| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/29/2008 | US7323227 Process for precise arrangement of micro-bodies |
| 01/29/2008 | US7323142 Used for sensing a variety of parameters, including physiological parameters; portable diagnostic medical equipment |
| 01/29/2008 | US7323093 Producing method of flexible wired circuit board |
| 01/29/2008 | US7322288 Method and apparatus for performing operations within a stencil printer |
| 01/29/2008 | US7322100 Method for producing a micromachined layered device |
| 01/29/2008 | CA2345764C Capacitance-coupled high dielectric constant embedded capacitors |
| 01/29/2008 | CA2313679C Electrical connector system with cross-talk compensation |
| 01/29/2008 | CA2210833C Method of wire bonding an integrated circuit to an ultraflexible substrate |
| 01/24/2008 | WO2008010978A2 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
| 01/24/2008 | WO2008010518A1 Circuit board device, electronic device provided with the circuit board device and gnd connecting method |
| 01/24/2008 | WO2008010516A1 Mounting method using thermocompression head |
| 01/24/2008 | WO2008010445A1 Multilayer printed circuit board |
| 01/24/2008 | WO2008009505A1 Combined fixing and contacting element for superposed electrical carrier components |
| 01/24/2008 | WO2008009494A1 Conductor support device, and arrangement of said conductor support device |
| 01/24/2008 | WO2008009493A1 Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier |
| 01/24/2008 | WO2008009492A2 Conductor carrier and arrangement comprising a conductor carrier |
| 01/24/2008 | WO2007140365A3 Solder flux composition |
| 01/24/2008 | WO2007025675A8 Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
| 01/24/2008 | US20080020727 Circular and Linear Polarization LNB |
| 01/24/2008 | US20080020599 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
| 01/24/2008 | US20080019103 Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same |
| 01/24/2008 | US20080017873 Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, led display, led backlight and electronic device |
| 01/24/2008 | US20080017410 Method for forming a plated microvia interconnect |
| 01/24/2008 | US20080017408 Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package |
| 01/24/2008 | US20080017403 Method of manufacturing circuit-forming board and material of circuit-forming board |
| 01/24/2008 | US20080017223 Conductive adhesive rework method |
| 01/24/2008 | US20080016686 Manufacturing method of printed circuit board |
| 01/24/2008 | US20080016682 Method and apparatus for microstructure assembly |
| 01/24/2008 | US20080016675 Methods of Forming Magnetic Memory Devices Including Ferroelectric Spacers |
| 01/24/2008 | DE19707485B4 Haltevorrichtung und Haltebaugruppe für ein Leiterplatten-Prüfgerät Holding device and support assembly for a printed circuit board testing device |
| 01/24/2008 | DE10251480B4 Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat A method for drilling holes by means of a laser beam in an electric circuit substrate |
| 01/24/2008 | DE102006033269A1 Verfahren zum Herstellen eines flexiblen Leiterträgers und Anordnung mit dem flexiblen Leiterträger A method for producing a flexible conductor carrier arrangement and with the flexible conductor carrier |
| 01/24/2008 | DE102006033178A1 Packed electronic component manufacturing method for mounting on printed circuit board, involves pre-centrally allowing electronic component with respect to centering tool that is premounted in printed circuit board using pre-centering unit |
| 01/24/2008 | DE102006031949A1 Flat plugging socket for motor vehicle, has contact pins connecting frame with connection support and contact springs contacting flat connection, where free end section of each contact springs is bent in interior of frame |
| 01/23/2008 | EP1881751A1 Ceramic multilayer board |
| 01/23/2008 | EP1881750A1 Electrically Conductive Feature Fabrication Process |
| 01/23/2008 | EP1881749A2 Method of fabricating an electrical connecting element, and electrical connecting element |
| 01/23/2008 | EP1881506A1 Conductor paste and electronic component |
| 01/23/2008 | EP1880416A1 Process for minimizing electromigration in an electronic device |
| 01/23/2008 | EP1880412A1 Method for forming high-resolution pattern with direct writing means |
| 01/23/2008 | EP1810385A4 Microelectronics package and method |
| 01/23/2008 | EP1658658A4 A flexible flat cable termination structure for a clockspring |
| 01/23/2008 | EP1342252B1 Multi-layer and user-configurable micro-printed circuit board |
| 01/23/2008 | CN201011748Y Wave crest pouring and welding stove especially for PWB plate |
| 01/23/2008 | CN201010291Y Dustproof guide pulley |
| 01/23/2008 | CN201009513Y Visual printing press of single light axis optical apparatus detecting mechanism |
