| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/17/2008 | US20080012151 Method and an Apparatus for Manufacturing an Electronic Thin-Film Component and an Electronic Thin-Film Component |
| 01/17/2008 | US20080011981 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same |
| 01/17/2008 | US20080011814 Method and System for Self-Aligning Parts in Mems |
| 01/17/2008 | US20080011612 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof |
| 01/17/2008 | US20080011508 Electronic parts packaging structure and method of manufacturing the same |
| 01/17/2008 | US20080010824 Probe card and method for manufacturing probe card |
| 01/17/2008 | US20080010823 Method for increasing a production rate of printed wiring boards |
| 01/17/2008 | US20080010822 Method for increasing a production rate of printed wiring boards |
| 01/17/2008 | US20080010820 Soldering a flexible circuit |
| 01/17/2008 | US20080010819 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
| 01/17/2008 | US20080010818 Wafer Expanding Device, Component Feeder, and Expanding Method for Wafer Sheet |
| 01/17/2008 | US20080010815 Heating tape structure |
| 01/17/2008 | US20080010814 Tester channel to multiple ic terminals |
| 01/17/2008 | US20080010798 Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof |
| 01/17/2008 | DE10234705B4 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen Electroplating and plating system for coating already formed conductive structures |
| 01/17/2008 | DE102007008490A1 Substrat mit vergrabenem Schaltbild und Herstellungsverfahren dafür Substrate buried diagram and manufacturing method thereof |
| 01/17/2008 | DE102006033055A1 Elektrisch leitfähige Strukturen Electrically conductive structures |
| 01/17/2008 | DE102006032821A1 Chip cards producing method, involves sucking card base body by hole in plates, where sucking is carried out by applying vacuum on plate and chip module is inserted into cavity through other hole in plate |
| 01/17/2008 | DE102006032051A1 Wellenlötanlage zum Löten elektronischer Bauteile auf einer Leiterplatte Wave soldering machine for soldering electronic components on a printed circuit board |
| 01/17/2008 | DE102004005361B4 Verfahren zur Herstellung von metallischen Leitbahnen und Kontaktflächen auf elektronischen Bauelementen A process for the production of metallic interconnects and contact surfaces on electronic components |
| 01/16/2008 | EP1879437A1 A marking apparatus used in a process for producing multi-layered printed circuit board |
| 01/16/2008 | EP1879436A2 Method for manufacturing a composite of copper and resin |
| 01/16/2008 | EP1879435A2 Electrically conductive structures |
| 01/16/2008 | EP1879294A1 Electrical device and method of producing an electrical device |
| 01/16/2008 | EP1879267A2 Press fitting apparatus and related method |
| 01/16/2008 | EP1879227A1 Multilayer wiring substrate and manufacturing method thereof |
| 01/16/2008 | EP1878527A1 Process and apparatus for reflow soldering with two different gases |
| 01/16/2008 | EP1878327A2 Generic patterned conductor for customizable electronic devices |
| 01/16/2008 | EP1877263A1 Process for contact printing of pattern of electroless deposition catalyst |
| 01/16/2008 | EP1828434B1 Method for improving the electrical connection properties of the surface of a product made from a polymer-matrix composite |
| 01/16/2008 | EP1709261B1 Façade covering |
| 01/16/2008 | EP1458784B1 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 01/16/2008 | EP0926931B1 Wiring board having vias |
| 01/16/2008 | CN201008237Y Cover lifting device for circuit board welding machine |
| 01/16/2008 | CN101107892A 多层印刷线路板 Multilayer printed circuit boards |
| 01/16/2008 | CN101107891A Multilayer printed wiring board |
| 01/16/2008 | CN101107888A Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section |
| 01/16/2008 | CN101107573A Exposure system and device |
| 01/16/2008 | CN101107091A Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder, a wave soldering machine with such nozzle, a method of improving the flow of solder out of a wa |
| 01/16/2008 | CN101107053A Method and apparatus for treatment of exhaust gas |
| 01/16/2008 | CN101106898A Substrate supportring device, device and method for manufactruring the same |
| 01/16/2008 | CN101106872A Printed wiring board and method of producing the same |
| 01/16/2008 | CN101106871A A marking apparatus used in a process for producing multi-layered printed circuit board |
| 01/16/2008 | CN101106870A Integrated circuit board capable of effectively controllong current resistance coefficient and its production process |
| 01/16/2008 | CN101106869A Method for manufacturing printed board |
| 01/16/2008 | CN101106868A Method for manufacturing printed circuit board using imprinting |
| 01/16/2008 | CN101106867A Method for manufacturing printed circuit board |
| 01/16/2008 | CN101106865A Double side flexible circuit board |
