfahren zum Herstellen eines Halbzeugs für Leiterplatten A method of manufacturing a preform for printed circuit boards |
| 01/03/2008 | DE102006030135A1 Pins array assembling device has body, which positively receives each end of pins spaced from printed board in direction of pins axis and in form fitting manner against tilting of pins axis, where body is pulled out after assembling pins |
| 01/03/2008 | DE102006028816A1 Verfahren zur Herstellung von Spritzgussteilen mit integrierter flexibler Leiterplatte A process for producing molded parts with integrated flexible printed circuit board |
| 01/02/2008 | EP1874107A2 Method, device and program for setting a reference value for substrate inspection |
| 01/02/2008 | EP1873923A1 High frequency module |
| 01/02/2008 | EP1873827A1 Heat sink device |
| 01/02/2008 | EP1873824A1 Jet singulation of a substrate |
| 01/02/2008 | EP1873131A1 Process for producing ceramic substrate, and ceramic substrate |
| 01/02/2008 | EP1872956A2 Plotting an image on a thin material having variations in thickness |
| 01/02/2008 | EP1872639A1 Method of forming flexible electronic circuits |
| 01/02/2008 | EP1872638A1 A method of forming flexible electronic circuits |
| 01/02/2008 | EP1871826A1 Surface graft material and its manufacturing method, electrically conductive material and its manufacturing method, and electrically conductive pattern material |
| 01/02/2008 | EP1531024B1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 01/02/2008 | EP1366207A4 Plating method of metal film on the surface of polymer |
| 01/02/2008 | EP1297383B1 A method for individualised marking of circuit boards |
| 01/02/2008 | EP1094029B1 Narrow-pitch connector, pitch converter, micromachine, piezoelectric actuator, electrostatic actuator, ink-jet head, ink-jet printer, liquid crystal device, and electronic apparatus |
| 01/02/2008 | EP1092676B1 Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| 01/02/2008 | CN201001256Y Passive combination multi-use thimble device |
| 01/02/2008 | CN201001237Y Waste treatment device for circuit board film-peeling machine |
| 01/02/2008 | CN101098784A Screen printer and screen printing method |
| 01/02/2008 | CN101098620A Alignment of printed circuit board targets |
| 01/02/2008 | CN101098619A Method, device and program for setting a reference value for substrate inspection |
| 01/02/2008 | CN101098618A High speed full-automatic paster machine array type mounting head |
| 01/02/2008 | CN101098617A Reflow temperature-control device of surface-mounted electronic component and circuit board and method thereof |
| 01/02/2008 | CN101098593A Circuit board air-pumping ink-penetrating via-filling method and device thereof |
| 01/02/2008 | CN101098592A Fixing mechanism |
| 01/02/2008 | CN101098591A Patterned method for tape coiling type thin object in automated process |
| 01/02/2008 | CN101098590A Printed circuit boards |
| 01/02/2008 | CN101098587A Printed circuit boards |
| 01/02/2008 | CN101098584A Printed circuit board and method of manufacturing the same |
| 01/02/2008 | CN100359996C Printed circuit board and manufacturing method thereof |
| 01/02/2008 | CN100359994C Chip-on-film use copper foil |
| 01/02/2008 | CN100359682C Thin electronic label and method for making same |
| 01/02/2008 | CN100359681C Semiconductor device and its lead frame |
| 01/02/2008 | CN100359677C 电子器件 Electronic devices |
| 01/02/2008 | CN100359674C Module type semi-conductor device |
| 01/02/2008 | CN100359653C Method for connecting substrates and composite element |
| 01/02/2008 | CN100359369C 显示装置 Display device |
| 01/02/2008 | CN100359045C Method for electroless deposition of a metal layer on selected portions of a substrate |
| 01/02/2008 | CN100358963C Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet |
| 01/01/2008 | US7315226 Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same |
| 01/01/2008 | US7315116 Organic electroluminescent display device with separately connected signal lines and power lines |
| 01/01/2008 | US7315085 Ball grid array package and method thereof |
| 01/01/2008 | US7315083 Circuit device and manufacturing method thereof |
| 01/01/2008 | US7315049 LED assembly with vented circuit board |
| 01/01/2008 | US7315000 Electronic module with dual connectivity |
| 01/01/2008 | US7314905 Drawn film and process for producing the same |
| 01/01/2008 | US7314821 Method for fabricating a semiconductor interconnect having conductive spring contacts |
| 01/01/2008 | US7314819 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
| 01/01/2008 | US7314817 Microelectronic device interconnects |
| 01/01/2008 | US7314780 Semiconductor package, method of production of same, and semiconductor device |