| 01/23/2008 | CN201009029Y Automatic stannum applying device of wave top welding machine |
| 01/23/2008 | CN201008825Y Automated adjustable carrier for injecting glue |
| 01/23/2008 | CN101112142A Multilayer printed wiring board |
| 01/23/2008 | CN101112141A Multi-layer printed wiring board and manufacturing method thereof |
| 01/23/2008 | CN101112140A Multilayer printed wiring board and its manufacturing method |
| 01/23/2008 | CN101112139A Jet solder bath |
| 01/23/2008 | CN101112138A Method and machine for manufacturing electrical circuits |
| 01/23/2008 | CN101111471A Material for metallic-pattern formation, crosslinking monomer, and method of forming metallic pattern |
| 01/23/2008 | CN101111342A Method for removing fume in reflow furnace and reflow furnace |
| 01/23/2008 | CN101111340A Workpiece boring/cutting operation aiding plate material and molding making use of the same |
| 01/23/2008 | CN101111131A Manufacturing method of multi-layer flexible circuit board |
| 01/23/2008 | CN101111130A Technique for placing connectors on printing circuit board |
| 01/23/2008 | CN101111129A Manufacturing method of printed circuit board |
| 01/23/2008 | CN101111128A Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embe |
| 01/23/2008 | CN101111127A Wiring method and system |
| 01/23/2008 | CN101111126A 电路板 Circuit board |
| 01/23/2008 | CN101111125A Multilayer interconnection board |
| 01/23/2008 | CN101111123A Hybrid multilayer circuit board and its manufacturing method |
| 01/23/2008 | CN101110412A A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same |
| 01/23/2008 | CN101110404A Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/23/2008 | CN101110351A Placement device of anisotropy conducting bond and manufacturing method of electric equipment |
| 01/23/2008 | CN100364372C Miniature circulating flow passage system and manufacturing method thereof |
| 01/23/2008 | CN100364370C Wiring structure |
| 01/23/2008 | CN100364086C Semiconductor device and electronic device, and methods for manufacturing thereof |
| 01/23/2008 | CN100364078C Circuit board, process for producing the same and power module |
| 01/23/2008 | CN100364077C High wireability microvia substrate |
| 01/23/2008 | CN100363795C Method for forming pattern using printing method |
| 01/23/2008 | CN100363744C Probe connecting terminal cladded with conducting wire on testing tool of printed circuit distributing board |
| 01/23/2008 | CN100363175C Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
| 01/22/2008 | US7321967 System and method for configuring capabilities of printed circuit boards |
| 01/22/2008 | US7321496 Flexible substrate, multilayer flexible substrate and process for producing the same |
| 01/22/2008 | US7321172 Selective plating of package terminals |
| 01/22/2008 | US7321099 Component mounting substrate and structure |
| 01/22/2008 | US7321098 Laminate ceramic circuit board and process therefor |
| 01/22/2008 | US7321097 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
| 01/22/2008 | US7320936 Plating of multi-layer structures |
| 01/22/2008 | US7320933 Double bumping of flexible substrate for first and second level interconnects |
| 01/22/2008 | US7320830 Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
| 01/22/2008 | US7320603 Flat connector |
| 01/22/2008 | US7320426 Cover for ball-grid array connector |
| 01/22/2008 | US7320174 Methods for creating ground paths for ILS |
| 01/22/2008 | US7320173 Method for interconnecting multi-layer printed circuit board |
| 01/17/2008 | WO2008008170A1 Assemblies useful for the preparation of electronic components and methods for making same |
| 01/17/2008 | WO2008007744A1 Position matching method and screen printing device |
| 01/17/2008 | WO2008006941A1 Method and apparatuses for printing and printed product |
| 01/17/2008 | WO2007102062A3 Method and process of manufacturing robust high temperature solder joints |
| 01/17/2008 | WO2007096752A3 Method of coupling photovoltaic cells and film for implementing it |
| 01/17/2008 | US20080014768 Rigid-flexible printed circuit board and method of manufacturing the same |
| 01/17/2008 | US20080014530 Graft Pattern-Forming Method, Graft Pattern Material, Lithography Method, Conductive Pattern - Forming Method, Conductive Pattern, Color Filter Producing Method, Color Filter, and Mircrolens Producing Method |
| 01/17/2008 | US20080014409 Method of making a circuitized substrate |
| 01/17/2008 | US20080014336 Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the same |
| 01/17/2008 | US20080013679 Marking apparatus used in a process for producing multi-layered printed circuit board |
| 01/17/2008 | US20080012903 Inkjet Nozzle Incorporating Serpentine Actuator |
| 01/17/2008 | US20080012593 Circuit board checker and circuit board checking method |