| 01/16/2008 | CN101106864A Metal cushion for mould plug part and its making method |
| 01/16/2008 | CN101106862A Printed circuit board and its making method |
| 01/16/2008 | CN101106861A Rigid-flexible printed circuit board and method of manufacturing the same |
| 01/16/2008 | CN101106125A Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly |
| 01/16/2008 | CN101106121A Wiring substrate, semiconductor device, and method of manufacturing the same |
| 01/16/2008 | CN101106098A Ball filling device and method |
| 01/16/2008 | CN101106018A Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof |
| 01/16/2008 | CN101105629A Light solidifying/heat solidifying one-part welding resistant agent composition and printing circuit plate |
| 01/16/2008 | CN101105628A Light solidifying/heat solidifying one-part welding resistant agent composition |
| 01/16/2008 | CN101105626A Light solidifying/heat solidifying resin composition, condensate of the same and printing circuit board |
| 01/16/2008 | CN101105625A Light solidifying composition and pattern forming method using the same |
| 01/16/2008 | CN101105612A Flexible wiring sheet, display apparatus and manufacturing method thereof |
| 01/16/2008 | CN101104780A Masking tape for board |
| 01/16/2008 | CN101104727A Halogen-free resin composition and resin-coated copper foil of the same for high-density interconnection |
| 01/16/2008 | CN100362905C Part inserting head device, part inserting device, and part inserting method |
| 01/16/2008 | CN100362698C Press fit terminal and connection structure |
| 01/16/2008 | CN100362640C Method for preventing semiconductor assembly pin welding from shorting circuit |
| 01/16/2008 | CN100362429C Precursor composition for positive photosensitive resin and display made with the same |
| 01/16/2008 | CN100362412C Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit |
| 01/16/2008 | CN100361809C Partition plate and method for producing a partition plate for a multi-layer pressed stack |
| 01/15/2008 | US7319599 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 01/15/2008 | US7319334 Apparatus and method of inspecting breakdown of conducting wire |
| 01/15/2008 | US7319304 Shunt connection to a PCB of an energy management system employed in an automotive vehicle |
| 01/15/2008 | US7319276 Substrate for pre-soldering material and fabrication method thereof |
| 01/15/2008 | US7319273 Methods and apparatus for a flexible circuit interposer |
| 01/15/2008 | US7319269 Semiconductor device power interconnect striping |
| 01/15/2008 | US7319197 Structure of stacked vias in multiple layer electrode device carriers |
| 01/15/2008 | US7319049 Method of manufacturing an electronic parts packaging structure |
| 01/15/2008 | US7318996 Method for forming patterned insulating elements and methods for making electron source and image display device |
| 01/15/2008 | US7318874 Adhesive tapes consisting of adhesive film on a release agent lining |
| 01/15/2008 | US7318868 Paste coating method |
| 01/15/2008 | US7318729 Sheet-form connector and production method and application therefor |
| 01/10/2008 | WO2008005993A1 Transformer and associated method of making using liquid crystal polymer (lcp) material |
| 01/10/2008 | WO2008005989A1 Ball grid array (bga) connection system and related method and ball socket |
| 01/10/2008 | WO2008005736A1 Flexible circuit |
| 01/10/2008 | WO2008004850A1 Collet head for placement machine |
| 01/10/2008 | WO2008004784A1 Method for manufacturing pcb and pcb manufactured using the same |
| 01/10/2008 | WO2008004720A1 Plasma semi-additive process method for manufacturing pcb |
| 01/10/2008 | WO2008004531A2 Cream solder and method of soldering electronic part |
| 01/10/2008 | WO2008004423A1 Wiring board having columnar conductor and method for manufacturing the wiring board |
| 01/10/2008 | WO2008004399A1 Bonding resin composition for fluororesin substrates and metal-clad laminates made by using the composition |
| 01/10/2008 | WO2008004382A1 Method for manufacturing multilayer printed wiring board |
| 01/10/2008 | WO2008004367A1 Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
| 01/10/2008 | WO2008004289A1 Printed circuit board, printed circuit board unit, and electronic apparatus |
| 01/10/2008 | WO2008004288A1 Printed wiring board and electronic device |
| 01/10/2008 | WO2008004287A1 Conductive adhesive |
| 01/10/2008 | WO2007126516A3 Process for creating a pattern on a copper surface |
| 01/10/2008 | WO2007093290A3 Method for producing a layer on a moulding and use thereof |
| 01/10/2008 | WO2007078717A3 Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
| 01/10/2008 | WO2004074553A3 Plating using an insoluble anode and seperately supplied plating material |
| 01/10/2008 | US20080009100 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations |
| 01/10/2008 | US20080008824 Method for manufacturing printed circuit board using imprinting |