| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/10/2008 | US20080008823 Deposition processes for tungsten-containing barrier layers |
| 01/10/2008 | US20080007927 Multilayered printed circuit board and the manufacturing method thereof |
| 01/10/2008 | US20080007921 High density memory module using stacked printed circuit boards |
| 01/10/2008 | US20080007919 Motor Control Apparatus And method Of Assembling Motor Control Apparatus |
| 01/10/2008 | US20080006928 Composite multi-layer substrate and module using the substrate |
| 01/10/2008 | US20080006605 Method of Manufacturing a Porous Resin Substrate Having Perforations and Method of Making a Porous Resin Substrate Including Perforations Having Electrically Conductive Wall Faces |
| 01/10/2008 | US20080006439 Reference layer openings |
| 01/10/2008 | US20080006296 Cleaning Device of Board and Cleaning Method, Flat Display Panel, Mounting Equipment of Electronic Parts and Mounting Method |
| 01/10/2008 | US20080005902 Method for increasing a production rate of printed wiring boards |
| 01/10/2008 | US20080005901 Holder for surface mount device during reflow |
| 01/10/2008 | US20080005899 Manufacturing method of wiring board, manufacturing method of electron source, manufacturing method of image display apparatus and image reproducing apparatus |
| 01/10/2008 | US20080005898 Through hole forming method and printed circuit board manufacturing method |
| 01/10/2008 | US20080005897 Flexible wiring sheet, display apparatus and manufacturing method thereof |
| 01/10/2008 | US20080005896 Method for fabricating multi-layered flexible printed circuit board without via holes |
| 01/10/2008 | US20080005895 Random-period chip transfer method |
| 01/10/2008 | US20080005894 Component Mounting Apparatus And Method For Determining Component Holding Members |
| 01/10/2008 | DE10236404B4 Verfahren zur Herstellung eines Substrates Process for the preparation of a substrate |
| 01/10/2008 | DE102007031171A1 Film antenna manufacturing method for e.g. mobile telephone, involves forming antenna emitter on side of carrier film by sputtering or cutting, where sputtering takes place using metal with specific amount of purity as sputtering target |
| 01/10/2008 | DE102007029713A1 Leiterplatte und Verfahren zu deren Herstellung Printed circuit board and process for their preparation |
| 01/10/2008 | DE102004018640B4 Lotaufschmelzofen Solder reflow oven |
| 01/10/2008 | DE10101948B4 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method for disposing a semiconductor chip on a substrate and on a substrate mountable semiconductor module |
| 01/10/2008 | DE10026187B4 Verfahren und eine Vorrichtung zum Aufbringen einer Paste auf einen Bauelementkörper eines elektronischen Bauelements A method and apparatus for applying a paste to a device body of an electronic component |
| 01/09/2008 | EP1876874A1 Wave soldering bath |
| 01/09/2008 | EP1876873A1 Process for producing double-sided flexible printed board and double-sided flexible printed board |
| 01/09/2008 | EP1876546A1 Circuit wiring interference analysis device, interference analysis program, database used in interference analysis device, and asymmetrically connected line model |
| 01/09/2008 | EP1876199A1 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
| 01/09/2008 | EP1875789A1 Flexible circuit substrate |
| 01/09/2008 | EP1875788A2 Method for producing a partially shaped electrically conductive structure |
| 01/09/2008 | EP1741006B1 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 01/09/2008 | EP1629706B1 Method for assembling a circuit |
| 01/09/2008 | CN201004735Y Conveying device for soft circuit board |
| 01/09/2008 | CN201004734Y Material removal device of printed circuit board molder |
| 01/09/2008 | CN201002162Y Vibration type wicking welding machine tin adhesion removing device |
| 01/09/2008 | CN201002158Y Adjusting device for wave peak tin soldering machine main beam |
| 01/09/2008 | CN101103661A Structure and method for attaching shield case to circuit board, electronic component module and portable telephone |
| 01/09/2008 | CN101103657A Lead wire connection method for touch panel |
| 01/09/2008 | CN101103656A Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/09/2008 | CN101103655A Anti-static spacer for high temperature curing process of flexible printed circuit board |
| 01/09/2008 | CN101103654A Printed board and printed board manufacturing method |
| 01/09/2008 | CN101103449A Method of connecting a semiconductor package to a printed wiring board |
| 01/09/2008 | CN101103312A Image exposing apparatus and microlens array unit |
| 01/09/2008 | CN101103310A Material for pattern formation, apparatus for pattern formation, and method for pattern formation |
| 01/09/2008 | CN101103062A Curable resin composition and interlayer insulating film |
| 01/09/2008 | CN101103057A Curable resin composition for ink-jet printing, cured object obtained therefrom, and printed wiring board using the same |