| 01/01/2008 | US7314777 Chip packaging systems and methods |
| 01/01/2008 | US7314573 Making printed circuits by by ink jet printing on dielectric a plate-resistant solvent-free acrylate ink with acid-free acrylic ester monomers and acrylates containing acid groups; polymerizing; electrolytic or electroless depositing metal layers, the upper layer of which is etch-resistant; removing ink |
| 01/01/2008 | US7314268 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip |
| 01/01/2008 | US7313863 Method to form a cavity having inner walls of varying slope |
| 01/01/2008 | US7313862 Method of mounting components on a PCB |
| 12/27/2007 | WO2007150066A1 Fluidic self-assembly for system integration |
| 12/27/2007 | WO2007148785A1 ELECTROLESS Ni-P PLATING METHOD AND SUBSTRATE FOR ELECTRONIC COMPONENT |
| 12/27/2007 | WO2007148773A1 Method for producing conductive material |
| 12/27/2007 | WO2007148666A1 Copper foil with primer resin layer and laminate using the same |
| 12/27/2007 | WO2007148556A1 Multilayered ceramic electronic part |
| 12/27/2007 | WO2007147750A1 Method for fixing an electrical or electronic component, in particular a printed circuit board, in a housing and fixing element therefor |
| 12/27/2007 | WO2007124280A3 Wiring board, production process thereof and connection method using same |
| 12/27/2007 | WO2007115546A3 Method for production of a conductor track structure and a correspondingly produced conductor track structure |
| 12/27/2007 | WO2007109594A3 Articles and methods including patterned substrates formed from densified, adhered metal powders |
| 12/27/2007 | WO2006003592A3 Soft lithographic stamp with a chemically patterned surface |
| 12/27/2007 | US20070299172 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 12/27/2007 | US20070299159 Resin particle, conductive particle, and anisotropic conductive adhesive containing the same |
| 12/27/2007 | US20070298609 Capping of metal interconnects in integrated circuit electronic devices |
| 12/27/2007 | US20070298161 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
| 12/27/2007 | US20070296533 Magnetic Device |
| 12/27/2007 | US20070295532 Multilayer printed wiring board |
| 12/27/2007 | US20070295444 Reel-type package of flexible printed circuit borads and method for supplying thereof |
| 12/27/2007 | US20070295426 Method For Manufacturing Austenitic Stainless Steel, Solder-Melting Tank, And Automatic Soldering Apparatus |
| 12/27/2007 | US20070294889 Electronic circuit module and method for its assembly |
| 12/27/2007 | US20070294888 Miniature circuitry and inductive components and methods for manufaturing same |
| 12/27/2007 | DE10255520B4 Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung Method for making electrical contact means filled with liquids and electronic components such contact |
| 12/27/2007 | DE102006028919A1 Signal processing arrangement, has multilayer structure formed for transporting signals into multilayer structure in three spatial directions |
| 12/27/2007 | DE102006028653A1 Vapour-Phase-Löten mit Überhitzungsschutz für elektronische Bauelemente Vapor phase soldering with overheating protection for electronic components |
| 12/27/2007 | DE102006028536A1 Verfahren zur Herstellung eines Schaltungsteils auf einem Substrat A method for producing a circuit member on a substrate |
| 12/27/2007 | CA2655936A1 Process for the production of a circuit portion on a substrate |
| 12/26/2007 | EP1871153A2 Wiring substrate and manufacturing method thereof, and semiconductor apparatus |
| 12/26/2007 | EP1870970A1 Method for manufacturing an electric hybrid component |
| 12/26/2007 | EP1870191A1 Reflow oven |
| 12/26/2007 | EP1870190A1 Vapour phase soldering of electronic components having a coating for protection against overheating; Electronic component with a coating for protection against overheating |
| 12/26/2007 | EP1869950A2 System and method for attaching a substantially three dimensional structure to a substantially two dimensional structure |
| 12/26/2007 | EP1869738A1 Surge arrester |
| 12/26/2007 | EP1869724A1 Circuitry module |
| 12/26/2007 | EP1685586A4 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 12/26/2007 | CN200997722Y Intermediate buffering material structure during contact process |
| 12/26/2007 | CN200997053Y Structure for welding and connecting watch master circuit board with coil retainer |
| 12/26/2007 | CN200995296Y Tungsten carbide drilling bit |
| 12/26/2007 | CN101095382A Wiring board and manufacturing method thereof |
| 12/26/2007 | CN101095084A Process and apparatus for the production of collimated uv rays for photolithographic transfer |
| 12/26/2007 | CN101094936A Microfabrication using patterned topography and self-assembled monolayers |