| 01/09/2008 | CN101102865A Baffle plate, hot air blower for solder treatment, and nozzle for the device |
| 01/09/2008 | CN101102864A Reflow furnace |
| 01/09/2008 | CN101102662A Surface mounting structure for electronic component |
| 01/09/2008 | CN101102661A Micro modular pasting header for high speed fully automatic chip machine |
| 01/09/2008 | CN101102649A Buried pattern substrate and manufacturing method thereof |
| 01/09/2008 | CN101102648A Through hole forming method and wiring circuit board manufacturing method |
| 01/09/2008 | CN101102647A Plasma semi-additive process method for manufacturing pcb |
| 01/09/2008 | CN101102646A Method for printed circuit board making process to overcome gold touch in non penetration hole |
| 01/09/2008 | CN101102645A Circuit pattern formation device and method of forming circuit pattern to substrate |
| 01/09/2008 | CN101102644A Vertical etching copper line method for internal layer of printed circuit board |
| 01/09/2008 | CN101102643A Film structure for thin core plate of PCB plate |
| 01/09/2008 | CN101102640A Printed circuit board and manufacturing method thereof |
| 01/09/2008 | CN101102638A COF flexible printed wiring board and manufacturing method for the same |
| 01/09/2008 | CN101102626A Metal heating plate |
| 01/09/2008 | CN101102004A Film antenna manufacturing method by using sputtering process |
| 01/09/2008 | CN101101899A Laminose board, manufacturing method thereof, electronic element and device with the laminose board |
| 01/09/2008 | CN100361350C Plug for connection strips and method for the production thereof |
| 01/09/2008 | CN100361284C IC packing substrate structure and its manufacture |
| 01/08/2008 | US7317622 Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt |
| 01/08/2008 | US7317621 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 01/08/2008 | US7317395 RFID tag and method of manufacturing the same |
| 01/08/2008 | US7317322 Interconnect for bumped semiconductor components |
| 01/08/2008 | US7317243 Encapsulated lead having step configuration |
| 01/08/2008 | US7317166 Wiring base board, method of producing thereof, and electronic device |
| 01/08/2008 | US7317165 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 01/08/2008 | US7316939 Semiconductor device manufacturing method and manufacturing apparatus |
| 01/08/2008 | US7316838 Low cost electrically conductive carpeting manufactured from conductive loaded resin-based materials |
| 01/08/2008 | US7316791 Polyimide based substrate comprising doped polyaniline |
| 01/08/2008 | US7316783 Method of wiring formation and method for manufacturing electronic components |
| 01/08/2008 | US7316748 Apparatus and method of dispensing small-scale powders |
| 01/08/2008 | US7316063 Methods of fabricating substrates including at least one conductive via |
| 01/08/2008 | US7316062 Solder extraction tool and method |
| 01/08/2008 | US7316061 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 01/08/2008 | US7316060 System for populating a circuit board with semiconductor chips |
| 01/03/2008 | WO2008002268A1 Ltcc substrate structure |
| 01/03/2008 | WO2008001915A1 Wiring board, semiconductor device using wiring board and their manufacturing methods |
| 01/03/2008 | WO2008001845A1 Squeegee for printing device, printing device, and printing method |
| 01/03/2008 | WO2008001838A1 Printing device and printing method |
| 01/03/2008 | WO2008001695A1 Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition |
| 01/03/2008 | WO2008001611A1 Method for producing metal film, foundation composition, metal film and use thereof |
| 01/03/2008 | WO2008001600A1 Method of removing conductive paste |
| 01/03/2008 | WO2008001430A1 Screen printing machine and solar battery cell |
| 01/03/2008 | WO2008001077A1 Registration system and method |
| 01/03/2008 | WO2008000215A1 Housing for accommodating an electronic component and electronic component arrangement |
| 01/03/2008 | US20080003849 S&P2 CWW1 connector with wipe |
| 01/03/2008 | US20080003817 Method of manufacturing semiconductor device and semiconductor device |
| 01/03/2008 | US20080003522 Photoresist with metal oxide nanoparticles |
| 01/03/2008 | US20080003407 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers |
| 01/03/2008 | US20080003352 Process control monitors for interferometric modulators |
| 01/03/2008 | US20080003351 Method for the manufacture of printed circuit boards with plated resistors |
| 01/03/2008 | US20080002379 Secure Electronic Entity Such as a Passport |
| 01/03/2008 | US20080002375 Flexible printed circuit board, ultrasonic probe, and method of manufacturing ultrasonic probe |
| 01/03/2008 | US20080002165 Method And Apparatus For Producing Printed-Circuit-Board |
| 01/03/2008 | US20080001309 Semiconductor Device, Wiring Board, And Manufacturing Method Thereof |
| 01/03/2008 | US20080001299 Method of manufacturing semiconductor device and semiconductor device |
| 01/03/2008 | US20080000949 Method of Joining Using Reactive Multilayer Foils With Enhanced Control of Molten Joining Materials |